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公开(公告)号：US20180020283A1
公开(公告)日：2018-01-18
申请号：US15540421
申请日：2015-12-17
Applicant: Goertek.Inc
Inventor： Zhibing Zhang , Gang Chen , Shuangshuang Fan
CPC classification number: H04R1/2811 , F16K3/314 , F16K7/17 , F16K25/005 , F16K27/0236 , H04R1/025 , H04R2499/11
Abstract: Described is an air valve and a speaker containing the air valve described. The air valve comprises a valve body, an elastic valve plate, an air inlet penetrating through an inner surface and an outer surface of the valve body, and an air outlet penetrating through an inner surface and an outer surface of the valve plate. The valve plate is connected with the valve body in a sealing manner to form an annular sealing area encircling the air outlet and the air inlet. The inner surface of the valve body covers the air outlet, and/or the inner surface of the valve plate covers the air inlet. The air valve can be opened or closed via elastic deformation of the valve plate of the air valve. Therefore, the air valve can be perfectly matched with smaller sized products, reducing the difficulty in adjusting the micro speaker in a limited space.
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公开(公告)号：US20170263811A1
公开(公告)日：2017-09-14
申请号：US15529602
申请日：2015-08-18
Applicant: Goertek.Inc
Inventor： Quanbo Zou , Zhe Wang
IPC: H01L33/00 , H01L25/075 , H01L33/62
CPC classification number: H01L33/0095 , H01L24/95 , H01L25/0753 , H01L33/0079 , H01L33/62 , H01L2933/0066
Abstract: A repairing method, manufacturing method, device and electronic apparatus of micro-LED are disclosed. The method for repairing micro-LED defects comprises: obtaining a micro-LED defect pattern on a receiving substrate; forming micro-LEDs (703b) corresponding to the defect pattern on a laser-transparent repair carrier substrate (707); aligning the micro-LEDs (703b) on the repair carrier substrate (707) with defect positions on the receiving substrate, and bringing the micro-LEDs (703b) into contact with pads at the defect positions; and irradiating the repair carrier substrate with a laser from the repair carrier substrate side, to lift-off the micro-LEDs from the repair carrier substrate (707).
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公开(公告)号：US10554109B2
公开(公告)日：2020-02-04
申请号：US15553026
申请日：2016-12-26
Applicant: GOERTEK.INC
Inventor： Dezhang Shi , Yueguang Zhu
Abstract: Disclosed is a linear vibration motor, comprising a housing, a vibration assembly and a stator assembly, wherein the vibration assembly includes a mass block, a permanent magnet and an elastic sheet and the stator assembly includes a coil and a damping element; the damping element includes a main body and an elastic arm extending upwards from the main body, and the main body is fixed on an end of the mass block in the length direction; and the elastic sheet has a middle arm and a first connection arm and a second connection arm respectively provided at two ends of the middle arm, the surface of the middle arm adjacent to the mass block is abutted against the elastic arm, the first connection arm is fixedly connected to the housing, and the second connection arm is fixedly connected to the mass block.
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公开(公告)号：US10295422B2
公开(公告)日：2019-05-21
申请号：US15559311
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang Zheng
Abstract: The present invention discloses a quasi-differential capacitive MEMS pressure sensor and manufacturing methods thereof. The quasi-differential capacitive MEMS pressure sensor includes a first lower electrode, a second lower electrode, a first upper electrode supported above the first lower electrode, and a second upper electrode supported above the second lower electrode, wherein the first upper electrode is a pressure-sensitive film, and a cavity between the first upper electrode and the first lower electrode is a closed cavity, so that the first upper electrode and the first lower electrode constitute an air pressure-sensitive type capacitor; and the second upper electrode and the second lower electrode constitute a reference capacitor whose capacitance does not vary with external air pressure. The pressure sensor provided by the present invention can at least partially filter out a common-mode interference signal in an output signal of the air pressure-sensitive type capacitor by use of the reference capacitor, thereby improving the stability and resolution of the output signal of the air pressure-sensitive type capacitor.
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公开(公告)号：US10250961B2
公开(公告)日：2019-04-02
申请号：US15570542
申请日：2015-12-14
Applicant: Goertek.Inc
Inventor： Zhibing Zhang , Gang Chen
Abstract: A speaker module is disclosed, which comprises an inner cavity defined by a shell, and a magnetic circuit system and a vibrating system arranged inside the inner cavity, wherein the vibrating system comprises a vibrating diaphragm fixed in the inner cavity, a voice coil is fixed to a lower end of the vibrating diaphragm, a first induction coil is provided to an upper end of the vibrating diaphragm, the voice coil is electrically connected with the first induction coil via its down-lead, and a second induction coil is provided above the first induction coil for electrically connecting a terminal device. When the speaker module operates, the terminal device conducts a current signal of an external audio to the second induction coil, so that the second induction coil generates a magnetic field which changes along with the change of the audio signal current.
