公开(公告)号：US09443714B2

公开(公告)日：2016-09-13

申请号：US13785903

申请日：2013-03-05

Applicant: APPLIED MATERIALS, INC.

Inventor： James Matthew Holden ,  Song-Moon Suh ,  Todd Egan ,  Kalyanjit Ghosh ,  Leon Volfovski ,  Michael R. Rice ,  Richard Giljum

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/67028 ,  B01D39/12 ,  B08B5/00 ,  B08B7/00 ,  H01L21/02076 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/67051

Abstract: A substrate cleaning apparatus may include a substrate support having a support surface to support a substrate to be cleaned, wherein the substrate support is rotatable about a central axis normal to the support surface; a first nozzle to provide a first cleaning gas to a region of the inner volume corresponding to the position of an edge of the substrate when the substrate is supported by the support surface of the substrate support; a first annular body disposed opposite and spaced apart from the support surface of the substrate support by a gap, the first annular body having a central opening defined by an inner wall shaped to provide a reducing size of the gap between the first annular body and the support surface in a radially outward direction; and a first gas inlet to provide a first gas to the central opening of the first annular body.

Abstract translation: 基板清洁装置可以包括具有支撑表面以支撑要清洁的基板的基板支撑件，其中基板支撑件可绕垂直于支撑表面的中心轴线旋转; 第一喷嘴，用于当所述基板由所述基板支撑件的支撑表面支撑时，将第一清洁气体提供到所述内部体积的与所述基板的边缘的位置相对应的区域; 第一环形体，其通过间隙与衬底支撑件的支撑表面相对设置并间隔开，第一环形体具有由内壁限定的中心开口，内壁被成形为提供第一环形体和第二环形体之间的间隙的减小尺寸 支撑表面沿径向向外的方向; 以及第一气体入口，用于向第一环形体的中心开口提供第一气体。

公开(公告)号：US20150357228A1

公开(公告)日：2015-12-10

申请号：US14299850

申请日：2014-06-09

Applicant: Applied Materials, Inc.

Inventor： Matthew Busche ,  Wendell Boyd, JR. ,  Vijay D. Parkhe ,  Michael R. Rice ,  Leon Volfovski

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68714 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67248

Abstract: Substrate temperature control apparatus including optical fiber temperature control are described. Substrate temperature control apparatus includes a base, a thermal contact member proximate to the base, and a plurality of optical fibers adapted to provide light-based heating extending laterally between the base and thermal contact member. Substrate temperature control systems and electronic device processing systems and methods including optical fiber temperature control are described, as are numerous other aspects.

Abstract translation: 描述了包括光纤温度控制的基板温度控制装置。 基板温度控制装置包括基座，靠近基座的热接触构件以及适于提供在基座和热接触构件之间横向延伸的基于光的加热的多个光纤。 与许多其他方面一样，描述了基板温度控制系统和包括光纤温度控制的电子设备处理系统和方法。

公开(公告)号：US12142503B2

公开(公告)日：2024-11-12

申请号：US18127278

申请日：2023-03-28

Applicant: Applied Materials, Inc.

Inventor： Nicholas Michael Kopec ,  Damon K. Cox ,  Leon Volfovski

IPC: B25J9/16 ,  G06T1/00 ,  H01L21/67 ,  H01L21/677

Abstract: A robotic object handling system comprises a robot arm, an image sensor, a first station, and a computing device. The computing device is to cause the robot arm to pick up an object on an end effector, cause the image sensor to generate sensor data of the object, determine at least one of (i) a rotational error of the object or (ii) a positional error of the object based on the sensor data, cause an adjustment to the robot arm to approximately remove at least one of the rotational error or the positional error, and cause the robot arm to place the object at the first station without at least one of the rotational error or the positional error.

公开(公告)号：US11823937B2

公开(公告)日：2023-11-21

申请号：US16990839

申请日：2020-08-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Nicholas Michael Bergantz ,  Andreas Schmid ,  Leon Volfovski ,  Sanggyum Kim ,  Damon Cox ,  Paul Wirth

IPC: H01L21/68 ,  B25J11/00 ,  H01L21/687 ,  H01L21/67 ,  B25J9/16

CPC classification number: H01L21/681 ,  B25J9/1692 ,  B25J11/0095 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67259 ,  H01L21/68707

Abstract: A calibration object is retrieved, by a first robot arm of a transfer chamber, from a processing chamber connected to the transfer chamber and placed in a load lock connected to the transfer chamber. The calibration object is retrieved from the load lock by a second robot arm of a factory interface connected to the load lock and placed at an aligner station housed in or connected to the factory interface. The calibration object has a first orientation at the aligner station. A difference is determined between the first orientation and an initial target orientation at the aligner station. A first characteristic error value associated with the processing chamber is determined based on the determined difference. The first characteristic error value is recorded in a storage medium. The aligner station is to use the first characteristic error value for alignment of objects to be placed in the processing chamber.

