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公开(公告)号：US20190128822A1
公开(公告)日：2019-05-02
申请号：US16162539
申请日：2018-10-17
Applicant: CAMTEK LTD.
Inventor： Menachem Regensburger
Abstract: There may be provided a method for evaluating an object, that may include evaluating a region of the object by a first evaluation module to provide first evaluation results that are related to multiple sites of the region; finding, using a mapping between values of first evaluation results and values of second evaluation results, (a) a first site of the multiple sites that does not require an evaluation by a second evaluation module, and (b) a second site of the multiple sites that requires an evaluation by the second evaluation module; wherein the second evaluation module is more reliable than the first evaluation module; evaluating the second site by the second evaluation module to provide second evaluation results of the second sites; estimating, based on first evaluation results of the first site and on the mapping, a state of the first site; and providing an evaluation of the region based on the state of the first site, and on the second evaluation result of the second site.
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公开(公告)号：US20140362208A1
公开(公告)日：2014-12-11
申请号：US14284483
申请日：2014-05-22
Applicant: CAMTEK LTD.
Inventor： Shimon Koren , Eldad Langmans , Menachem Regensburger , Uri Weinar
CPC classification number: H04N13/254 , G01B11/0608 , G01N21/95 , G01N2021/9513 , G01N2021/95638 , G01N2021/95676
Abstract: A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object.
Abstract translation: 一种三角测量系统，包括区域照相机，通信接口，第一图像处理模块，第二图像处理模块; 其中所述区域相机被布置成以获取速率获得对象的照明区域的图像流; 其中防止区域相机执行高度计算; 其中所述通信接口被布置成实时地从所述区域摄像机向所述第一图像处理模块传送与所述获取速率相对应的图像流; 其中所述第一图像处理模块被布置成实时地处理所述图像流以提供第一压缩信息; 其中所述第二图像处理模块被布置成以非实时图像处理速率处理所述第一压缩信息以提供指示所述对象的至少所述照明区域的高度的高度信息。
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公开(公告)号：US20220214287A1
公开(公告)日：2022-07-07
申请号：US17655914
申请日：2022-03-22
Applicant: CAMTEK Ltd.
Inventor： Menachem Regensburger , Daniel Buzaglo
Abstract: A method for automatic defect classification, the method may include acquiring, by a first camera, at least one first image of at least one area of an object; processing the at least one first image to detect a group of suspected defects within the at least one area; performing a first classification process for initially classifying the group of suspected defects; determining whether a completion of a classification of the first subgroup of the suspected defects requires additional information from a second camera; when determining that the first subgroup of the suspected defects requires additional information from the second camera then: acquiring second images, by the second camera while applying image acquisition parameters of the second camera, to provide the additional information; and performing the second classification process for classifying the first subgroup of suspected defects.
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公开(公告)号：US10598607B2
公开(公告)日：2020-03-24
申请号：US15881777
申请日：2018-01-28
Applicant: Camtek Ltd.
Inventor： Zehava Ben Ezer , Menachem Regensburger , Shimon Koren , Tomer Gilad , Shy Shapira
IPC: G01N21/95 , G01N21/55 , H01L21/66 , H01L21/67 , G01N21/956
Abstract: An inspection system for inspecting a semiconductor substrate, the inspection system may include an inspection unit that comprises a partially blocking bright field unit and a non-blocking bright field unit; wherein the partially blocking bright field unit is configured to block any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along a first axis, of an area of the wafer, (b) the specular reflection propagates along a second axis, (c) the first axis and the second axis are symmetrical about a normal to the area of the wafer, and (d) the normal is parallel to an optical axis of the partially blocking bright field unit; and wherein the non-blocking bright field unit is configured to pass to the image plane any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along the first axis, of an area of the wafer, (b) the specular reflection propagates along the second axis, (c) the first axis and the second axis are symmetrical about the normal, and (d) the normal is parallel to the optical axis of the partially blocking bright field unit.
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Patent Agency Ranking
公开(公告)号：US09756313B2
公开(公告)日：2017-09-05
申请号：US14284483
申请日：2014-05-22
Applicant: CAMTEK LTD.
