公开(公告)号：US20240313142A1

公开(公告)日：2024-09-19

申请号：US18222292

申请日：2023-07-14

Applicant: Maxeon Solar Pte. Ltd.

Inventor： RICHARD HAMILTON SEWELL ,  DAVID AARON RANDOLPH BARKHOUSE ,  DOUGLAS ROSE ,  LEWIS ABRA

IPC: H01L31/05 ,  H01L31/02 ,  H01L31/18

CPC classification number: H01L31/0516 ,  H01L31/02013 ,  H01L31/0508 ,  H01L31/188

Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.

公开(公告)号：US20240145607A1

公开(公告)日：2024-05-02

申请号：US18405720

申请日：2024-01-05

Applicant: Maxeon Solar Pte. Ltd.

Inventor： RICHARD HAMILTON SEWELL ,  MATTHIEU MINAULT REICH ,  ANDREA R. BOWRING ,  ARBAZ SHAKIR ,  RYAN REAGAN ,  MATTHEW MATSUMOTO

IPC: H01L31/05 ,  H01L31/18

CPC classification number: H01L31/0504 ,  H01L31/0516 ,  H01L31/188

Abstract: Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a string of solar cells includes a plurality of back-contact solar cells, wherein each of the plurality of back-contact solar cells includes P-type and N-type doped diffusion regions. A plurality of conductive wires is disposed over a back surface of each of the plurality of solar cells, wherein each of the plurality of conductive wires is substantially parallel to the P-type and N-type doped diffusion regions of each of the plurality of solar cells. One or more of the plurality of conductive wires adjoins a pair of adjacent solar cells of the plurality of solar cells and has a relief feature between the pair of adjacent solar cells.

公开(公告)号：US20240222534A1

公开(公告)日：2024-07-04

申请号：US18608788

申请日：2024-03-18

Applicant: Maxeon Solar Pte. Ltd.

Inventor： GABRIEL HARLEY ,  TAESEOK KIM ,  RICHARD HAMILTON SEWELL ,  MICHAEL MORSE ,  DAVID D. SMITH ,  MATTHIEU MOORS ,  JENS-DIRK MOSCHNER

IPC: H01L31/0224 ,  H01L31/0236 ,  H01L31/028 ,  H01L31/0475 ,  H01L31/05 ,  H01L31/068 ,  H01L31/0745

CPC classification number: H01L31/02245 ,  H01L31/022441 ,  H01L31/02363 ,  H01L31/028 ,  H01L31/0475 ,  H01L31/0512 ,  H01L31/0516 ,  H01L31/0682 ,  H01L31/0745 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/50

Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.

公开(公告)号：US20240170596A1

公开(公告)日：2024-05-23

申请号：US18427539

申请日：2024-01-30

Applicant: Maxeon Solar Pte. Ltd.

Inventor： THOMAS P. PASS ,  GABRIEL HARLEY ,  DAVID FREDRIC JOEL KAVULAK ,  RICHARD HAMILTON SEWELL

IPC: H01L31/05 ,  B23K31/02 ,  H01L31/068 ,  H01L31/0745 ,  H01L31/18

CPC classification number: H01L31/0512 ,  B23K31/02 ,  H01L31/05 ,  H01L31/0504 ,  H01L31/0508 ,  H01L31/0682 ,  H01L31/0745 ,  H01L31/18 ,  H01L31/1876 ,  Y02E10/50 ,  Y02E10/547

Abstract: A solar cell can include a conductive foil having a first portion with a first yield strength coupled to a semiconductor region of the solar cell. The solar cell can be interconnected with another solar cell via an interconnect structure that includes a second portion of the conductive foil, with the interconnect structure having a second yield strength greater than the first yield strength.

公开(公告)号：US20240088317A1

公开(公告)日：2024-03-14

申请号：US18513256

申请日：2023-11-17

Applicant: Maxeon Solar Pte. Ltd.

Inventor： RICHARD HAMILTON SEWELL ,  DAVID FREDRIC JOEL KAVULAK ,  LEWIS ABRA ,  THOMAS P. PASS ,  TAESEOK KIM ,  MATTHIEU MOORS ,  BENJAMIN IAN HSIA ,  GABRIEL HARLEY

IPC: H01L31/05 ,  H01L31/0224 ,  H01L31/068

CPC classification number: H01L31/0516 ,  H01L31/022441 ,  H01L31/022458 ,  H01L31/05 ,  H01L31/0504 ,  H01L31/0508 ,  H01L31/0682 ,  Y02E10/50 ,  Y02E10/546 ,  Y02E10/547

Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.

公开(公告)号：US20250056914A1

公开(公告)日：2025-02-13

申请号：US18932519

申请日：2024-10-30

Applicant: Maxeon Solar Pte. Ltd.

Inventor： RICHARD HAMILTON SEWELL ,  GABRIELA BUNEA

IPC: H01L31/18 ,  H01L31/0224 ,  H01L31/048 ,  H01L31/05 ,  H01L31/068

Abstract: Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.

公开(公告)号：US20240379884A1

公开(公告)日：2024-11-14

申请号：US18783283

申请日：2024-07-24

Applicant: Maxeon Solar Pte. Ltd.

Inventor： RICHARD HAMILTON SEWELL ,  DAVID AARON RANDOLPH BARKHOUSE ,  JUNBO WU ,  MICHAEL CUDZINOVIC ,  PAUL LOSCUTOFF ,  JOSEPH BEHNKE ,  MICHEL ARSÈNE OLIVIER NGAMO TOKO

IPC: H01L31/0224 ,  H01L31/02 ,  H01L31/068 ,  H01L31/0745

Abstract: Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a barrier layer on a semiconductor region disposed in or above a substrate. The semiconductor region includes monocrystalline or polycrystalline silicon. The method also involves forming a conductive paste layer on the barrier layer. The method also involves forming a conductive layer from the conductive paste layer. The method also involves forming a contact structure for the semiconductor region of the solar cell, the contact structure including at least the conductive layer.

公开(公告)号：US20240313133A1

公开(公告)日：2024-09-19

申请号：US18674200

申请日：2024-05-24

Applicant: Maxeon Solar Pte. Ltd.

Inventor： RICHARD HAMILTON SEWELL ,  ROBERT WOEHL ,  JENS DIRK MOSCHNER ,  NILS-PETER HARDER

IPC: H01L31/0224 ,  H01L31/068

CPC classification number: H01L31/022441 ,  H01L31/0682 ,  Y02E10/547

Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.