公开(公告)号：US11536765B2

公开(公告)日：2022-12-27

申请号：US16892076

申请日：2020-06-03

Applicant: MPI Corporation

Inventor： Kang-Yen Fu ,  Ya-Hung Lo ,  Shou-Jen Tsai ,  Wei-Cheng Ku

IPC: G01R31/28 ,  H01L21/67 ,  G01R1/073

Abstract: A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.

公开(公告)号：US10070512B2

公开(公告)日：2018-09-04

申请号：US15423584

申请日：2017-02-03

Applicant: MPI corporation

Inventor： Wei-Cheng Ku ,  Jun-Liang Lai ,  Chih-Hao Ho

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

公开(公告)号：US09927487B2

公开(公告)日：2018-03-27

申请号：US14133603

申请日：2013-12-18

Applicant: MPI Corporation

Inventor： Chao-Ching Huang ,  Chih-Hao Ho ,  Wei-Cheng Ku

IPC: G01R31/28 ,  G01R1/073

CPC classification number: G01R31/2887 ,  G01R1/07314 ,  G01R31/2889

Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.

公开(公告)号：US09759746B2

公开(公告)日：2017-09-12

申请号：US14558558

申请日：2014-12-02

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Hao Wei ,  Shin-Lan Kao

IPC: G01R31/20 ,  G01R3/00 ,  G01R1/067 ,  G01R1/18

CPC classification number: G01R3/00 ,  G01R1/06772 ,  G01R1/18

Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.

公开(公告)号：US09596769B2

公开(公告)日：2017-03-14

申请号：US14620015

申请日：2015-02-11

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Jun-Liang Lai ,  Chih-Hao Ho

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K1/03

CPC classification number: H05K1/0216 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/113 ,  H05K1/114 ,  H05K1/18 ,  H05K3/421 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/041 ,  H05K2201/09545 ,  H05K2203/0369 ,  H05K2203/1461

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

Abstract translation: 多层电路板包括第一衬底和堆叠中的第二衬底。 第一基板设置有第一焊盘，第二焊盘和第一子电路。 第一焊盘和第二焊盘电连接到第一子电路。 第二基板具有顶表面，底表面和开口。 第二基板的底表面附接到第一基板的顶表面。 开口从第二基板的顶表面延伸到底表面。 第一基板的第一焊盘在第二基板的开口中; 第一衬底的第二衬垫不被第二衬底覆盖。 第二基板还在顶表面上设置有焊盘，并且电连接到第二基板的焊盘的第二子电路。

公开(公告)号：US09545002B2

公开(公告)日：2017-01-10

申请号：US14619944

申请日：2015-02-11

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Jun-Liang Lai ,  Chih-Hao Ho

IPC: H05K1/11

CPC classification number: H05K1/112 ,  H05K1/0268 ,  H05K1/113 ,  H05K2201/10265 ,  H05K2201/10295

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate has a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.

Abstract translation: 多层电路板包括第一衬底和堆叠中的第二衬底。 第一基板具有第一焊盘和第一电路，其中第一电路嵌入在第一基板中，并且第一焊盘电连接到第一电路。 第二基板具有第一通孔，第二焊盘和第二电路，其中第一通孔在第二基板的两侧开口，第一基板的第一焊盘位于第一通孔中; 第二电路嵌入第二衬底中，第二衬垫电连接到第二电路。 每个衬底上的焊盘由上述衬底的通孔暴露，以缩短互连器的零部分，并减少无效部分的干扰。

公开(公告)号：US10101362B2

公开(公告)日：2018-10-16

申请号：US14553590

申请日：2014-11-25

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Hao Wei ,  Yu-Hao Chen ,  Chih-Hao Ho

IPC: G01R1/067

Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.

