公开(公告)号：US20240047263A1

公开(公告)日：2024-02-08

申请号：US18492488

申请日：2023-10-23

Applicant: Applied Materials, Inc.

Inventor： Paul Wirth ,  Behzad Taheri

IPC: H01L21/687 ,  F15B9/03

CPC classification number: H01L21/68742 ,  F15B9/03 ,  F15B11/076

Abstract: A lift apparatus includes a lift assembly and a servo-control system. The lift assembly includes at least one pneumatic actuator including a movable member to provide a load to transfer a substrate between a support and a transfer plane. The lift assembly further includes at least one proportional pneumatic valve to control fluid flow between the actuator and a pressurized fluid supply or a vent, a plurality of pressure sensors each to measure pressure in a respective supply line to the actuator, and at least one position sensor to measure a position of the movable member. The servo-control system includes a controller to determine an output force based on a commanded force and an estimated force, generate a control signal based on the output force, and apply the control signal to the proportional valve to move the movable member.

公开(公告)号：US20230028135A1

公开(公告)日：2023-01-26

申请号：US17954227

申请日：2022-09-27

Applicant: Applied Materials, Inc.

Inventor： Paul Wirth ,  Behzad Taheri

IPC: H01L21/687 ,  F15B9/03

Abstract: Disclosed herein are embodiments of a servo-control system comprising at least one pneumatic actuator comprising a movable member, at least one proportional pneumatic valve configured to control fluid flow between the at least one pneumatic actuator and a pressurized fluid supply or a vent, a plurality of pressure sensors each configured to independently measure pressure in a respective supply line to the at least one pneumatic actuator, at least one position sensor configured to measure a position of the moveable member, and a controller. The controller is configured to determine a control signal based at least in part on pressure measurements of the plurality of pressure sensors and a position measurement of the at least one position sensor, and apply the control signal to at least one proportional pneumatic valve to move the movable member to a target position.

公开(公告)号：US20210028040A1

公开(公告)日：2021-01-28

申请号：US16519535

申请日：2019-07-23

Applicant: Applied Materials, Inc.

Inventor： Paul Wirth

IPC: H01L21/677 ,  H01L21/687

Abstract: Disclosed is a device fabrication system comprising a wafer input loadlock, a wafer output loadlock, one or more wafer processing regions, and one or more walking beams for transporting one or more wafers from the wafer input loadlock through the wafer processing regions, and onto the wafer output loadlock. Also disclosed are methods for transporting one or more wafers through the device fabrication system described herein.

公开(公告)号：US20180298513A1

公开(公告)日：2018-10-18

申请号：US16013686

申请日：2018-06-20

Applicant: APPLIED Materials, Inc.

Inventor： Robert B. Moore ,  David Silvetti ,  Paul Wirth ,  Randy Harris

IPC: C25D17/06 ,  C25D17/00 ,  H01L21/768 ,  H01L21/687 ,  C25D7/12

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

公开(公告)号：US09399827B2

公开(公告)日：2016-07-26

申请号：US14259492

申请日：2014-04-23

Applicant: APPLIED Materials, Inc.

Inventor： Robert B. Moore ,  David Silvetti ,  Paul Wirth ,  Randy Harris

IPC: C25D17/06 ,  C25D17/00

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/005 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/76879

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract translation: 在用于电镀半导体晶片和类似衬底的处理系统中，电镀处理器的接触环从处理器的转子移除，并被先前去绝缘的接触环替代。 这允许接触环在系统的环形服务模块中脱落，同时处理器继续工作。 晶圆生产量提高。 接触环可以附接到卡盘，用于使处理器和环形服务模块之间的接触环移动，卡盘可快速地附接和释放到转子上。

公开(公告)号：US11823937B2

公开(公告)日：2023-11-21

申请号：US16990839

申请日：2020-08-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Nicholas Michael Bergantz ,  Andreas Schmid ,  Leon Volfovski ,  Sanggyum Kim ,  Damon Cox ,  Paul Wirth

IPC: H01L21/68 ,  B25J11/00 ,  H01L21/687 ,  H01L21/67 ,  B25J9/16

CPC classification number: H01L21/681 ,  B25J9/1692 ,  B25J11/0095 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67259 ,  H01L21/68707

