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    Curable resin composition and short-cure method
    23.
    发明授权
    Curable resin composition and short-cure method 有权
    可固化树脂组合物和短固化方法

    公开(公告)号：US09039951B2

    公开(公告)日：2015-05-26

    申请号：US13776754

    申请日：2013-02-26

    Applicant: Cytec Technology Corp.

    Inventor： Jonathan E. Meegan

    IPC: B29C45/02 ,  B29C45/14 ,  C08G65/22 ,  D06M17/04 ,  C08G85/00 ,  C08G59/50 ,  C08G59/56 ,  C08G59/38 ,  C08L63/00 ,  B32B27/04 ,  B32B27/26 ,  B32B27/38

    CPC classification number: C08K7/06 ,  B29C70/48 ,  B29K2063/00 ,  B29K2105/0809 ,  C08G59/00 ,  C08G59/38 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/504 ,  C08G59/56 ,  C08G65/22 ,  C08G85/00 ,  C08J3/243 ,  C08J3/244 ,  C08J2363/00 ,  C08L63/00 ,  D06M17/04 ,  Y10T428/24994 ,  Y10T428/31511

    Abstract: Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.

    Abstract translation: 本文公开了一种利用由低温固化反应产生的放热能进行高温固化反应的方法，否则在所选择的工具温度下能够达到高能量固化反应，从而产生固化的树脂基质，其特性与所生产的 通过高温固化反应，但通过短的固化时间和低固化温度实现。 还公开了一种短固化树脂组合物，其包含：（a）至少一种环氧官能度大于1的多官能环氧树脂; （b）一种硬化剂组合物，其包含（i）至少一种每分子具有一个或多个氨基的脂族或脂环族胺固化剂; （ii）每分子具有一个或多个氨基的至少一种芳族胺固化剂; 和（iii）咪唑作为固化促进剂。 该树脂组合物的改进的性质包括在<120℃的温度下可固化的时间小于10分钟，以达到比由相同组成衍生的固化程度更高的刚性（i）脂族/ 脂环族胺或（ii）芳族胺。

    STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF
    24.
    发明申请
    STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF 有权
    结构粘合和粘结应用

    公开(公告)号：US20150030844A1

    公开(公告)日：2015-01-29

    申请号：US14512642

    申请日：2014-10-13

    Applicant: CYTEC TECHNOLOGY CORP.

    Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli ,  Kunal Gaurang Shah

    IPC: C09J163/00 ,  B32B27/38 ,  B32B27/18 ,  B32B7/12

    CPC classification number: C09J163/00 ,  B32B7/12 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2264/0207 ,  B32B2270/00 ,  B32B2405/00 ,  C08G59/4253 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/5073 ,  C08K3/36 ,  C08L63/00 ,  C08L81/06 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/254 ,  Y10T428/31515 ,  Y10T428/31522 ,  C08L51/04 ,  C08L101/00

    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler as a rheology/thixotropy modifying component. The weight ratio of part (A) to part (B) is within the range of 3:2 to 10:2. In another embodiment, the structural adhesive composition is based on a one-part system which includes the components of the resinous part (A) in the two-part system mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine. The one-part system is curable within the temperature range of 140-300° F. (60-150° C.). The paste adhesive disclosed herein has film-like properties and is particularly useful in rapid-assembly aerospace structure bonding applications.

    Abstract translation: 适用于金属和航空航天结构材料的高强度粘合的结构粘合剂组合物。 在一个实施方案中，基于两部分系统的结构粘合剂组合物，其可在等于或低于200°F（93℃）下固化。 两部分系统由树脂部分（A）和催化剂部分（B）组成，可以在室温下分开储存，直到准备使用。 树脂部分（A）包括至少两种具有不同官能度的功能性多官能环氧树脂，其中二官能，三官能和四官能环氧树脂，某些增韧组分和无机填料颗粒作为流变学/触变性改良组分。 增韧组分包括具有不同粒度的核 - 壳橡胶颗粒和弹性体聚合物和聚醚砜聚合物中的至少一种。 催化剂部分（B）包括作为固化剂的脂族或环状胺化合物和作为流变/触变性改性成分的无机填料。 部分（A）与部分（B）的重量比在3:2至10:2的范围内。 在另一个实施方案中，结构粘合剂组合物基于一部分系统，其包括与潜伏胺固化剂混合的两部分体系中的树脂部分（A）的组分。 单组分体系可以进一步包括咪唑和/或脂族胺。 单组分体系可在140-300°F（60-150°C）的温度范围内固化。 本文公开的糊状粘合剂具有膜状特性，并且在快速组装航空航天结构粘合应用中特别有用。

    COMPOSITE MATERIALS COMPRISING CONDUCTIVE NANO-FILLERS
    26.
    发明申请
    COMPOSITE MATERIALS COMPRISING CONDUCTIVE NANO-FILLERS 有权
    包含导电纳米填料的复合材料

    公开(公告)号：US20140306164A1

    公开(公告)日：2014-10-16

    申请号：US14356653

    申请日：2012-12-19

    Applicant: Cytec Technology Corp.

