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    AUTOMATIC CLEANING DEVICE FOR MACHINE TOOL
    22.
    发明申请
    AUTOMATIC CLEANING DEVICE FOR MACHINE TOOL 审中-公开
    机床自动清洗装置

    公开(公告)号：US20100293739A1

    公开(公告)日：2010-11-25

    申请号：US12741889

    申请日：2008-10-22

    Applicant: Hiroyuki Imamura ,  Shunsuke Kubo

    Inventor： Hiroyuki Imamura ,  Shunsuke Kubo

    IPC: B08B7/00

    CPC classification number: B23Q11/005 ,  B23Q2230/002

    Abstract: An objective is to provide an automatic cleaning device for machine tool in which cleaning efficiency is improved by performing cleaning for a large range during machining. To achieve this, an air nozzle (21) that removes, by air-blowing, chips (Wa) and cutting oil (C) dispersed while a workpiece is being machined to an outside of the machine is allowed to move not only independently from a movement of a spindle head (16), but also relatively to a workpiece (W) in directions of three orthogonal axes.

    Abstract translation: 目的是提供一种用于机床的自动清洁装置，其中通过在加工期间进行大范围的清洁来提高清洁效率。 为了实现这一点，通过吹送将工件加工到机器外部的分散的切屑（Wa）和切削油（C）除去的空气喷嘴（21）不仅可以独立于 主轴头（16）的移动，而且在三个正交轴线的方向上也相对于工件（W）移动。

    Wiring board, semiconductor device and display module
    23.
    发明授权
    Wiring board, semiconductor device and display module 失效
    接线板，半导体器件和显示模块

    公开(公告)号：US07250575B2

    公开(公告)日：2007-07-31

    申请号：US11441678

    申请日：2006-05-26

    Applicant: Kouichi Nagao ,  Yoshifumi Nakamura ,  Hiroyuki Imamura ,  Michinari Tetani

    Inventor： Kouichi Nagao ,  Yoshifumi Nakamura ,  Hiroyuki Imamura ,  Michinari Tetani

    IPC: H05K3/46

    CPC classification number: H05K1/028 ,  H01L2224/73204 ,  H05K1/111 ,  H05K1/189 ,  H05K3/025 ,  H05K3/243 ,  H05K3/28 ,  H05K3/382 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  Y02P70/611

    Abstract: A wiring board includes: a flexible insulating base 1; a plurality of conductive wirings 2 arranged on the flexible insulating base 1; protruding electrodes 3 provided respectively at an end portion of the same side of each of the conductive wirings; external terminals 4, 5 formed respectively at the other end portions of each of the conductive wirings; metal plating layers applied on the conductive wirings, the protruding electrodes and the external terminals; and solder resist layers 7 formed respectively by coating the conductive wirings in regions between the end portions at which the protruding electrodes are provided and the external terminals. In the regions where the solder resist layers are formed, no metal plating layers are formed on the conductive wirings, and the surfaces of the conductive wirings to be contacted with the flexible insulating base are rougher than the surfaces not to be contacted with the flexible insulating base. Even when a film base is thin, bending stress applied to the conductive wirings is relieved sufficiently, and thus breaks in the wirings are suppressed.

    Abstract translation: 布线板包括：柔性绝缘基座1; 布置在柔性绝缘基座1上的多个导电布线2; 突出电极3分别设置在每个导电布线的同一侧的端部处; 外部端子4,5分别形成在每个导电布线的另一端部; 施加在导电布线，突出电极和外部端子上的金属镀层; 以及分别通过在设置有突出电极的端部与外部端子之间的区域中涂覆导电布线而形成的阻焊层7。 在形成阻焊层的区域中，在导电布线上不形成金属镀层，与挠性绝缘基体接触的导电配线的表面比不与柔性绝缘体接触的表面更粗糙 基础。 即使当薄膜基底较薄时，施加到导电布线的弯曲应力被充分地减轻，因此抑制布线中断。

    Wiring board and semiconductor device
    25.
    发明申请
    Wiring board and semiconductor device 审中-公开
    接线板和半导体器件