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Patent Agency Ranking
公开(公告)号：US10225659B2
公开(公告)日：2019-03-05
申请号：US15551254
申请日：2015-11-26
Applicant: Goertek.Inc
Inventor： Minghui Shao , Jianbin Yang
Abstract: The present invention discloses a speaker device capable of restraining polarization, a method for adjusting a diaphragm balance position of the speaker device and a method for adjusting diaphragm compliance performance of the speaker device. The speaker device comprises a vibration system, a magnetic circuit system, a shell accommodating the vibration system and the magnetic circuit system, a first electret layer, a second electret layer and a third electret layer, wherein the first electret layer, the second electret layer and the third electret layer have the same electric charge polarity; the first electret layer is attached to the vibration system; the second electret layer is attached to a first fixing component above the vibration system and opposite to the first electret layer; the third electret layer is attached to a second fixing component below the vibration system and opposite to the first electret layer; and the first electret layer, the second electret layer and the third electret layer are parallel to one another. In the present invention, an electrostatic field force is adopted to restrain the polarization of a diaphragm in a vibration direction.
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公开(公告)号：US10181546B2
公开(公告)日：2019-01-15
申请号：US15559801
申请日：2015-11-04
Applicant: Goertek.Inc
Inventor： Quanbo Zou , Manen Lu , Zhe Wang
IPC: H01L33/00 , H01L21/68 , H01L21/786 , H01L25/075 , H01L27/15 , H01L33/20
Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronics apparatus of micro-LED. The method for transferring micro-LEDs comprises: forming a mask layer on the backside of a laser-transparent original substrate, wherein micro-LEDs are formed on the front-side of the original substrate; bringing the micro-LEDs on the original substrate in contact with preset pads on a receiving substrate; and irradiating the original substrate from the original substrate side with laser through the mask layer, to lift-off micro-LEDs from the original substrate.
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公开(公告)号：US10177055B2
公开(公告)日：2019-01-08
申请号：US15559780
申请日：2015-12-10
Applicant: Goertek.Inc
Inventor： Luyu Duanmu , Junde Zhang , Qinglin Song
IPC: H01L23/10 , B81B7/02 , H01L23/552 , B81B7/00
Abstract: Provided are an encapsulation structure and encapsulation method for an integrated sensor. The encapsulation structure comprises: a first substrate (1) and a first outer housing (2), the first outer housing and first substrate enclosing a first encapsulation cavity; a plurality of sensors arranged inside the first encapsulation cavity, each of the sensors comprising MEMS sensor chips (3, 8) and ASIC chips (5, 7) electrically connected to the MEMS sensor chips; inside the first encapsulation cavity, the exterior of the ASIC chip of at least one of the sensors is provided with a shielding structure. Arranging a shielding structure on the exterior of the ASIC chip in the integrated sensor and likely to be subjected to interference causes the ASIC chip to be encapsulated in isolation from other sensor units, preventing the other sensor units in the integrated sensor from interfering with the ASIC chip, and effectively improving the performance of the sensor unit and the overall performance of the integrated sensor.
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公开(公告)号：US20180113040A1
公开(公告)日：2018-04-26
申请号：US15559311
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang ZHENG
CPC classification number: G01L9/0072 , G01L9/12 , G01L13/025 , G01L19/0618
Abstract: The present invention discloses a quasi-differential capacitive MEMS pressure sensor and manufacturing methods thereof. The quasi-differential capacitive MEMS pressure sensor includes a first lower electrode, a second lower electrode, a first upper electrode supported above the first lower electrode, and a second upper electrode supported above the second lower electrode, wherein the first upper electrode is a pressure-sensitive film, and a cavity between the first upper electrode and the first lower electrode is a closed cavity, so that the first upper electrode and the first lower electrode constitute an air pressure-sensitive type capacitor; and the second upper electrode and the second lower electrode constitute a reference capacitor whose capacitance does not vary with external air pressure. The pressure sensor provided by the present invention can at least partially filter out a common-mode interference signal in an output signal of the air pressure-sensitive type capacitor by use of the reference capacitor, thereby improving the stability and resolution of the output signal of the air pressure-sensitive type capacitor.
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30.发明申请公开(公告)号：US20180069148A1
公开(公告)日：2018-03-08
申请号：US15559778
申请日：2015-09-09
Applicant: Goertek.Inc
Inventor： Quanbo ZOU , Zhe WANG
CPC classification number: H01L33/0095 , H01L24/03 , H01L25/0753 , H01L25/13 , H01L33/483 , H01L33/62 , H01L2224/83 , H01L2224/98 , H01L2924/0105 , H01L2924/01079 , H01L2933/0066
Abstract: The present invention discloses a repairing method, manufacturing method, device and electronics apparatus of micro-LED. The method for repairing a micro-LED comprises: bringing a known-good micro-LED on a conductive pick-up head into contact with a first pad on an defective position of a receiving substrate, wherein the conductive pick-up head and the known-good micro-LED are bonded via a conductive adhesive; locally joule heating a first bonding layer through the conductive pick-up head, to melt the first bonding layer, wherein the first bonding layer is provided between the known-good micro-LED and the first pad; and lifting up the conductive pick-up head after the first bonding layer is cooled, leaving the known-good micro-LED on the receiving substrate.
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