公开(公告)号：US20130305396A1

公开(公告)日：2013-11-14

申请号：US13876232

申请日：2011-09-28

Applicant: Luigi Grasso ,  Jian Min Lin ,  Yuhong Zhou ,  Brian E. Tomkowicz ,  Nicholas C. Nicolaides ,  Philip M. Sass

Inventor： Luigi Grasso ,  Jian Min Lin ,  Yuhong Zhou ,  Brian E. Tomkowicz ,  Nicholas C. Nicolaides ,  Philip M. Sass

IPC: A61K49/00

CPC classification number: A61K49/0008 ,  A01K67/0278 ,  A01K2217/072 ,  A01K2227/105 ,  A01K2267/0331 ,  A01K2267/0368 ,  A01K2267/0375 ,  C07K14/7056 ,  C07K14/70596 ,  G01N33/5088

Abstract: Provided herein are rodents that express the human endosialin gene. In preferred embodiments, the rodent is a mouse. Preferably, the human endosialin gene is integrated into the native or endogenous endosialin gene locus. More preferably, the host rodent is null for the endogenous endosialin gene product. The human endosialin gene is preferably expressed in a similar development and disease response pattern as that of the native endosialin gene product in parental or wild type rodents. This feature makes these rodents useful for studying the effects of test agents to positively or negatively affect endosialin biology for therapeutic use. Use of human endosialin expressing rodents lacking native endosialin gene product (HUE rodents) is proposed as a strategy for developing agents that can positively or negatively affect the endosialin pathway and also serve as a screening tool to identify those agents that may be useful as human therapies.

Abstract translation: 本文提供表达人内皮唾液酸基因的啮齿动物。 在优选的实施方案中，啮齿动物是小鼠。 优选地，人内皮唾液酸蛋白基因整合到天然或内源性内唾液酸基因座。 更优选地，宿主啮齿动物对于内源性内唾液酸基因产物是无效的。 人内皮唾液酸蛋白基因优选以与亲本或野生型啮齿动物中的天然唾液酸内切酶基因产物相似的发育和疾病应答模式表达。 该特征使得这些啮齿动物可用于研究试验剂对用于治疗用途的唾液酸生物学的正面或负面影响的影响。 提出缺乏天然唾液酸内切酶基因产物（HUE啮齿类动物）的人类内皮糖蛋白表达啮齿动物的使用作为可以对内皮唾液酸途径有正面或负面影响的发育剂的策略，也可作为鉴定可用作人类治疗的药物的筛选工具 。

公开(公告)号：US20130233605A1

公开(公告)日：2013-09-12

申请号：US13607820

申请日：2012-09-10

Applicant: Chien-Min Hsu ,  Min-Lin Lee ,  Li-Duan Tsai

Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Li-Duan Tsai

IPC: H05K1/18

CPC classification number: H05K1/162 ,  H01G9/012 ,  H01G9/04 ,  H01G9/15 ,  H01G9/26 ,  H05K1/0231 ,  H05K1/053 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2201/0191 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/09063 ,  H05K2201/10522 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/0369 ,  H05K2203/0723

Abstract: A capacitor and a circuit board having the same are provided. The capacitor includes a substrate, an oxide layer, a second electrode, an insulating layer, a plurality of conductive sheets and a plurality of vias. The substrate includes a first electrode and a porous structure. The porous structure in at least of two distribution regions has different depths. An oxide layer is disposed on the surface of the porous structure. The second electrode is disposed on the oxide layer and includes a conductive polymer material. The insulating layer disposed on the second electrode has a third and a fourth surfaces. The fourth surface of the insulating layer is connected with the second electrode. The conductive sheets are disposed on the first surface of the first electrode and the third surface of the insulating layer and electrically connected with the corresponding vias according to different polarities.

