公开(公告)号：US20140362208A1

公开(公告)日：2014-12-11

申请号：US14284483

申请日：2014-05-22

Applicant: CAMTEK LTD.

Inventor： Shimon Koren ,  Eldad Langmans ,  Menachem Regensburger ,  Uri Weinar

IPC: G01B11/22 ,  H04N13/02

CPC classification number: H04N13/254 ,  G01B11/0608 ,  G01N21/95 ,  G01N2021/9513 ,  G01N2021/95638 ,  G01N2021/95676

Abstract: A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object.

Abstract translation: 一种三角测量系统，包括区域照相机，通信接口，第一图像处理模块，第二图像处理模块; 其中所述区域相机被布置成以获取速率获得对象的照明区域的图像流; 其中防止区域相机执行高度计算; 其中所述通信接口被布置成实时地从所述区域摄像机向所述第一图像处理模块传送与所述获取速率相对应的图像流; 其中所述第一图像处理模块被布置成实时地处理所述图像流以提供第一压缩信息; 其中所述第二图像处理模块被布置成以非实时图像处理速率处理所述第一压缩信息以提供指示所述对象的至少所述照明区域的高度的高度信息。

公开(公告)号：US20240355083A1

公开(公告)日：2024-10-24

申请号：US18644312

申请日：2024-04-24

Applicant: CAMTEK LTD

Inventor： Carmel Yehuda DRILLMAN ,  Mordi DAHAN ,  Moshe EDRI ,  Ohad SHIMON ,  Shimon KOREN ,  Gil PERLBERG

IPC: G06V10/145 ,  G01N21/95 ,  G06T7/00 ,  G06T7/13 ,  H04N23/56

CPC classification number: G06V10/145 ,  G01N21/9503 ,  G06T7/0004 ,  G06T7/13 ,  H04N23/56 ,  G06T2207/10152 ,  G06T2207/30148

Abstract: An inspection system and method are presented for edge and bevel inspection of a semiconductor structure using and an optical system defining: a tangential imaging providing back-light tangential illumination propagating along a tangential illumination path with respect to a contour outline of a contour region of an edge of the structure and substantially along a detection path of a tangential imaging sensor unit which detects at least a part of said back-light tangential illumination and generates image data indicative of a tangential image of the contour outline to enable detection of defect data of the edge, and at least dark-field imaging setup directing dark-field illumination towards the contour region along at least one dark-field illumination path and providing collection of scattering of a response of the contour region to the dark-field illumination, to enable detection of a dark-field image indicative of location of defects along said profile of the edge.

公开(公告)号：US20240289945A1

公开(公告)日：2024-08-29

申请号：US18641395

申请日：2024-04-21

Applicant: CAMTEK LTD.

Inventor： Isaac Daniel Buzaglo ,  Nir Dromi

IPC: G06T7/00 ,  G01N21/95 ,  G06T7/90 ,  H01L21/66

CPC classification number: G06T7/001 ,  G01N21/9501 ,  G06T7/90 ,  H01L22/12 ,  G06T2207/10024 ,  G06T2207/10116 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/20221 ,  G06T2207/30148

Abstract: The present disclosure provides method and system 100 for classifying defects in wafer using wafer defect images, based on deep learning network. Embodiments herein uses synergy between several modalities of the wafer defect images for the classification decision. Further, by adding a mixture of modalities, information may be obtained from different sources such as color image, ICI, the black and white image, to classify the defect image. In addition to mixture of modalities, a reference image may be used for each modality. The reference image of each modality image is provided to deep learning models to concentrate on the defect itself and not on the related underlying lithography of the defect image. Further, the reference image may be provided to the training process of the deep learning models that may significantly reduce the number of labelled images and the training epochs required for convergence of the deep learning model.

公开(公告)号：US20230280282A1

公开(公告)日：2023-09-07

申请号：US18005351

申请日：2021-07-11

Applicant: CAMTEK Ltd.

Inventor： Eyal Segev

IPC: G01N21/95 ,  G01N21/956 ,  G01B11/06

CPC classification number: G01N21/9501 ,  G01N21/956 ,  G01B11/06

Abstract: A method that may include performing first measurements of the height differences between the bumps and the corresponding areas, by illuminating the bumps and the corresponding areas with first radiation; wherein the first measurements are subjected to first measurement errors resulting from a virtual penetration of the first illumination into the layer; wherein each bump has a corresponding area that is proximate to the bump; preforming second measurements of thickness of the layer at the corresponding areas; wherein at least some of the first measurements are executed in parallel to an executing of at least some of the second measurements; determining first measurement errors, based on the second measurements; and determining the height differences between the bumps and the corresponding areas based on the first measurements and the first measurements errors.

公开(公告)号：US11055836B2

公开(公告)日：2021-07-06

申请号：US16273162

申请日：2019-02-12

Applicant: CAMTEK LTD.

Inventor： Zehava Ben Ezer

IPC: G06T7/00 ,  G01N21/88 ,  G02B27/30 ,  H04N5/232

Abstract: An inspection system and a method for inspection an object. The method may include acquiring a defocused image of an area of an object, and processing the defocused image of the area to find a phase shift between optical paths associated with certain proximate points of the area. The phase shift may be indicative of a defect. The acquiring of the defocused image may include illuminating the area with a radiation beam that may be spatially coherent and collimated when impinging on the area. The illuminating may include passing the radiation beam through an aperture that may be defined by an aperture stop that may be positioned within an aperture stop plane. The size of the aperture may be a fraction of a size of the aperture stop.

