公开(公告)号：US20190124764A1

公开(公告)日：2019-04-25

申请号：US16135492

申请日：2018-09-19

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang LI

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/40

Abstract: An electronic device and manufacturing method thereof are disclosed. The manufacturing method of the electronic device comprises following steps: forming at least a thin-film conductive line on the substrate by a thin-film process; forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line; and disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad. The electronic device has a lower manufacturing cost and a higher component configuration density, and the production yield and reliability of the electronic device are improved by the configuration of the electrical connection pad.

公开(公告)号：US20130343054A1

公开(公告)日：2013-12-26

申请号：US13924524

申请日：2013-06-21

Applicant: GIO Optoelectronics Corp.

Inventor： CHIA-HO YANG

IPC: F21V23/00

CPC classification number: F21V23/00 ,  G09F9/33 ,  H05K1/028 ,  H05K1/142 ,  H05K3/303 ,  H05K2201/10106 ,  H05K2201/10303

Abstract: A light emitting apparatus includes at least a light emitting module, and the light emitting module comprises a supporting element, a flexible circuit board and at least a light emitting element. The supporting element has a first surface and a second surface which are opposite to each other. The flexible circuit board includes a first light emitting portion and at least an electrical connection portion. The light emitting portion is disposed on the first surface of the supporting element, and the electrical connection portion is bent to the side of the second surface of the supporting element. The light emitting element is disposed at the light emitting portion.

Abstract translation: 发光装置至少包括发光模块，并且发光模块包括支撑元件，柔性电路板和至少发光元件。 支撑元件具有彼此相对的第一表面和第二表面。 柔性电路板包括第一发光部分和至少电连接部分。 发光部设置在支撑元件的第一表面上，并且电连接部弯曲到支撑元件的第二表面侧。 发光元件设置在发光部分。

公开(公告)号：US11075330B2

公开(公告)日：2021-07-27

申请号：US16806296

申请日：2020-03-02

Applicant: GIO Optoelectronics Corp.

Inventor： Chin-Tang Li

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/60 ,  H01L33/54 ,  H01L23/14 ,  H01L23/498

Abstract: A package structure and an electronic device including the package structure are disclosed. The package structure includes a substrate, a wire layer disposed on the substrate, a visual unit disposed on the substrate, and an encapsulation element disposed on the substrate. The wire layer includes a plurality of patterned circuits. The visual unit includes a first area and a second area defined along a periphery of the first area. The first area is configured with a photoelectric element, and the photoelectric element is electrically connected to and disposed corresponding to at least one of the patterned circuits. The encapsulation element completely covers the first area of the visual unit and overlaps the corresponding patterned circuit, such that an average reflectance inside the encapsulation element is greater than an average reflectance outside the encapsulation element.

公开(公告)号：US20200287112A1

公开(公告)日：2020-09-10

申请号：US16806296

申请日：2020-03-02

Applicant: GIO Optoelectronics Corp.

Inventor： Chin-Tang LI

IPC: H01L33/62 ,  H01L33/52 ,  H01L23/498 ,  H01L33/60

Abstract: A package structure and an electronic device including the package structure are disclosed. The package structure includes a substrate, a wire layer disposed on the substrate, a visual unit disposed on the substrate, and an encapsulation element disposed on the substrate. The wire layer includes a plurality of patterned circuits. The visual unit includes a first area and a second area defined along a periphery of the first area. The first area is configured with a photoelectric element, and the photoelectric element is electrically connected to and disposed corresponding to at least one of the patterned circuits. The encapsulation element completely covers the first area of the visual unit and overlaps the corresponding patterned circuit, such that an average reflectance inside the encapsulation element is greater than an average reflectance outside the encapsulation element.

公开(公告)号：US10573597B1

公开(公告)日：2020-02-25

申请号：US16545393

申请日：2019-08-20

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang Li

IPC: H01L23/538 ,  H01L27/12 ,  H01L25/00 ,  H01L23/498 ,  H01L25/18

Abstract: An electronic device and manufacturing method thereof are disclosed. The manufacturing method includes steps of: providing a component board, wherein the component board comprises a substrate and a first conductive wire; providing a connecting board, wherein the connecting board comprises a second conductive wire; disposing an attaching member on the connecting board or a lateral face of the substrate; aligning the second conductive wire of the connecting board toward the lateral face, and attaching the connecting board to the lateral face by the attaching member, wherein the lateral face, the attaching member and the connecting board form a recess; and disposing a conductive member in the recess, wherein the conductive member contacts the first conductive wire and the second conductive wire, and the first conductive wire is electrically connected with the second conductive wire through the conductive member.