Inventor： Shimon Koren , Eldad Langmans , Menachem Regensburger , Uri Weinar
IPC: G01B11/22 , G01N21/95 , H04N13/02 , G01B11/06 , G01N21/956
CPC classification number: H04N13/254 , G01B11/0608 , G01N21/95 , G01N2021/9513 , G01N2021/95638 , G01N2021/95676
Abstract: A triangulation system comprising an area camera, a communication interface, a first image processing module, a second image processing module; wherein the area camera is arranged to obtain, at an acquisition rate, a stream of images of illuminated regions of an object; wherein the area camera is prevented from performing height calculations; wherein the communication interface is arranged to convey, in real time thereby in correspondence to the acquisition rate, the stream of images from the area camera to the first image processing module; wherein the first image processing module is arranged to process, in real time, the stream of images to provide first compressed information; wherein the second image processing module is arranged to process, at a non-real time image processing rate, the first compressed information to provide height information indicative of heights of at least the illuminated regions of the object.
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公开(公告)号：US11828713B1
公开(公告)日：2023-11-28
申请号：US18080006
申请日：2022-12-13
Applicant: CAMTEK LTD
Inventor： Carmel Yehuda Drillman , Moshe Edri , Menachem Regensburger , Baheej Bathish , Mordi Dahan
CPC classification number: G01N21/9503 , G01N21/8806 , G01N2021/8825 , G01N2021/8841 , H01L22/12
Abstract: A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.
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公开(公告)号：US11300521B2
公开(公告)日：2022-04-12
申请号：US16619941
申请日：2018-06-14
Applicant: Camtek Ltd.
Inventor： Menachem Regensburger , Daniel Buzaglo
Abstract: A method for automatic defect classification, the method may include (i) acquiring, by a first camera, at least one first image of at least one area of an object; (ii) processing the at least one first image to detect a group of suspected defects within the at least one area; (iii) performing a first classification process for initially classifying the group of suspected defects; (iii) determining whether a first subgroup of the suspected defects requires additional information from a second camera for a completion of a classification; (iv) when determining that the first subgroup of the suspected defects requires additional information from the second camera then: (a) acquiring second images, by the second camera, of the first subgroup of the suspected defects; and (b) performing a second classification process for classifying the first subgroup of suspected defects.
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公开(公告)号：US10732128B2
公开(公告)日：2020-08-04
申请号：US16162539
申请日：2018-10-17
Applicant: CAMTEK LTD.
Inventor： Menachem Regensburger
Abstract: There may be provided a method for evaluating an object, that may include evaluating a region of the object by a first evaluation module to provide first evaluation results that are related to multiple sites of the region; finding, using a mapping between values of first evaluation results and values of second evaluation results, (a) a first site of the multiple sites that does not require an evaluation by a second evaluation module, and (b) a second site of the multiple sites that requires an evaluation by the second evaluation module; wherein the second evaluation module is more reliable than the first evaluation module; evaluating the second site by the second evaluation module to provide second evaluation results of the second sites; estimating, based on first evaluation results of the first site and on the mapping, a state of the first site; and providing an evaluation of the region based on the state of the first site, and on the second evaluation result of the second site.
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公开(公告)号：US20190033234A1
公开(公告)日：2019-01-31
申请号：US15881777
申请日：2018-01-28
Applicant: Camtek Ltd.
Inventor： Zehava Ben Ezer , Menachem Regensburger , Shimon Koren , Tomer Gilad , Shy Shapira
Abstract: An inspection system for inspecting a semiconductor substrate, the inspection system may include an inspection unit that comprises a partially blocking bright field unit and a non-blocking bright field unit; wherein the partially blocking bright field unit is configured to block any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along a first axis, of an area of the wafer, (b) the specular reflection propagates along a second axis, (c) the first axis and the second axis are symmetrical about a normal to the area of the wafer, and (d) the normal is parallel to an optical axis of the partially blocking bright field unit; and wherein the non-blocking bright field unit is configured to pass to the image plane any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along the first axis, of an area of the wafer, (b) the specular reflection propagates along the second axis, (c) the first axis and the second axis are symmetrical about the normal, and (d) the normal is parallel to the optical axis of the partially blocking bright field unit.
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