    Inventor： Carmelo Luca Restuccia ,  Fiorenzo Lenzi ,  Emiliano Frulloni ,  Natalie Denise Jordan ,  Mark Edward Harriman

    IPC: H01B1/22

    CPC classification number: H01B1/22 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/04 ,  C08K3/041 ,  C08K7/24 ,  C08L63/00 ,  H01Q17/00 ,  H05K9/0079 ,  Y10S977/753 ,  Y10S977/847 ,  Y10S977/932

    Abstract: A process for the production of a composition comprising one or more conductive nano-filler(s), one or more polyarylethersulphone thermoplastic polymer(s) (A), one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor, wherein said process comprises mixing or dispersing a first composition comprising one or more conductive nano-filler(s) and one or more polyarylethersulphone thermoplastic polymer(s) (A) with or into one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor.

    Abstract translation: 一种制备包含一种或多种导电纳米填料，一种或多种聚芳醚砜热塑性聚合物（A），一种或多种未固化的热固性树脂前体（P）和任选的一种或多种 或更多的固化剂，其中所述方法包括将包含一种或多种导电纳米填料和一种或多种聚芳醚砜热塑性聚合物（A）的第一组合物混合或分散在一种或多种未固化的 热固性树脂前体（P）和任选的一种或多种固化剂。

    COMPATIBLE CARRIER FOR SECONDARY TOUGHENING
    27.
    发明申请
    COMPATIBLE CARRIER FOR SECONDARY TOUGHENING 审中-公开
    兼容载体用于二次加固

    公开(公告)号：US20130269855A1

    公开(公告)日：2013-10-17

    申请号：US13873274

    申请日：2013-06-24

    Applicant: CYTEC TECHNOLOGY CORP.

    Inventor： Alexandre A. Baidak ,  Patrick Terence McGrail ,  Dominique Ponsolle ,  Robert Blackburn

    IPC: D04H3/005 ,  B29C45/14

    CPC classification number: D04H3/005 ,  B29C45/14508 ,  B29C70/02 ,  B29C70/44 ,  C08J5/24 ,  Y10T442/60 ,  Y10T442/659 ,  Y10T442/673

    Abstract: A process for manufacturing a composite article, which include combining a nonwoven mat of extruded fibers with one or more layers of fabrics to form a preform, and injecting the preform with a liquid thermosetting resin. The extruded fibers are formed by combining and extruding a thermoplastic carrier material with a toughening material within a predetermined temperature range. The carrier material is immiscible with the toughening material, and the toughening material is encapsulated within the carrier material. The carrier material is at least partially soluble in the thermosetting resin within a predetermined temperature range, and the toughening material is insoluble in the thermosetting resin during a cure cycle. A preform having at least one nonwoven mat of extruded fibers is also disclosed.

    Abstract translation: 一种制造复合制品的方法，其包括将挤出纤维的非织造垫与一层或多层织物组合以形成预成型体，以及用液态热固性树脂注射预型体。 挤出纤维通过在预定温度范围内组合并挤出热塑性载体材料与增韧材料而形成。 载体材料与增韧材料不混溶，并且增韧材料被包封在载体材料内。 载体材料在预定温度范围内至少部分地可溶于热固性树脂，并且增韧材料在固化循环期间不溶于热固性树脂。 还公开了一种具有至少一个挤出纤维非织造垫的预成型件。

    STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF
    28.
    发明申请
    STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF 有权
    结构粘合和粘结应用

    公开(公告)号：US20130115442A1

    公开(公告)日：2013-05-09

    申请号：US13652724

    申请日：2012-10-16

    Applicant: Cytec Technology Corp

    Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli ,  Kunal Gaurang Shah

    IPC: C09J163/00 ,  C08K3/36 ,  B32B7/12 ,  B82Y30/00

    CPC classification number: C09J163/00 ,  B32B7/12 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2264/0207 ,  B32B2270/00 ,  B32B2405/00 ,  C08G59/4253 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/5073 ,  C08K3/36 ,  C08L63/00 ,  C08L81/06 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/254 ,  Y10T428/31515 ,  Y10T428/31522 ,  C08L51/04 ,  C08L101/00

    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.

