公开(公告)号：US08707974B2

公开(公告)日：2014-04-29

申请号：US12635710

申请日：2009-12-11

Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Ming-Hsin Lee ,  Wei-Hong Chuang ,  Kuei-Chang Tung ,  Yan-Yi Lu ,  Chin-Chin Wang

Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Ming-Hsin Lee ,  Wei-Hong Chuang ,  Kuei-Chang Tung ,  Yan-Yi Lu ,  Chin-Chin Wang

IPC: B08B3/02

CPC classification number: B08B3/04 ,  B08B3/02 ,  H01L21/67051 ,  H01L21/6708

Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.

Abstract translation: 一种晶片清洗装置，包括用于保持具有待清洗表面的晶片的晶片台，位于晶片上方的第一喷嘴，位于晶片上方的第二喷嘴。 第一高度在第一喷嘴和表面之间，第二高度在第二喷嘴和表面之间，其中第一高度比第二高度短。

公开(公告)号：US08314469B2

公开(公告)日：2012-11-20

申请号：US12553987

申请日：2009-09-04

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L31/0232

CPC classification number: H01L27/14629 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627

Abstract: An image sensor structure and a method for making the image sensor structure, for avoiding or mitigating lens shading effect. The image sensor structure includes a substrate, a sensor array disposed at the surface of the substrate, a dielectric layer covering the sensor array, wherein the dielectric layer includes a top surface having a dishing structure, an under layer filled into the dishing structure and having a refraction index greater than that of the dielectric layer, a filter array disposed on the under layer corresponding to the sensor array, and a microlens array disposed above the filter array. A top layer may be additionally disposed to cover the filter array and the microlens array is disposed on the top layer.

Abstract translation: 图像传感器结构和图像传感器结构的制造方法，用于避免或减轻镜片遮蔽效应。 图像传感器结构包括基板，设置在基板表面的传感器阵列，覆盖传感器阵列的电介质层，其中电介质层包括具有凹陷结构的顶表面，填充到凹陷结构中的下层，并具有 折射率大于介电层的折射率，设置在与传感器阵列对应的下层上的滤光片阵列，以及设置在滤光片阵列上方的微透镜阵列。 可以另外设置顶层以覆盖过滤器阵列，并且微透镜阵列设置在顶层上。

公开(公告)号：US08294041B2

公开(公告)日：2012-10-23

申请号：US12170082

申请日：2008-07-09

Applicant: Cheng-Po Yu ,  Cheng-Hung Yu

Inventor： Cheng-Po Yu ,  Cheng-Hung Yu

IPC: H05K1/11

CPC classification number: H05K1/0231 ,  H05K1/0219 ,  H05K1/162 ,  H05K3/107 ,  H05K2201/09036 ,  H05K2201/09809 ,  Y10T29/49117

Abstract: A circuit board including a first dielectric layer having a first surface and a second surface, a first circuit layer, a second dielectric layer, and a second circuit layer is provided. At least one trench is formed on the first surface, and the first circuit layer is formed on an inside wall of the trench. In addition, the second dielectric layer is disposed in the trench, and covers the first circuit layer. The second circuit layer is disposed in the trench, and the second dielectric layer is located between the first circuit layer and the second circuit layer. A manufacturing method of the circuit board is further provided.

Abstract translation: 提供一种电路板，包括具有第一表面和第二表面的第一介电层，第一电路层，第二电介质层和第二电路层。 在第一表面上形成至少一个沟槽，并且第一电路层形成在沟槽的内壁上。 此外，第二电介质层设置在沟槽中并覆盖第一电路层。 第二电路层设置在沟槽中，第二电介质层位于第一电路层和第二电路层之间。 还提供了电路板的制造方法。

公开(公告)号：US20110057277A1

公开(公告)日：2011-03-10

申请号：US12553987

申请日：2009-09-04

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L31/0232 ,  H01L31/18 ,  H01L31/0216

CPC classification number: H01L27/14629 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627

Abstract: An image sensor structure and a method for making the image sensor structure, for avoiding or mitigating lens shading effect. The image sensor structure includes a substrate, a sensor array disposed at the surface of the substrate, a dielectric layer covering the sensor array, wherein the dielectric layer includes a top surface having a dishing structure, an under layer filled into the dishing structure and having a refraction index greater than that of the dielectric layer, a filter array disposed on the under layer corresponding to the sensor array, and a microlens array disposed above the filter array. A top layer may be additionally disposed to cover the filter array and the microlens array is disposed on the top layer.