Abstract translation: 提供电容器和具有该电容器的电路板。 电容器包括衬底，氧化物层，第二电极，绝缘层，多个导电片和多个通孔。 基板包括第一电极和多孔结构。 至少两个分布区域中的多孔结构具有不同的深度。 氧化物层设置在多孔结构的表面上。 第二电极设置在氧化物层上并且包括导电聚合物材料。 设置在第二电极上的绝缘层具有第三和第四表面。 绝缘层的第四表面与第二电极连接。 导电片设置在第一电极的第一表面和绝缘层的第三表面上，并根据不同的极性与相应的通孔电连接。

公开(公告)号：US08513795B2

公开(公告)日：2013-08-20

申请号：US13337346

申请日：2011-12-27

Applicant: Ping-Lin Yang ,  Sa-Lly Liu ,  Chien-Min Lin

Inventor： Ping-Lin Yang ,  Sa-Lly Liu ,  Chien-Min Lin

IPC: H01L23/02

CPC classification number: H01L24/82 ,  H01L23/3677 ,  H01L23/48 ,  H01L23/5227 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/05647 ,  H01L2924/00014

Abstract: A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.

Abstract translation: 封装包括具有至少两个堆叠管芯的管芯堆叠，用于彼此进行非接触式通信。 堆叠的模具中的至少一个具有连接到其主面的衬底。 衬底在衬底中或衬底上具有多个导电迹线，用于向裸片传导功率并且用于从模具传导热量。 至少一个导电柱与基板的至少第一边缘上的导电迹线中的至少一个接合，用于将功率传导到至少一个管芯并且用于从至少一个管芯传导热量。

公开(公告)号：US08497001B2

公开(公告)日：2013-07-30

申请号：US13667743

申请日：2012-11-02

Applicant: Cho-Ying Lin ,  Ding-Jen Chen ,  Hui-Min Lin ,  Yang-Ching Lin

Inventor： Cho-Ying Lin ,  Ding-Jen Chen ,  Hui-Min Lin ,  Yang-Ching Lin

IPC: G02F1/1337 ,  C09K19/38

CPC classification number: G02F1/133703 ,  Y10T428/10 ,  Y10T428/1005 ,  Y10T428/1059

Abstract: A first substrate and a second substrate are provided. An alignment process is performed on a surface of the first substrate and a surface of the second substrate respectively. A liquid crystal mixture is prepared, where the liquid crystal mixture includes a liquid crystal molecule and a liquid crystal monomer having a functional group of diacrylates, and the liquid crystal monomer having the functional group of diacrylates occupies 0.01-2 wt % of the liquid crystal mixture. The first substrate and the second substrate are assembled, and the liquid crystal mixture is filled therebetween. A polymerization curing process is performed such that the liquid crystal monomer having the functional group of diacrylates is polymerized to respectively form a liquid crystal polymer film on the aligned surfaces of the first and second substrates. The method enhances anchoring energy and reduces problems of V-T shift, surface gliding, and residual image.

Abstract translation: 提供第一基板和第二基板。 分别在第一基板的表面和第二基板的表面上进行对准处理。 制备液晶混合物，其中液晶混合物包括液晶分子和具有二丙烯酸酯官能团的液晶单体，具有二丙烯酸酯官能团的液晶单体占液晶的0.01-2重量％ 混合物。 组装第一基板和第二基板，并且在其间填充液晶混合物。 进行聚合固化过程，使得具有二丙烯酸酯官能团的液晶单体聚合，以在第一和第二基板的对准表面上分别形成液晶聚合物膜。 该方法增强了锚固能量，减少了V-T位移，表面滑动和残差图像的问题。

公开(公告)号：US20130161811A1

公开(公告)日：2013-06-27

申请号：US13337346

申请日：2011-12-27

Applicant: Ping-Lin YANG ,  Sa-Lly LIU ,  Chien-Min LIN

Inventor： Ping-Lin YANG ,  Sa-Lly LIU ,  Chien-Min LIN

IPC: H01L23/498 ,  H01L21/50

CPC classification number: H01L24/82 ,  H01L23/3677 ,  H01L23/48 ,  H01L23/5227 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/05647 ,  H01L2924/00014

Abstract: A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.