Abstract: A calibration object is retrieved, by a first robot arm of a transfer chamber, from a processing chamber connected to the transfer chamber and placed in a load lock connected to the transfer chamber. The calibration object is retrieved from the load lock by a second robot arm of a factory interface connected to the load lock and placed at an aligner station housed in or connected to the factory interface. The calibration object has a first orientation at the aligner station. A difference is determined between the first orientation and an initial target orientation at the aligner station. A first characteristic error value associated with the processing chamber is determined based on the determined difference. The first characteristic error value is recorded in a storage medium. The aligner station is to use the first characteristic error value for alignment of objects to be placed in the processing chamber.

公开(公告)号：US20160298255A1

公开(公告)日：2016-10-13

申请号：US15190370

申请日：2016-06-23

Applicant: APPLIED Materials, Inc.

Inventor： Robert B. Moore ,  David Silvetti ,  Paul Wirth ,  Randy Harris

IPC: C25D17/06 ,  H01L21/768 ,  H01L21/687 ,  C25D17/00 ,  C25D7/12

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/005 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/76879

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract translation: 在用于电镀半导体晶片和类似衬底的处理系统中，电镀处理器的接触环从处理器的转子移除，并被先前去绝缘的接触环替代。 这允许接触环在系统的环形服务模块中脱落，同时处理器继续工作。 晶圆生产量提高。 接触环可以附接到卡盘，用于使处理器和环形服务模块之间的接触环移动，卡盘可快速地附接和释放到转子上。

公开(公告)号：US11798833B2

公开(公告)日：2023-10-24

申请号：US16801622

申请日：2020-02-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Paul Wirth ,  Behzad Taheri

IPC: H01L21/687 ,  F15B9/03 ,  F15B11/076 ,  F15B9/14

CPC classification number: H01L21/68742 ,  F15B9/03 ,  F15B9/14 ,  F15B11/076

Abstract: Disclosed herein are embodiments of a lift apparatus and systems containing a support and at least one lift apparatus for moving a substrate between the support and a transfer plane, using a servo-control system. Further disclosed herein are methods for servo control of a lift apparatus and lifting a substrate off of a support or lowering the substrate onto the support.

公开(公告)号：US20210265194A1

公开(公告)日：2021-08-26

申请号：US16801622

申请日：2020-02-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Paul Wirth ,  Behzad Taheri

IPC: H01L21/687 ,  F15B9/03

Abstract: Disclosed herein are embodiments of a lift apparatus and systems containing a support and at least one lift apparatus for moving a substrate between the support and a transfer plane, using a servo-control system. Further disclosed herein are methods for servo control of a lift apparatus and lifting a substrate off of a support or lowering the substrate onto the support.

公开(公告)号：US20210057256A1

公开(公告)日：2021-02-25

申请号：US16990839

申请日：2020-08-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Nicholas Michael Bergantz ,  Andreas Schmid ,  Leon Volfovski ,  Sanggyum Kim ,  Damon Cox ,  Paul Wirth

IPC: H01L21/68 ,  G01B11/27 ,  B25J11/00 ,  H01L21/67 ,  H01L21/687

Abstract: A method for calibrating an aligner station of an electronics processing system is provided. A calibration is retrieved, by a first robot arm of a transfer chamber, from a processing chamber connected to the transfer chamber. The calibration object has a target orientation in the processing chamber. The calibration is placed, by the first robot art, in a load lock connected to the transfer chamber. The calibration is retrieved from the load lock by a second robot arm of a factory interface connected to the load lock. The calibration object is placed, by the second robot arm, at an aligner station housed in or connected to the factory interface. The calibration object has a first orientation at the aligner station. A difference is determined between the first orientation at the aligner station and an initial target orientation at the aligner station. The initial target orientation at the aligner station is associated with the target orientation in the processing chamber. A first characteristic error value associated with the processing chamber is determined based on the difference between the first orientation and the initial target orientation. The first characteristic error value is recorded in a storage medium. The aligner station is to use the first characteristic error value for alignment of objects to be placed in the processing chamber.