公开(公告)号：US09459279B2

公开(公告)日：2016-10-04

申请号：US14557043

申请日：2014-12-01

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Shao-Wei Lu ,  Hung-Chih Sung ,  Chun-Nan Chen

IPC: G01R31/00 ,  G01R1/04 ,  G01R31/28 ,  G01R1/073

CPC classification number: G01R1/04 ,  G01R1/07392 ,  G01R31/2887

Abstract: An electrical testing machine includes a base having two parallel first rails, a platform provided on the base, a probe holder provided on the base and having a plurality of placement locations, a support provided between the first rails and having a second rail thereon, a test arm provided on the second rail and above the platform, a receiving seat provided on the test arm, and a plurality of probe sets, wherein one of the probe sets is engaged on the receiving seat, while the others are respectively provided on the placement locations. The support is movable relative to the base and the platform. The test arm is movable along with the support, and is also movable relative to the support. The receiving seat is movable or rotatable relative to the test arm. The probe set engaged on the receiving seat is movable along with the receiving seat.

Abstract translation: 电测试机包括具有两个平行的第一轨道的基座，设置在基座上的平台，设置在基座上并具有多个放置位置的探针保持架，设置在第一轨道之间并具有第二轨道的支撑件， 设置在第二导轨上并位于平台上的测试臂，设置在测试臂上的接收座和多个探针组，其中探针组中的一个接合在接收座上，而其它探针组分别设置在放置位置 位置。 支撑件相对于基座和平台是可移动的。 测试臂与支撑件一起可移动，并且也可相对于支撑件移动。 接收座椅相对于测试臂是可移动的或可旋转的。 接合在接收座上的探针组可与接收座一起移动。

公开(公告)号：US09442134B2

公开(公告)日：2016-09-13

申请号：US14332047

申请日：2014-07-15

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Jun-Liang Lai ,  Chun-Chung Huang ,  Wei Chen ,  Hsin-Hsiang Liu ,  Kuang-Chung Chou

IPC: G01R31/00 ,  G01R1/073 ,  G01R31/28

CPC classification number: G01R1/07342 ,  G01R31/2889

Abstract: A probe card, which is between a tester and a device under test (DUT), includes two first electrical lines, two second electrical lines, two inductive elements, and a capacitor. The first electrical lines are electrically connected to the probes respectively. The second electrical lines are electrically connected to the first electrical lines respectively. The inductive elements are electrically connected to the first electrical lines and the tester respectively; and the capacitor has opposite ends connected to the second electrical lines respectively.

Abstract translation: 位于测试仪和待测器件（DUT）之间的探针卡包括两条第一条电线，两条第二条电线，两条电感元件和一个电容器。 第一电线分别与探针电连接。 第二电线分别电连接到第一电线。 电感元件分别电连接到第一电线和测试仪; 并且电容器具有分别连接到第二电线的相对端。

公开(公告)号：US09410986B2

公开(公告)日：2016-08-09

申请号：US14557879

申请日：2014-12-02

Applicant: MPI CORPORATION

Inventor： Wei-Cheng Ku ,  Hao Wei ,  Chia-Nan Chou ,  Chih-Hao Ho

IPC: G01R1/04

CPC classification number: G01R1/0466

Abstract: A testing jig includes a substrate, a carrier provided on the substrate, two conductive members made of a conductive material, and a compensation member made of a conductive material. The substrate has a signal circuit and a grounding circuit thereon. The carrier has a base board made of an insulating material and a conductive circuit made of a conductive material provided thereon. The base board has a signal perforation aligning with the signal circuit, a grounding perforation aligning with the grounding circuit, and multiple compensation holes. The conductive members both have an end exposed out of the carrier, and are respectively fitted in the signal perforation and the grounding perforation to make another end thereof contact the signal circuit or the grounding circuit. The compensation member is fitted in one of the compensation holes to be electrically connected to the conductive member in the grounding perforation through the conductive circuit.

Abstract translation: 测试夹具包括衬底，设置在衬底上的载体，由导电材料制成的两个导电构件和由导电材料制成的补偿构件。 衬底上具有信号电路和接地电路。 载体具有由绝缘材料制成的基板和设置在其上的由导电材料制成的导电电路。 基板具有与信号电路对准的信号穿孔，与接地电路对准的接地穿孔，以及多个补偿孔。 导电构件都具有暴露在载体外的端部，并且分别装配在信号穿孔和接地穿孔中，以使另一端与信号电路或接地电路接触。 补偿部件安装在一个补偿孔中，以通过导电电路与接地穿孔中的导电部件电连接。