公开(公告)号：US10281488B2

公开(公告)日：2019-05-07

申请号：US15488181

申请日：2017-04-14

Applicant: MPI CORPORATION

Inventor： Shih-Shin Chen ,  Cheng-En Wu ,  Chia-Hsiang Yu

IPC: G01R22/00 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  H01L21/00 ,  G01R1/00

Abstract: A probe card includes a substrate module having an installation hole and a first stair-shaped structure provided on two stairs thereof with a first connection surface and a first transmission surface having a first contact pad, a probe module having a probe and a second stair-shaped structure provided on two stairs thereof with a second connection surface and a second transmission surface having a second contact pad electrically connected with the probe, and a pressing member. The probe module is disposed in the installation hole so that the first and second connection surfaces are connected and the first and second transmission surfaces are opposite. The pressing member is detachably pressed on the probe module to press the second connection surface against the first connection surface and make the first and second contact pads electrically connected.

公开(公告)号：US10070512B2

公开(公告)日：2018-09-04

申请号：US15423584

申请日：2017-02-03

Applicant: MPI corporation

Inventor： Wei-Cheng Ku ,  Jun-Liang Lai ,  Chih-Hao Ho

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

公开(公告)号：US10048844B2

公开(公告)日：2018-08-14

申请号：US14996282

申请日：2016-01-15

Applicant: MPI Corporation

Inventor： Stojan Kanev ,  Yung-Chin Liu ,  Andrej Rumiantsev ,  Yao-Chuan Chiang

IPC: G06F3/0484 ,  G06F3/041 ,  G06F3/0488 ,  G01R31/28 ,  G03F7/20 ,  G01N21/95

Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.

公开(公告)号：US10041974B2

公开(公告)日：2018-08-07

申请号：US15260326

申请日：2016-09-09

Applicant: MPI Corporation

Inventor： Tien-Chia Li ,  Yi-Ching Chuo

IPC: G01R1/067

Abstract: A probe head includes a probe base, a film, and a probe assembly. The probe base includes first, second, and third guiding boards. The second guiding board is fixed between the first and third guiding boards. The film is fixed to the probe base and has a hole. The probe assembly passes through the first, second, and third guiding boards and the hole, and includes a probe and an outer spring sleeve. The probe has a tip passing out through the third guiding board. The outer spring sleeve is sleeved at the exterior of the probe and has a spring area and a plurality of non-spring areas. The spring area is disposed between adjacent two of the non-spring areas. One of the non-spring areas has a bonding section mounted to the probe and retained between the third guiding board and the film.

公开(公告)号：US09958477B2

公开(公告)日：2018-05-01

申请号：US15064607

申请日：2016-03-09

Applicant: MPI Corporation

Inventor： Yu-Hsun Hsu ,  Ban-Ban Lim

IPC: G01R31/20 ,  G01R1/067 ,  G01R31/26

CPC classification number: G01R1/06705 ,  G01R31/2601 ,  G01R31/2635

Abstract: A test machine includes a base, a testing platform, a probe platform, a control lever, a temporary positioning mechanism and a damper. The testing platform connects with the base and carries a device under test. The probe platform connects with the base and moves along a longitudinal direction. The probe platform connects with a probe. The control lever connects with the base and the probe platform which is driven by the control lever to move along the longitudinal direction. The temporary positioning mechanism connects with the control lever and temporarily holds the probe platform and the control lever at a specific position. The damper connects with the base. When a distance between the probe and the DUT is shorter than a buffering distance, the damper abuts against the control lever or the probe platform to reduce a velocity of the probe moving towards the DUT.

公开(公告)号：US09927487B2

公开(公告)日：2018-03-27

申请号：US14133603

申请日：2013-12-18

Applicant: MPI Corporation

Inventor： Chao-Ching Huang ,  Chih-Hao Ho ,  Wei-Cheng Ku

IPC: G01R31/28 ,  G01R1/073

CPC classification number: G01R31/2887 ,  G01R1/07314 ,  G01R31/2889

Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.

公开(公告)号：US09759746B2

公开(公告)日：2017-09-12

申请号：US14558558

申请日：2014-12-02

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Hao Wei ,  Shin-Lan Kao

IPC: G01R31/20 ,  G01R3/00 ,  G01R1/067 ,  G01R1/18

CPC classification number: G01R3/00 ,  G01R1/06772 ,  G01R1/18

Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.

公开(公告)号：US20170219650A1

公开(公告)日：2017-08-03

申请号：US15414852

申请日：2017-01-25

Applicant: MPI Corporation

Inventor： Chen-Ching Chen ,  Yu-Hsun Hsu ,  Po-Yi Ting ,  Stojan Kanev

IPC: G01R31/28 ,  G01K13/00

CPC classification number: H01L21/6773 ,  A47B88/457 ,  A47B88/497 ,  A47B88/988 ,  G01K13/00 ,  G01R31/2891 ,  G01R31/44 ,  H01L21/67346 ,  H01L21/67386

Abstract: A method for compensating probe misplacement and a probe apparatus are provided. The method is applicable to a probe module which includes a probe and a fixing base. The probe includes a probe body section and a probe tip section. The probe body section is fixed on the fixing base. The method includes: measuring a temperature of a probe body of the probe body section of the probe; calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section; calculating a compensation value according to the thermal expansion amount; moving the probe or a to-be-tested element according to the calculated compensation value, to align a probe tip of the probe tip section with the to-be-tested element or align the to-be-tested element with the probe tip of the probe tip section.

公开(公告)号：US20170192036A1

公开(公告)日：2017-07-06

申请号：US15334477

申请日：2016-10-26

Applicant: MPI Corporation

Inventor： Yi-Chien Tsai ,  Yi-Lung Lee ,  Horng-Kuang Fan

IPC: G01R1/067 ,  G01R31/28

CPC classification number: G01R1/06722 ,  G01R1/06733 ,  G01R31/2884

Abstract: A probe structure includes a tube body and a pin body. The tube body has a central axis and includes a first rigid section, a first spring section, a second rigid section, and a second spring section. The first spring section surrounds the central axis and extends in a direction along the central axis. Two ends of the first spring section connect to one end of the first rigid section and one end of the second rigid section. The first spring section and the second spring section are different in spring constant. The pin body passes through and is disposed in the tube body. The pin body has a head section protruding out of the first rigid section, and the head section is fastened to the first rigid section.

公开(公告)号：US20170176497A1

公开(公告)日：2017-06-22

申请号：US15379887

申请日：2016-12-15

Applicant: MPI CORPORATION

Inventor： Shao-Lun WEI ,  Yu-Chen HSU ,  Mao-Fa SHEN ,  Chih-Hao HSU

IPC: G01R1/073 ,  B81C1/00 ,  B81B1/00

CPC classification number: G01R1/07357 ,  B81B1/008 ,  B81C1/00007 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00

Abstract: A microelectromechanical probe is manufactured by a MEMS manufacturing process forming a probe body and a cutting process providing a pinpoint portion a cutting face. The probe has a top surface, a body portion, and a pinpoint portion extended in a probing direction from the body portion and provided with first and second sides and a probing end oriented in the probing direction. The cutting face is provided on the top surface, adjoins the first and second sides and the probing end, and has at least one cut mark formed by the cutting process, extended from the first side to the second side and non-parallel to the probing direction. The cutting face descends from an edge cut mark to the probing end.