Abstract:
A charged particle optic apparatus for improvement in resolution of an electrostatic, multi-beam column is disclosed. The charged particle optic apparatus includes an electrostatic lens array having a first plurality of apertures and a first magnetic pole piece disposed proximate the electrostatic lens array. The first magnetic pole piece includes a second plurality of apertures. The charged particle optic apparatus also includes a second magnetic pole piece disposed proximate the electrostatic lens array such that the electrostatic lens array is between the first magnetic pole piece and the second magnetic pole piece. The second magnetic pole piece includes a third plurality of apertures. The first, second and third pluralities of apertures are aligned with each other. The charged particle optic apparatus may be implemented in a charged particle beam system.
Abstract:
Disclosed is a method of inspecting a sample. The method includes moving to a first field associated with a first group of test structures. The first group of test structures are partially within the first field. The method further includes scanning the first field to determine whether there are any defects present within the first group of test structures. When it is determined that there are defects within the first group of test structures, the method further includes repeatedly stepping to areas and scanning such areas so as to determine a specific defect location within the first group of test structures. A suitable test structure for performing this method is also disclosed.
Abstract:
Disclosed is, a method for detecting electrical defects on test structures of a semiconductor die. The semiconductor die includes a plurality of electrically-isolated test structures and a plurality of non-electrically-isolated test structures. Voltages are established for the plurality of electrically-isolated test structures. These voltages are different than the voltages of the plurality of non-electrically-isolated test structures. A region of the semiconductor die is continuously inspected in a first direction thereby obtaining voltage contrast data indicative of whether there are defective test structures. The voltage contrast data is analyzed to determine whether there are one or more defective test structures.
Abstract:
A system and method for controlling electron exposure on image specimens by adjusting a raster scan area in-between scan frame cycles. A small, zoomed-in, scan area and the surrounding area are flooded with positive charge for a number of frame cycles between scan frames to reduce the voltage differential between the scan area and surrounding area, thereby reducing the positive charge buildup which tends to obscure small features in scanned images. The peak current into a pixel element on the specimen is reduced by scanning the beam with a line period that is very short compared to regular video. Frames of image data may further be acquired non-sequentially, in arbitrarily programmable patterns. Alternatively, an inert gas can be injected into the scanning electron microscope at the point where the electron beam impinges the specimen to neutralize a charge build-up on the specimen by the ionization of the inert gas by the electron beam.
Abstract:
Methods and apparatus are disclosed for conditional acquisition of potential measurements in integrated circuits, with the aid of electron-beam probes. The conditional acquisition enables display of waveform images which permit diagnosis of the causes and/or origins of failure in circuits which fail intermittently. Data is acquired in the normal manner on each pass through the test pattern. At the end of each test pattern execution a pass/fail signal from the tester exercising the circuit is used to reject or accept the acquired data. In this fashion, it is possible to accumulate only that data which carries information about the failure of interest and to reject data which does not. Over several test pattern repetitions it is possible to display only that data which shows the failure. Engineers are thus able to efficiently diagnose intermittent failures without the need to change device operating parameters. In one form of the invention, (a) initially a first buffer is defined as a "good-data" buffer and a second buffer is defined as a "temporary-data" buffer; (b) the circuit is probed during application of a test vector pattern to acquire data; (c) the acquired data is summed with stored data from the "good-data" buffer, and the sum is stored in the "temporary-data" buffer; (d) a determination is made whether circuit has failed to operate as expected in response to the pattern and, if the circuit has failed to operate as expected, the second buffer is redefined as a "good-data" buffer and the first buffer is re-defined as a "temporary-data" buffer; and (e) steps (b)-(d) are repeated, such that the data stored in the "good-data" buffer represents failing operation of the circuit.
Abstract:
Disclosed are methods and apparatus for simultaneously flooding a sample (e.g., a semiconductor wafer) to control charge and inspecting the sample. The apparatus includes a charged particle beam generator arranged to generate a charged particle beam substantially towards a first portion of the sample and a flood gun for generating a second beam towards a second portion of the sample. The second beam is generated substantially simultaneously with the inspection beam. The apparatus further includes a detector arranged to detect charged particles originating from the sample portion. In a further implementation, the apparatus further includes an image generator for generating an image of the first portion of the sample from the detected particles. In one embodiment, the sample is a semiconductor wafer. In a method aspect, a first area of a sample is flooded with a flood beam to control charge on a surface of the sample. A second area of the sample is inspected with an inspection beam. The second area comprises at least a portion of the first area flooded by the flood beam. The inspection beam moves in tandem with the flood beam. In another aspect of the present invention, methods and apparatus are provided for controlling the charge buildup of an area of the sample by an electrode having a voltage applied to it and through which the flood beam and charged particles emitted from the area of the sample can pass.
Abstract:
Disclosed is a semiconductor die having a lower test structure formed in a lower metal layer of the semiconductor die. The lower conductive test structure has a first end and a second end. The first end is coupled to a predetermined voltage level. The semiconductor die also includes an insulating layer formed over the lower metal layer. The die further includes an upper test structure formed in an upper metal layer of the semiconductor die. The upper conductive test structure is coupled with the second end of the lower conductive test structure. The upper metal layer is formed over the insulating layer. In a specific implementation, the first end of the lower test structure is coupled to ground. In another embodiment, the semiconductor die also includes a substrate and a first via coupled between the first end of the lower test structure and the substrate. In yet another aspect, the lower test structure is an extended metal line, and the upper test structure is a voltage contrast element. Methods for inspecting and fabricating such semiconductor die are also disclosed.
Abstract:
A surface is probed with a pulsed electron beam and secondary electrons are detected to produce a detector signal. First portions of the detector signal are substantially dependent on the voltage of the surface being probed, while second portions of the detector signal are substantially independent of the voltage of the surface being probed. In general, the first and second portions of the detector signal include unwanted noise caused by low-level sampling due to beam leakage and/or by scintillator afterglow in the secondary-electron detector. The detector signal is sampled during the first signal portions and is sampled during the second signal portions. The sampled first signal portions are combined with the complement of the sampled second signal portions to produce a measured voltage signal representing voltage of the conductor. In a preferred sampling scheme, alternate electron-beam sampling pulses are held-off. A first gate samples the secondary-electron detector signal when sampling pulses are not held off. A second gate samples the secondary-electron detector signal when sampling pulses are held off, and these samples are inverted. The samples from the first gate are combined with the inverted samples from the second gate to substantially cancel unwanted background noise caused by beam leakage and/or scintillator afterglow after sufficient integration.