    Abstract translation: 适用于金属和航空航天结构材料的高强度粘合的结构粘合剂组合物。 在一个实施方案中，基于两部分系统的结构粘合剂组合物，其可在等于或低于200°F（93℃）下固化。 两部分系统由树脂部分（A）和催化剂部分（B）组成，可以在室温下分开储存，直到准备使用。 树脂部分（A）包括至少两种不同的多官能环氧树脂，增韧组分和无机填料颗粒。 催化剂部分（B）包括脂族或环状胺化合物作为固化剂和无机填料。 在另一个实施方案中，结构粘合剂组合物基于一部分系统，其包括与潜胺胺固化剂混合的树脂部分（A）的组分。 单组分体系可以进一步包括咪唑和/或脂族胺。

    CO-CURABLE, CONDUCTIVE SURFACING FILMS FOR LIGHTNING STRIKE AND ELECTROMAGNETIC INTERFERENCE SHIELDING OF THERMOSET COMPOSITE MATERIALS
    29.
    发明申请
    CO-CURABLE, CONDUCTIVE SURFACING FILMS FOR LIGHTNING STRIKE AND ELECTROMAGNETIC INTERFERENCE SHIELDING OF THERMOSET COMPOSITE MATERIALS 有权
    热固性复合材料的耐光冲击和电磁干扰屏蔽的可固化，导电表面膜

    公开(公告)号：US20130101833A1

    公开(公告)日：2013-04-25

    申请号：US13714506

    申请日：2012-12-14

    Applicant: CYTEC TECHNOLOGY CORP.

    Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli

    IPC: C09D5/24

    CPC classification number: C09D5/24 ,  B82Y30/00 ,  C08K3/10 ,  C09D163/00 ,  H01B1/22 ,  H01B1/24 ,  Y10S977/742 ,  Y10S977/762 ,  Y10T156/10 ,  Y10T428/249921 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/268 ,  Y10T428/27 ,  Y10T428/273 ,  C08L2666/54

    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 mΩ/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.

    Abstract translation: 本公开的实施方案提供用于表面化膜和粘合剂的导电性，热固性组合物。 表面膜具有与金属相当的增强的电导率，而不使用嵌入的金属屏幕或箔。 作为最外表面层，这样的表面化膜可以并入到复合结构（例如，预浸料，胶带和织物）中，例如通过共固化。 特别地，发现使用银薄片作为导电填料形成的组合物表现出非常高的导电性。 例如，包含大于45wt。 ％银薄片表现出小于约55mOmega / sq的电阻率。 以这种方式，当用作诸如飞行器部件的应用中时，作为最外面导电层的表面膜可以提供照明保护（LSP）和电磁干扰（EMI）屏蔽。

    POLYMERIC HOLLOW ARTICLES CONTAINING CHROMAN-BASED COMPOUNDS AND MADE BY ROTATIONAL MOLDING
    30.
    发明申请
    POLYMERIC HOLLOW ARTICLES CONTAINING CHROMAN-BASED COMPOUNDS AND MADE BY ROTATIONAL MOLDING 有权

    公开(公告)号：US20220212375A1

    公开(公告)日：2022-07-07

    申请号：US17697232

    申请日：2022-03-17

    Applicant: CYTEC TECHNOLOGY CORP.

    Inventor： Ram GUPTA ,  Sari-Beth SAMUELS ,  Thomas STEELE ,  J. Mon Hei ENG

    IPC: B29C41/04 ,  C08K5/00 ,  C08K5/34 ,  C08K5/1545 ,  C08L23/08 ,  C08K5/51 ,  C07D311/72

    Abstract: A stabilizer composition for producing a polymeric hollow article in a rotomolding process has stabilizing amounts of: (i) at least one chroman-based compound according to Formula (V): wherein at least one instance of R21 is OR27, R27 is COR′″ or Si(R28)3, and R′″, R22, R23 R24, R25 and R26 are as defined herein; (ii) at least one phosphite or phosphonite; and (iii) a basic co-additive selected from alkali metal or alkaline metal salts of higher fatty acids. A polymeric hollow article is made by a process comprising: a) filling a mold with a polyolefin and a stabilizing amount of the stabilizer composition described herewith; b) rotating the mold around at least one axis while heating the mold in an oven, thereby fusing the composition and spreading it to the walls of the mold; c) cooling the mold; and d) opening the mold to remove the resulting polymeric hollow article.

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