公开(公告)号：US20190086705A1

公开(公告)日：2019-03-21

申请号：US16184040

申请日：2018-11-08

Applicant: GIO OPTOELECTRONICS CORP. ,  BARCO N.V. ,  BARCO CONTROL ROOMS GMBH

Inventor： Yuan-Liang WU ,  Peter GERETS ,  Sven SCHULE

IPC: G02F1/1333 ,  G02F1/1345 ,  G02F1/1362 ,  G02F1/1335 ,  G02F1/1343 ,  G06F3/041 ,  G02F1/1368

CPC classification number: G02F1/13338 ,  G02F1/133308 ,  G02F1/133514 ,  G02F1/134336 ,  G02F1/13439 ,  G02F1/13452 ,  G02F1/13454 ,  G02F1/13458 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2201/42 ,  G06F3/0412

Abstract: A matrix circuit substrate, having a substrate body, having a first surface and a second surface which are opposite each other, and at least one sidewall located between the first surface and the second surface, the sidewall having at least one recess; multiple electrodes, disposed in a crisscross arrangement on the first surface; and at least one first conductive material, disposed in the recess to correspond to at least one of the electrodes, and electrically connected to the electrode. Additionally, a display apparatus having such substrate, and to a method for manufacturing such substrate.

公开(公告)号：US20160224141A1

公开(公告)日：2016-08-04

申请号：US15010761

申请日：2016-01-29

Applicant: GIO Optoelectronics Corp.

Inventor： Yuan-Liang WU

IPC: G06F3/041 ,  H05K3/14 ,  H05K3/16

CPC classification number: H05K3/143 ,  G06F3/044 ,  G06F2203/04103 ,  H05K3/16 ,  H05K2201/09745 ,  H05K2203/0557

Abstract: An electronic device with an active area is disclosed. The electronic device includes a substrate and a first pattern circuit layer. The first pattern circuit layer is disposed at one side of the substrate. The first pattern circuit layer has at least one metal net structure. In the active area, the metal net structure has a first thickness and a second thickness. The second thickness is thinner than the first thickness. An electronic manufacturing method is also disclosed. The electronic device made by the manufacturing method can simplify the manufacturing processes.

Abstract translation: 公开了一种具有有源区域的电子设备。 电子器件包括衬底和第一图案电路层。 第一图案电路层设置在基板的一侧。 第一图案电路层具有至少一个金属网结构。 在有源区域中，金属网结构具有第一厚度和第二厚度。 第二厚度比第一厚度薄。 还公开了一种电子制造方法。 通过制造方法制造的电子装置可以简化制造工艺。

公开(公告)号：US20140375907A1

公开(公告)日：2014-12-25

申请号：US14309878

申请日：2014-06-19

Applicant: GIO Optoelectronics Corp.

Inventor： YUAN-LIANG WU

IPC: G06F3/044

CPC classification number: G06F3/0412 ,  G02F1/13338 ,  G06F2203/04111

Abstract: A touch display panel includes a first substrate, a second substrate, a touch electrode unit and at least one conducting unit. The second substrate is disposed opposite to the first substrate. The second substrate has a conductive pattern layer. The touch electrode unit is disposed on one side of the first substrate which is away from the second substrate. One end of the conducting unit is connected to the touch electrode unit, and the other end of the conducting unit is connected to the conductive pattern layer of the second substrate.

Abstract translation: 触摸显示面板包括第一基板，第二基板，触摸电极单元和至少一个导电单元。 第二基板与第一基板相对设置。 第二基板具有导电图案层。 触摸电极单元设置在远离第二基板的第一基板的一侧。 导电单元的一端连接到触摸电极单元，并且导电单元的另一端连接到第二基板的导电图案层。

公开(公告)号：US20220013513A1

公开(公告)日：2022-01-13

申请号：US17366710

申请日：2021-07-02

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang LI

IPC: H01L25/16 ,  H01L27/12 ,  H01L23/538

Abstract: An electronic device includes a circuit board, a plurality of carrier boards, a plurality of photoelectric elements, and a plurality of driving elements. The circuit board has a first conductive layer. The carrier boards are arranged on the circuit board with a component distance in a direction. Each carrier board has a substrate and a second conductive layer. The second conductive layer is disposed on the substrate and electrically connected to the first conductive layer of the circuit board. The substrate defines a substrate area, and each photoelectric element defines an element area. The ratio of the substrate area to the element area is not less than 5. The driving elements are disposed on the circuit board or the carrier boards. The driving elements are electrically connected to the first conductive layer and the second conductive layers, and drive the photoelectric elements.

公开(公告)号：US20210265546A1

公开(公告)日：2021-08-26

申请号：US17262605

申请日：2020-05-20

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang LI

IPC: H01L33/62 ,  H01L25/075

Abstract: An electronic device and a manufacturing method thereof are provided. The pattern circuit of each surface mount structure of the electronic device is disposed on the substrate; at least two through holes are respectively corresponding to at least two signal lines of the pattern circuit; and the two ends of at least one optoelectronic element are respectively electrically connected to at least two signal lines of the pattern circuit. Each connection pad group of the driving circuit board is corresponding to each surface mount structure, and at least two connection pads are respectively corresponding to the at least two through holes of the surface mount structure. At least two conductive members of each conductive member unit are disposed in the at least two through holes of the surface mount structure, respectively, and extending to the first surface and the second surface of the substrate. The conductive member disposed in each through hole electrically connects the signal lines of each surface mounting structure to the connection pads of each connection pad group of the driving circuit board.