Abstract translation: 图像传感器结构和图像传感器结构的制造方法，用于避免或减轻镜片遮蔽效应。 图像传感器结构包括基板，设置在基板表面的传感器阵列，覆盖传感器阵列的电介质层，其中电介质层包括具有凹陷结构的顶表面，填充到凹陷结构中的下层，并具有 折射率大于介电层的折射率，设置在与传感器阵列对应的下层上的滤光片阵列，以及设置在滤光片阵列上方的微透镜阵列。 可以另外设置顶层以覆盖过滤器阵列，并且微透镜阵列设置在顶层上。

公开(公告)号：US20090321862A1

公开(公告)日：2009-12-31

申请号：US12147940

申请日：2008-06-27

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L31/0232 ,  H01L31/18

CPC classification number: H01L27/14621 ,  H01L27/14627 ,  H01L27/14632

Abstract: A method for fabricating an image sensor, which includes the following steps, is provided. A semiconductor substrate including a sensor array, a pad and a passivation layer is provided, and the passivation layer covers the sensor array and the pad. An opening, which comprises tapered sidewalls not perpendicular to a bared surface of the pad, is formed in the semiconductor substrate to expose the pad. An under layer is formed on the semiconductor substrate, and covers the pad and the passivation layer. A color filter array is formed on the under layer and over the corresponding sensor array. A planar layer is formed on the color filter array. A portion of the under layer is removed to expose the pad. A plurality of U-lenses is formed on the planar layer.

Abstract translation: 提供了一种制造图像传感器的方法，其包括以下步骤。 提供了包括传感器阵列，焊盘和钝化层的半导体衬底，并且钝化层覆盖传感器阵列和衬垫。 在半导体衬底中形成包括不垂直于衬垫的裸露表面的锥形侧壁的开口以露出衬垫。 在半导体衬底上形成底层，覆盖衬垫和钝化层。 在下层和相应的传感器阵列上形成滤色器阵列。 平面层形成在滤色器阵列上。 下层的一部分被去除以暴露垫。 在平面层上形成多个U型透镜。

公开(公告)号：US20070246639A1

公开(公告)日：2007-10-25

申请号：US11379229

申请日：2006-04-19

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L27/00

CPC classification number: H01L27/14627

Abstract: A wafer for manufacturing image sensors is disclosed. The wafer includes an image sensor and a test key. The image sensor includes a plurality of micro-lenses; the test key includes a plurality of micro-lens samples for defects inspection. The arrangement of the micro-lens samples on the test key is substantially different from the arrangement of the micro-lenses on the image sensor. The arrangement of the micro-lens samples on the test key allows defects inspection to become less complicated.

Abstract translation: 公开了一种用于制造图像传感器的晶片。 晶片包括图像传感器和测试键。 图像传感器包括多个微透镜; 测试键包括用于缺陷检查的多个微透镜样本。 微透镜样品在测试键上的布置与图像传感器上的微透镜的布置显着不同。 微透镜样品在测试键上的布置使得缺陷检查变得不那么复杂。

公开(公告)号：US08137901B2

公开(公告)日：2012-03-20

申请号：US12128600

申请日：2008-05-28

Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu

Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu

IPC: G03F7/20

CPC classification number: H01L27/14685 ,  G03F7/2022 ,  H01L27/14627 ,  H01L27/14643

Abstract: A method for fabricating an image sensor is disclosed. First, a semiconductor substrate is provided, in which a photosensitive region is defined on the semiconductor substrate. At least one photosensitive material is then formed on the semiconductor substrate, and a first exposure process is performed to form a tapered pattern in the photosensitive material. A second exposure process is performed to form a straight foot pattern in the photosensitive material, and a developing process is performed to remove the tapered pattern and straight foot pattern to form the photosensitive material into a plurality of photosensitive blocks. A reflow process is conducted thereafter to form the photosensitive blocks into a plurality of microlenses.