公开(公告)号：US20210020476A1

公开(公告)日：2021-01-21

申请号：US16923903

申请日：2020-07-08

Applicant: Applied Materials, Inc.

Inventor： Andrew Paul Harbert ,  Michael C. Kuchar ,  Nicholas Michael Bergantz ,  Leon Volfovski ,  Sivakumar Ramalingam ,  Karuppasamy Muthukamatchi ,  Douglas R. McAllister

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  H01L21/673

Abstract: A method includes receiving, by a first loadlock chamber of the loadlock system, a first object from a factory interface via a first opening. The first object is transferred into the first loadlock chamber via a first robot arm. The factory interface is at a first state. The first loadlock chamber is configured to receive different types of objects. The method further includes sealing a first loadlock door against the first opening to create a first sealed environment at the first state in the first loadlock chamber and causing the first sealed environment of the first loadlock chamber to be changed to a second state. The method further includes actuating a second loadlock door to provide a second opening between the first loadlock chamber and a transfer chamber. The first object is to be transferred from the first loadlock chamber to the transfer chamber via a second robot arm.

公开(公告)号：US20200373190A1

公开(公告)日：2020-11-26

申请号：US16417348

申请日：2019-05-20

Applicant: Applied Materials, Inc.

Inventor： Helder Lee ,  Nicholas Michael Kopec ,  Leon Volfovski ,  Douglas R. McAllister ,  Andreas Schmid ,  Jeffrey Hudgens ,  Yogananda Sarode Vishwanath ,  Steven Babayan

IPC: H01L21/687 ,  H01L21/673 ,  H01L21/68 ,  H01L21/677

Abstract: A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

公开(公告)号：US10217650B2

公开(公告)日：2019-02-26

申请号：US15264082

申请日：2016-09-13

Applicant: APPLIED MATERIALS, INC.

Inventor： James Matthew Holden ,  Song-Moon Suh ,  Todd Egan ,  Kalyanjit Ghosh ,  Leon Volfovski ,  Michael R. Rice ,  Richard Giljum

IPC: B08B7/00 ,  H01L21/67 ,  H01L21/02 ,  B01D39/12 ,  B08B5/00

Abstract: A substrate cleaning apparatus may include a substrate support having a support surface to support a substrate to be cleaned, wherein the substrate support is rotatable about a central axis normal to the support surface; a first nozzle to provide a first cleaning gas to a region of the inner volume corresponding to the position of an edge of the substrate when the substrate is supported by the support surface of the substrate support; a first annular body disposed opposite and spaced apart from the support surface of the substrate support by a gap, the first annular body having a central opening defined by an inner wall shaped to provide a reducing size of the gap between the first annular body and the support surface in a radially outward direction; and a first gas inlet to provide a first gas to the central opening of the first annular body.

公开(公告)号：US09698041B2

公开(公告)日：2017-07-04

申请号：US14299850

申请日：2014-06-09

Applicant: Applied Materials, Inc.

Inventor： Matthew Busche ,  Wendell Boyd, Jr. ,  Vijay D. Parkhe ,  Michael R. Rice ,  Leon Volfovski

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68714 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67248

Abstract: Substrate temperature control apparatus including optical fiber temperature control are described. Substrate temperature control apparatus includes a base, a thermal contact member proximate to the base, and a plurality of optical fibers adapted to provide light-based heating extending laterally between the base and thermal contact member. Substrate temperature control systems and electronic device processing systems and methods including optical fiber temperature control are described, as are numerous other aspects.

公开(公告)号：US09538583B2

公开(公告)日：2017-01-03

申请号：US13742639

申请日：2013-01-16

Applicant: APPLIED MATERIALS, INC.

Inventor： Leon Volfovski ,  Mayur G. Kulkarni ,  Alex Minkovich ,  Michael R. Rice

IPC: H05B3/68 ,  H05B3/26 ,  H01L21/67 ,  H05B1/02

CPC classification number: H05B3/26 ,  H01L21/67103 ,  H05B1/0233

Abstract: Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first planar surface of the first member, a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present, a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member, and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements.

Abstract translation: 本文提供了具有加热器的基板支撑件的实施例。 在一些实施例中，衬底支撑件可以包括第一构件，用于当存在于第一构件的第一平面表面上方时将热量分配到衬底;第二构件，设置在第一构件下方，第二构件包括多个电阻加热元件， 其中所述多个电阻加热元件在存在时向所述第一构件提供局部温度补偿以加热所述基板，设置在所述第二构件下方的第三构件，所述第三构件包括一个或多个基座加热区以向所述第一构件提供基座温度曲线 以及设置在所述第三构件下方的第四构件，所述第四构件包括耦合到每个所述电阻加热元件的第一组电导体。