Abstract translation: 封装包括具有至少两个堆叠管芯的管芯堆叠，用于彼此进行非接触式通信。 堆叠的模具中的至少一个具有连接到其主面的衬底。 衬底在衬底中或衬底上具有多个导电迹线，用于向裸片传导功率并且用于从模具传导热量。 至少一个导电柱与基板的至少第一边缘上的导电迹线中的至少一个接合，用于将功率传导到至少一个管芯并且用于从至少一个管芯传导热量。

公开(公告)号：US20130142229A1

公开(公告)日：2013-06-06

申请号：US13691839

申请日：2012-12-02

Applicant: Shih-Min Lin

Inventor： Shih-Min Lin

IPC: H04B1/44

CPC classification number: H04B1/44 ,  H04L25/0272 ,  H04L25/0278

Abstract: A high-definition multimedia interface (HDMI) data transceiving apparatus is disclosed. The HDMI data transceiving apparatus includes a data receiver and a data transmitter. The data transmitter includes a first impedance-providing device and a second impedance-providing device. The data transmitter has a first data transmission terminal and a second data transmission terminal. The first data transmission terminal and the second data transmission terminal are coupled to the data receiver through a first transmission line and a second transmission line, respectively. The data transmitter respectively transmits first data and second data to the data receiver. The first impedance-providing device and the second impedance-providing device absorb a reflected wave generated by the HDMI data transceiving apparatus when the first data and the second data are transmitted.

Abstract translation: 公开了一种高清多媒体接口（HDMI）数据收发装置。 HDMI数据收发装置包括数据接收器和数据发送器。 数据发射机包括第一阻抗提供装置和第二阻抗提供装置。 数据发射机具有第一数据传输终端和第二数据传输终端。 第一数据传输终端和第二数据传输终端分别通过第一传输线和第二传输线耦合到数据接收机。 数据发送器分别向数据接收机发送第一数据和第二数据。 当发送第一数据和第二数据时，第一阻抗提供装置和第二阻抗提供装置吸收由HDMI数据收发装置产生的反射波。

公开(公告)号：US20130126247A1

公开(公告)日：2013-05-23

申请号：US13740197

申请日：2013-01-12

Applicant: Ying Xin Yang ,  Lian Chen ,  Min Lin ,  Zhu Pei ,  Hai Tao Ren

Inventor： Ying Xin Yang ,  Lian Chen ,  Min Lin ,  Zhu Pei ,  Hai Tao Ren

IPC: E21B10/08 ,  E21B10/50

CPC classification number: E21B10/16 ,  E21B10/14 ,  E21B10/20 ,  E21B10/50

Abstract: A composite drill bit with a bit body configured at its upper extend for connection into a drillstring, comprising: a bit body (1) with at least one bit leg (3), at least one scraping-wheel (2) set with a cutter-row (4), and a set of cutters fixed thereon. The scraping-wheel (2) is mounted for rotation on the corresponding bit leg (3) with a large angular deflection α in the range of 20°≦|α|≦90°. The cutters on the scraping-wheel break rock by means of successive scraping, forming a cross-cutting area on the bottomhole accompanied by the cutters on the fixed cutting unit, thus achieving high rock-breaking efficiency, even wear, high cooling performance, and a longer service life for the cutters, bearings and the drill bit.

Abstract translation: 一种复合钻头，其具有在其上部延伸部分上配置的钻头主体，用于连接到钻柱中，包括：具有至少一个钻头刀头（3）的钻头体（1），至少一个刮刀轮（2） （4）和固定在其上的一组刀具。 刮刀轮（2）以20°@ |α| @ 90°的范围内的大的角度偏转α安装在相应的钻头腿（3）上旋转。 刮刀上的切割机通过连续刮削破碎岩石，在固定切割单元上的切割机上形成了在井底上的交叉切割区域，从而实现了高的破碎效率，甚至磨损，高冷却性能，以及 刀具，轴承和钻头的使用寿命更长。

公开(公告)号：US20130099082A1

公开(公告)日：2013-04-25

申请号：US13310810

申请日：2011-12-05

Applicant: CHIH-MIN LIN ,  WEN-CHEN WANG

Inventor： CHIH-MIN LIN ,  WEN-CHEN WANG

IPC: H05K7/00

CPC classification number: G11B33/128 ,  H05K7/1425

Abstract: A mounting apparatus for mounting a number of data storage devices includes a supporting member, a connecting plate, and a number of partitioning members perpendicularly connected between the supporting member and the connecting plate. Each data storage device is sandwiched between two neighboring partitioning members. The supporting member defines a number of first latching holes. The connecting plate defines a number of second latching holes. Each partitioning member includes a partitioning plate, a first hook extending from a first end of the partitioning member, and a second hook extending out from a second end of the partitioning member. The first hook is detachably latched in the corresponding first latching hole. The second hook is detachably latched in the corresponding second latching hole.

