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公开(公告)号：US20240400277A1
公开(公告)日：2024-12-05
申请号：US18203659
申请日：2023-05-31
Applicant: Maxeon Solar Pte. Ltd.
Inventor： Jianxun Wu , Yafu Lin , Yonggang Guo
Abstract: A packaging piece is disclosed. The packaging piece includes a first side that includes a first module frame interlocking structure configured to snap fit to a drainage hole of a module frame in a first orientation and to extend toward a glass surface of a module in a second orientation. The packaging piece also includes a second side that includes: a second module frame interlocking structure configured to extend toward the glass surface of the module in the first orientation and to snap fit to the drainage hole of the module frame in the second orientation.
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公开(公告)号：US12142700B2
公开(公告)日：2024-11-12
申请号：US18095769
申请日：2023-01-11
Applicant: Maxeon Solar Pte Ltd.
Inventor： Staffan Westerberg , Gabriel Harley
IPC: H01L31/0224 , H01L31/0236 , H01L31/0352 , H01L31/0745 , H01L31/18
Abstract: Methods of fabricating solar cell emitter regions with differentiated P-type and N-type architectures and incorporating dotted diffusion, and resulting solar cells, are described. In an example, a solar cell includes a substrate having a light-receiving surface and a back surface. A first polycrystalline silicon emitter region of a first conductivity type is disposed on a first thin dielectric layer disposed on the back surface of the substrate. A second polycrystalline silicon emitter region of a second, different, conductivity type is disposed on a second thin dielectric layer disposed in a plurality of non-continuous trenches in the back surface of the substrate.
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公开(公告)号：US20240313134A1
公开(公告)日：2024-09-19
申请号：US18123318
申请日：2023-03-19
Applicant: Maxeon Solar Pte. Ltd.
Inventor： Nils Peter Harder
IPC: H01L31/0224 , H01L31/02
CPC classification number: H01L31/022458 , H01L31/02013 , H01L31/0682
Abstract: A solar cell is disclosed. The solar cell incudes a substrate, a dielectric layer formed on a backside of the substrate, and a plurality of non-contiguous deposited emitter regions having a first polarity on the dielectric layer. The solar cell also includes at least one deposited emitter region having a second polarity on the dielectric layer, laterally disposed to the plurality of non-contiguous deposited emitter regions.
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公开(公告)号：US20240250201A1
公开(公告)日：2024-07-25
申请号：US18586315
申请日：2024-02-23
Applicant: Maxeon Solar Pte. Ltd.
Inventor： PEI HSUAN LU , BENJAMIN I. HSIA , TAESEOK KIM
IPC: H01L31/18 , B23K26/382 , H01L31/0216 , H01L31/0224 , H01L31/0236
CPC classification number: H01L31/18 , B23K26/382 , H01L31/022441 , H01L31/02168 , H01L31/02363 , H01L31/1804
Abstract: Local patterning and metallization of semiconductor structures using a laser beam, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a method of fabricating a solar cell includes providing a substrate having an intervening layer thereon. The method also includes locating a metal foil over the intervening layer. The method also includes exposing the metal foil to a laser beam, wherein exposing the metal foil to the laser beam forms openings in the intervening layer and forms a plurality of conductive contact structures electrically connected to portions of the substrate exposed by the openings.
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公开(公告)号：US20240235466A9
公开(公告)日：2024-07-11
申请号：US18493516
申请日：2023-10-24
Applicant: Maxeon Solar Pte. Ltd.
Inventor： Arnaud LEPERT , Paul ADRIANI
IPC: H02S30/10
CPC classification number: H02S30/10
Abstract: Embodiments create groupings of singulated strips of mixed (chamfered; rectangular) footprint/outline/perimeter types. The groupings exhibit a consistent ratio of chamfered strips to rectangular strips. These groupings can then be freely incorporated into solar modules in order to offer a pleasingly uniform appearance.