公开(公告)号：US11047807B2

公开(公告)日：2021-06-29

申请号：US16829118

申请日：2020-03-25

Applicant: CAMTEK Ltd.

Inventor： Daniel Buzaglo

IPC: G01N21/95 ,  G06T9/00 ,  G06T15/00 ,  G06N3/02

Abstract: There may be provided a method for determining three dimensional (3D) defect information, the method may include performing a two-dimensional (2D) inspection of an area of a wafer to generate 2D defect information related to defects of the area of the wafer; estimating 3D defect information regarding the defects of the area of the wafer, wherein the estimating is based on the 2D defect information related to defects of the area of the wafer, and a mapping between 2D defect information and 3D defect information, wherein the mapping is generated using a supervised deep learning machine process.

公开(公告)号：US10989670B1

公开(公告)日：2021-04-27

申请号：US16221630

申请日：2018-12-17

Applicant: CAMTEK LTD.

Inventor： Aki Shoukrun

IPC: G01N21/95 ,  G01N21/956

Abstract: A method for detecting defects in a thinned die, the method may include inspecting the thinned die with a two-dimensional inspection module, to find suspected defects that appear as non-reflecting regions that fulfill a size condition; measuring, using a depth measurement module, a depth of the suspected defects; and defining a suspected defects as a defects when the depth parameter exceeds a depth threshold.

公开(公告)号：US20160374207A1

公开(公告)日：2016-12-22

申请号：US15137011

申请日：2016-04-25

Applicant: CAMTEK LTD.

Inventor： Yehuda Ben-Abu ,  Yair Ozeri

IPC: H05K3/00

CPC classification number: H05K3/28 ,  B41J2/51 ,  B41J3/407 ,  B41J3/543 ,  H05K2203/013 ,  H05K2203/1476

Abstract: An ink jet printer that includes a group of print heads; wherein the group of print heads comprises (a) a first sub-group of print heads that exhibit a first resolution; and (b) a second sub-group of print heads that exhibits a second resolution that differs from the first resolution; wherein in response to a printing scheme that associates a first area of a printed circuit board with the first resolution and associates a second area of the printed circuit board with the second resolution, the first sub-group is configured to print solder mask ink on the first area at the first resolution and the second sub-group is configured to print solder mask ink on the second area at the second resolution.

Abstract translation: 一种喷墨打印机，包括一组打印头; 其中所述一组打印头包括（a）呈现第一分辨率的第一打印头子组; 和（b）具有不同于第一分辨率的第二分辨率的打印头的第二子组; 其中响应于将印刷电路板的第一区域与第一分辨率相关联并将印刷电路板的第二区域与第二分辨率相关联的打印方案，第一子组被配置为在 第一分辨率的第一区域和第二子组被配置为以第二分辨率在第二区域上印刷焊料掩模油墨。

公开(公告)号：US20160321792A1

公开(公告)日：2016-11-03

申请号：US15208678

申请日：2016-07-13

Applicant: CAMTEK LTD.

Inventor： Shimon Koren ,  Or Shur

IPC: G06T7/00 ,  G06T7/20 ,  G06T7/60

CPC classification number: G06T7/001 ,  G01N21/9501 ,  G01N2021/8883 ,  G05B19/41875 ,  G05B2219/31447 ,  G05B2219/35063 ,  G05B2219/37224 ,  G06T7/0004 ,  G06T7/0006 ,  G06T7/20 ,  G06T7/60 ,  G06T2207/30148 ,  Y02P90/20 ,  Y02P90/22

Abstract: A system, a non-transitory computer program product and a method for selecting an inspection recipe, the method includes: (i) obtaining an image of a structural element of the semiconductor device; (ii) calculating multiple types of distances between the image of the structural element and each of a plurality of reference images obtained by applying a plurality of inspection recipes; and (iii) automatically selecting at least one selected inspection recipe out of the plurality of inspection recipes based on values of the multiple types of distances.

Abstract translation: 一种系统，非暂时性计算机程序产品和用于选择检查配方的方法，所述方法包括：（i）获得半导体器件的结构元件的图像; （ii）计算结构元素的图像与通过应用多个检查配方获得的多个参考图像中的每一个之间的距离的多种类型; 和（iii）基于多种类型的距离的值自动地选择多个检查配方中的至少一个选择的检查配方。

公开(公告)号：US20160278216A1

公开(公告)日：2016-09-22

申请号：US15134516

申请日：2016-04-21

Applicant: CAMTEK LTD.

Inventor： Muhammad Iraqi ,  Einat Cohen ,  Eva Igner

IPC: H05K3/22 ,  C09D11/30

CPC classification number: H05K3/227 ,  B41J2/01 ,  C09D11/101 ,  C09D11/30 ,  C09D11/322 ,  H05K1/095 ,  H05K3/00 ,  H05K3/125 ,  H05K2203/0514

Abstract: A method for printing onto a printed circuit board comprising: ink jet printing a curable ink onto said printed circuit board, ultraviolet curing of the curable ink; and curing the curable ink with thermal energy; wherein the curable ink comprises a mixture of reactive monomers and oligomers; at least one pigment; at least one photo initiator; and at least one resin out of phenolic resin, amino resin and epoxy resin.

Abstract translation: 一种用于印刷到印刷电路板上的方法，包括：将可固化油墨喷墨印刷到所述印刷电路板上，对可固化油墨进行紫外线固化; 并用热能固化可固化油墨; 其中所述可固化油墨包含反应性单体和低聚物的混合物; 至少一种颜料; 至少一个光引发剂; 和酚醛树脂中的至少一种树脂，氨基树脂和环氧树脂。