Abstract translation: 用于安装多个数据存储装置的安装装置包括支撑构件，连接板和垂直连接在支撑构件和连接板之间的多个分隔构件。 每个数据存储装置夹在两个相邻的分隔构件之间。 支撑构件限定多个第一闭锁孔。 连接板限定多个第二锁定孔。 每个分隔构件包括分隔板，从分隔构件的第一端延伸的第一钩和从分隔构件的第二端延伸出的第二钩。 第一钩可拆卸地锁定在相应的第一锁定孔中。 第二钩可拆卸地闩锁在相应的第二闩锁孔中。

公开(公告)号：US08415795B2

公开(公告)日：2013-04-09

申请号：US13089289

申请日：2011-04-18

Applicant: Yu-Min Lin ,  Chau-Jie Zhan ,  Su-Tsai Lu

Inventor： Yu-Min Lin ,  Chau-Jie Zhan ,  Su-Tsai Lu

IPC: H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/17 ,  H01L21/563 ,  H01L23/345 ,  H01L24/14 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/14131 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16507 ,  H01L2224/17505 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/81234 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/32145 ,  H01L2924/00012 ,  H01L2224/32225

Abstract: A semiconductor device and an assembling method thereof are provided. The semiconductor device includes a chip, a carrier, a plurality of first conductive elements and a plurality of second conductive elements. The chip has a plurality of first pads. The carrier has a plurality of second pads. The second pads correspond to the first pads. Each first conductive element is disposed between one of the first pads and one of the second pads. Each second conductive element is disposed between one of the first pads and one of the second pads. A volume ratio of intermetallic compound of the second conductive elements is greater than a volume ratio of intermetallic compound of the first conductive elements.

Abstract translation: 提供了一种半导体器件及其组装方法。 半导体器件包括芯片，载体，多个第一导电元件和多个第二导电元件。 芯片具有多个第一焊盘。 载体具有多个第二垫。 第二垫对应于第一垫。 每个第一导电元件设置在第一焊盘之一和第二焊盘中的一个之间。 每个第二导电元件设置在第一焊盘之一和第二焊盘中的一个之间。 第二导电元件的金属间化合物的体积比大于第一导电元件的金属间化合物的体积比。

公开(公告)号：US20120326238A1

公开(公告)日：2012-12-27

申请号：US13167738

申请日：2011-06-24

Applicant: Chin-Cheng Chien ,  Tzung-Ying Lee ,  Tsuo-Wen Lu ,  Shu-Yen Chan ,  Jei-Ming Chen ,  Yu-Min Lin ,  Chun-Wei Hsu

Inventor： Chin-Cheng Chien ,  Tzung-Ying Lee ,  Tsuo-Wen Lu ,  Shu-Yen Chan ,  Jei-Ming Chen ,  Yu-Min Lin ,  Chun-Wei Hsu

IPC: H01L27/092 ,  H01L21/28 ,  H01L21/8238

CPC classification number: H01L29/7833 ,  H01L21/823842 ,  H01L21/823857 ,  H01L29/165 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/66636 ,  H01L29/7843 ,  H01L29/7848

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region and a second region thereon; forming a high-k dielectric layer, a barrier layer, and a first metal layer on the substrate; removing the first metal layer of the second region; forming a polysilicon layer to cover the first metal layer of the first region and the barrier layer of the second region; patterning the polysilicon layer, the first metal layer, the barrier layer, and the high-k dielectric layer to form a first gate structure and a second gate structure in the first region and the second region; and forming a source/drain in the substrate adjacent to two sides of the first gate structure and the second gate structure.

Abstract translation: 一种制造半导体器件的方法包括以下步骤：提供其上具有第一区域和第二区域的衬底; 在基板上形成高k电介质层，阻挡层和第一金属层; 去除第二区域的第一金属层; 形成多晶硅层以覆盖第一区域的第一金属层和第二区域的阻挡层; 图案化多晶硅层，第一金属层，势垒层和高k电介质层，以在第一区域和第二区域中形成第一栅极结构和第二栅极结构; 以及在所述衬底中邻近所述第一栅极结构和所述第二栅极结构的两侧形成源极/漏极。