    公开(公告)号：US20060267219A1

    公开(公告)日：2006-11-30

    申请号：US11442185

    申请日：2006-05-26

    Applicant: Yoshifumi Nakamura ,  Kouichi Nagao ,  Hiroyuki Imamura

    Inventor： Yoshifumi Nakamura ,  Kouichi Nagao ,  Hiroyuki Imamura

    IPC: H01L23/52

    CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    Abstract: A flexible insulating base, a plurality of conductor wirings provided on the base, and a plurality of bump electrodes that are formed on the plurality of conductor wirings, respectively, are provided. A semiconductor chip having electrode pads is to be mounted by placing the semiconductor chip on the bump electrodes and bonding the electrode pads and the bump electrodes, respectively. The bump electrodes are placed on the conductor wirings, respectively, in edge portions of at least two sides of a chip mounting region in which the semiconductor chip is to be mounted. The conductor wiring corresponding to at least one of the bump electrodes placed in the edge portions of the two sides passes through the chip mounting region so as to be routed via a side different from the side on which the at least one of the bump electrodes is placed, and then led to an outside of the chip mounting region. It is possible to route wirings more freely for leading conductor wirings from bump electrodes placed in an edge portion of a semiconductor chip mounting region to an outside of the chip mounting region.

    Abstract translation: 提供柔性绝缘基座，设置在基座上的多个导体布线和分别形成在多个导体布线上的多个凸块电极。 通过将半导体芯片放置在凸块电极上并分别结合电极焊盘和凸块电极来安装具有电极焊盘的半导体芯片。 凸起电极分别放置在芯片安装区域的至少两侧的边缘部分中，半导体芯片将要安装在其中。 对应于放置在两侧边缘部分中的凸起电极中的至少一个凸起电极的导体布线通过芯片安装区域，以便经由与其中至少一个凸起电极的侧面不同的一侧 放置，然后引导到芯片安装区域的外部。 可以更加自由地将布线布线从位于半导体芯片安装区域的边缘部分中的凸起电极引导到芯片安装区域的外部。

    Lock-up clutch pressure control device
    27.
    发明授权
    Lock-up clutch pressure control device 失效
    锁定离合器压力控制装置

    公开(公告)号：US5082095A

    公开(公告)日：1992-01-21

    申请号：US578198

    申请日：1990-09-06

    Applicant: Hiroyuki Imamura

    Inventor： Hiroyuki Imamura

    IPC: F16H61/14

    CPC classification number: F16H61/143

    Abstract: A spool of a lock-up control valve is arranged to have equal pressure differential areas exposed to the apply and release pressures applied to the apply and release chambers of the lock-up clutch. The movement of the spool is determined by changes in a single variable level pressure and independent of the apply pressure.

    Abstract translation: 锁定控制阀的阀芯布置成具有暴露于施加到锁止离合器的施加和释放室的施加和释放压力的相等的压差区域。 阀芯的运动由单个可变液位压力的变化决定，独立于施加压力。

    Silver halide emulsion containing colored magenta coupler for photography
    29.
    发明授权
    Silver halide emulsion containing colored magenta coupler for photography 失效
    含有彩色品红色成色剂的卤化银乳剂用于摄影

    公开(公告)号：US4070191A

    公开(公告)日：1978-01-24

    申请号：US455121

    申请日：1974-03-27

    Applicant: Hiroyuki Imamura ,  Shui Sato ,  Tamotsu Kojima ,  Takaya Endo

    Inventor： Hiroyuki Imamura ,  Shui Sato ,  Tamotsu Kojima ,  Takaya Endo

    IPC: G03C7/38 ,  C09B26/02 ,  C09B29/50 ,  G03C7/333 ,  G03C1/40

    CPC classification number: G03C7/3335 ,  C09B29/366

    Abstract: A coloured magenta coupler for photography is disclosed which is represented by the following general formula: ##STR1## wherein R is substituted phenyl, R.sub.1 and R.sub.2 individually stand for hydrogen, halogen, hydroxyl, alkyl, alkoxy or acylamino, with the proviso that one of R.sub.1 and R.sub.2 is hydroxyl but that both are not hydroxyl simultaneously, R.sub.3 is hydrogen, halogen, alkyl, nitro or acylamino and R.sub.4 stands for hydrogen, halogen or a monovalent organic residue.

    Abstract translation: 公开了用于摄影的着色品红色成色剂，其由以下通式表示：其中R是取代的苯基，R 1和R 2各自代表氢，卤素，羟基，烷基，烷氧基或酰氨基，条件是 R 1和R 2是羟基，但同时不是羟基，R 3是氢，卤素，烷基，硝基或酰基氨基，R 4代表氢，卤素或一价有机残基。

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