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Patent Agency Ranking
公开(公告)号：US20240222534A1
公开(公告)日：2024-07-04
申请号：US18608788
申请日：2024-03-18
Applicant: Maxeon Solar Pte. Ltd.
Inventor： GABRIEL HARLEY , TAESEOK KIM , RICHARD HAMILTON SEWELL , MICHAEL MORSE , DAVID D. SMITH , MATTHIEU MOORS , JENS-DIRK MOSCHNER
IPC: H01L31/0224 , H01L31/0236 , H01L31/028 , H01L31/0475 , H01L31/05 , H01L31/068 , H01L31/0745
CPC classification number: H01L31/02245 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0475 , H01L31/0512 , H01L31/0516 , H01L31/0682 , H01L31/0745 , Y02E10/50 , Y02E10/547 , Y02P70/50
Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
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公开(公告)号：US12009438B2
公开(公告)日：2024-06-11
申请号：US15823896
申请日：2017-11-28
Applicant: Maxeon Solar Pte. Ltd.
Inventor： Thomas P. Pass , Gabriel Harley
IPC: H01L31/02 , H01L31/0224 , H01L31/05 , H01L31/0745 , H01L31/18
CPC classification number: H01L31/02008 , H01L31/02021 , H01L31/022441 , H01L31/0516 , H01L31/0745 , H01L31/18 , Y02E10/50
Abstract: Foil trim approaches for the foil-based metallization of solar cells and the resulting solar cells are described. For example, a method involves attaching a metal foil sheet to a metallized surface of an underlying supported wafer to provide a unified pairing of the metal foil sheet and the wafer. Subsequent to attaching the metal foil sheet, a portion of the metal foil sheet is laser scribed from above to form a groove in the metal foil sheet. Subsequent to laser scribing the metal foil sheet, the unified pairing of the metal foil sheet and the wafer is rotated to provide the metal sheet below the wafer. Subsequent to the rotating, the unified pairing of the metal foil sheet and the wafer is placed on a chuck with the metal sheet below the wafer. The metal foil sheet is torn at least along the groove to trim the metal foil sheet.
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公开(公告)号：US20240170596A1
公开(公告)日：2024-05-23
申请号：US18427539
申请日：2024-01-30
Applicant: Maxeon Solar Pte. Ltd.
IPC: H01L31/05 , B23K31/02 , H01L31/068 , H01L31/0745 , H01L31/18
CPC classification number: H01L31/0512 , B23K31/02 , H01L31/05 , H01L31/0504 , H01L31/0508 , H01L31/0682 , H01L31/0745 , H01L31/18 , H01L31/1876 , Y02E10/50 , Y02E10/547
Abstract: A solar cell can include a conductive foil having a first portion with a first yield strength coupled to a semiconductor region of the solar cell. The solar cell can be interconnected with another solar cell via an interconnect structure that includes a second portion of the conductive foil, with the interconnect structure having a second yield strength greater than the first yield strength.
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公开(公告)号：US20240145619A1
公开(公告)日：2024-05-02
申请号：US18409190
申请日：2024-01-10
Applicant: MAXEON SOLAR PTE. LTD.
Inventor： Vergil R. SANDOVAL , Emmanuel C. Abas , Yafu Lin
CPC classification number: H01L31/188 , H01B13/0003 , H01L31/05 , Y10T29/49117
Abstract: A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.
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公开(公告)号：US20240136973A1
公开(公告)日：2024-04-25
申请号：US18493516
申请日：2023-10-23
Applicant: Maxeon Solar Pte. Ltd.
Inventor： Arnaud LEPERT , Paul ADRIANI
IPC: H02S30/10
CPC classification number: H02S30/10
Abstract: Embodiments create groupings of singulated strips of mixed (chamfered; rectangular) footprint/outline/perimeter types. The groupings exhibit a consistent ratio of chamfered strips to rectangular strips. These groupings can then be freely incorporated into solar modules in order to offer a pleasingly uniform appearance.
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