Abstract translation: 公开了一种用于制造图像传感器的方法。 首先，提供半导体衬底，其中光敏区被限定在半导体衬底上。 然后在半导体衬底上形成至少一种感光材料，并进行第一曝光处理以在感光材料中形成锥形图案。 执行第二曝光处理以在感光材料中形成直脚图案，并且进行显影处理以去除锥形图案和直脚图案以将感光材料形成为多个感光块。 此后进行回流处理以将感光块形成多个微透镜。

公开(公告)号：US20110139188A1

公开(公告)日：2011-06-16

申请号：US12635710

申请日：2009-12-11

Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Ming-Hsin Lee ,  Wei-Hong Chuang ,  Kuei-Chang Tung ,  Yan-Yi Lu ,  Chin-Chin Wang

Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Ming-Hsin Lee ,  Wei-Hong Chuang ,  Kuei-Chang Tung ,  Yan-Yi Lu ,  Chin-Chin Wang

IPC: B08B3/00

CPC classification number: B08B3/04 ,  B08B3/02 ,  H01L21/67051 ,  H01L21/6708

Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.

Abstract translation: 一种晶片清洗装置，包括用于保持具有待清洗表面的晶片的晶片台，位于晶片上方的第一喷嘴，位于晶片上方的第二喷嘴。 第一高度在第一喷嘴和表面之间，第二高度在第二喷嘴和表面之间，其中第一高度比第二高度短。

公开(公告)号：US20090250247A1

公开(公告)日：2009-10-08

申请号：US12170082

申请日：2008-07-09

Applicant: Cheng-Po Yu ,  Cheng-Hung Yu

Inventor： Cheng-Po Yu ,  Cheng-Hung Yu

IPC: H05K1/02 ,  H01R43/00

CPC classification number: H05K1/0231 ,  H05K1/0219 ,  H05K1/162 ,  H05K3/107 ,  H05K2201/09036 ,  H05K2201/09809 ,  Y10T29/49117

Abstract: A circuit board including a first dielectric layer having a first surface and a second surface, a first circuit layer, a second dielectric layer, and a second circuit layer is provided. At least one trench is formed on the first surface, and the first circuit layer is formed on an inside wall of the trench. In addition, the second dielectric layer is disposed in the trench, and covers the first circuit layer. The second circuit layer is disposed in the trench, and the second dielectric layer is located between the first circuit layer and the second circuit layer. A manufacturing method of the circuit board is further provided.

Abstract translation: 提供一种电路板，包括具有第一表面和第二表面的第一介电层，第一电路层，第二电介质层和第二电路层。 在第一表面上形成至少一个沟槽，并且第一电路层形成在沟槽的内壁上。 此外，第二电介质层设置在沟槽中并覆盖第一电路层。 第二电路层设置在沟槽中，第二电介质层位于第一电路层和第二电路层之间。 还提供了电路板的制造方法。

公开(公告)号：US07473522B2

公开(公告)日：2009-01-06

申请号：US11754364

申请日：2007-05-28

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: G02B3/00

CPC classification number: G03F7/0005 ,  B29D11/00365 ,  G02B3/0012 ,  G02B3/0043 ,  G02B3/0056 ,  G02B3/0068 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685

Abstract: A method for manufacturing micro-lenses of image sensors includes providing a semiconductor substrate having at least a planarization layer, performing a first photolithography process to form a first set of micro-lens blocks on the planarization layer, performing a first baking process to form a first set of micro-lenses, performing a first surface treatment to harden surfaces of the first set of micro-lenses, performing a second photolithography to form a second set of micro-lens blocks on the planarization layer, and performing a second baking process to form a second set of micro-lenses.

Abstract translation: 一种用于制造图像传感器的微透镜的方法包括提供至少具有平坦化层的半导体衬底，执行第一光刻处理以在平坦化层上形成第一组微透镜块，执行第一烘焙处理以形成 第一组微透镜，执行第一表面处理以硬化第一组微透镜的表面，执行第二光刻以在平坦化层上形成第二组微透镜块，并且执行第二烘焙处理 形成第二组微透镜。