COMPONENT COUPLED TO HEAT DISSIPATION UNIT
    21.
    发明申请

    公开(公告)号:US20170245395A1

    公开(公告)日:2017-08-24

    申请号:US15052851

    申请日:2016-02-24

    CPC classification number: H01L23/4006 H01L23/34 H01L23/3672

    Abstract: A component coupled to a heat dissipation unit, allowing a screwing element to be pivotally coupled to a heat dissipation unit, includes a body, a stop portion, a first inner engagement portion, a second inner engagement portion and a first outer engagement portion. The body has a first part and a second part and forms therein a through hole which extends axially. The stop portion is circumferentially disposed at the rim of the first or second part. The first inner engagement portion has checking plates and corresponds in position to the stop portion. The second inner engagement portion has stop blocks disposed at the first or second part. The first outer engagement portion is disposed at the rim of the body and opposite the stop portion. The screwing element is fixed to the heat dissipation unit temporarily but firmly, thereby preventing disintegration and disconnection during transport.

    Heat transfer component reinforcement structure

    公开(公告)号:US12111113B2

    公开(公告)日:2024-10-08

    申请号:US16666426

    申请日:2019-10-29

    CPC classification number: F28D15/04 H05K7/20218 H05K7/20336 H05K7/2039

    Abstract: A heat transfer component reinforcement structure includes a main body. The main body has a pair of first lateral sides and a pair of second lateral sides and a reinforcement member. The reinforcement member is correspondingly externally connected with the main body in at least one manner selected from the group consisting of that the reinforcement members are engaged, latched and connected with the first lateral sides and the second lateral sides of the main body and the reinforcement members are engaged, latched and connected with the junctions between the first and second lateral sides in four corners.

    THERMAL MODULE STRUCTURE
    23.
    发明公开

    公开(公告)号:US20230243598A1

    公开(公告)日:2023-08-03

    申请号:US18064294

    申请日:2022-12-12

    CPC classification number: F28D15/0275

    Abstract: A thermal module structure includes an aluminum base having a heat pipe receiving groove formed on one side thereof; a heat dissipation unit including a plurality of radiation fin assemblies or heat sinks and being provided with a first heat pipe receiving section; a plurality of heat pipes made of a copper material and respectively having a heat absorption section and a horizontally extended condensation section; and a copper embedding layer provided on surfaces of the heat pipe receiving groove and the first heat pipe receiving section. The aluminum base and the heat dissipation unit are horizontally parallelly arranged. The heat absorption sections are fitted in the heat pipe receiving groove, and the condensation sections are extended through the first heat pipe receiving section. With the copper embedding layer, the aluminum base and the heat dissipation unit can be directly welded to the heat pipes.

    HEAT SINK STRUCTURE
    24.
    发明申请

    公开(公告)号:US20220346266A1

    公开(公告)日:2022-10-27

    申请号:US17242230

    申请日:2021-04-27

    Abstract: A heat sink structure includes a base seat and at least one heat dissipation unit. The base seat has a first face and a second face. At least one extension column extends from the second face of the base seat. The heat dissipation unit is disposed above the base seat and spaced from the base seat by a gap. The extension column serves to restrict or secure the heat dissipation unit in horizontal and vertical directions. The heat dissipation unit with different structures provides multiple heat dissipation features to enhance the entire heat dissipation performance.

    HEAT TRANSFER COMPONENT REINFORCEMENT STRUCTURE

    公开(公告)号:US20210123687A1

    公开(公告)日:2021-04-29

    申请号:US16666426

    申请日:2019-10-29

    Abstract: A heat transfer component reinforcement structure includes a main body. The main body has a pair of first lateral sides and a pair of second lateral sides and a reinforcement member. The reinforcement member is correspondingly externally connected with the main body in at least one manner selected from the group consisting of that the reinforcement members are engaged, latched and connected with the first lateral sides and the second lateral sides of the main body and the reinforcement members are engaged, latched and connected with the junctions between the first and second lateral sides in four corners. The reinforcement member is connected with the main body to enhance the structural strength of the main body.

    Thermal module assembling structure

    公开(公告)号:US10021813B2

    公开(公告)日:2018-07-10

    申请号:US14882387

    申请日:2015-10-13

    CPC classification number: H05K7/20418 H01L23/4093

    Abstract: A thermal module assembling structure includes a heat sink, at least one leaf spring, at least one holding member and a shaft rod. The heat sink has a base seat and multiple radiating fins disposed on the base seat. At least one perforation is formed on each of two opposite sides of the base seat. The heat sink is correspondingly assembled on the leaf spring. At least one engagement post is disposed on the leaf spring corresponding to the perforation. The holding member is slidably capped on the engagement post and has a first end and a second end. The second end is formed with a socket having an internal receiving space in which a raised section is formed. The engagement post is inlaid in the receiving space. The shaft rod passes through the heat sink. Two ends of the shaft rod are respectively connected with the engagement posts.

    HEAT DISSIPATION DEVICE
    27.
    发明申请

    公开(公告)号:US20170082377A1

    公开(公告)日:2017-03-23

    申请号:US14857779

    申请日:2015-09-17

    Abstract: A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.

    HEAT DISSIPATION DEVICE
    28.
    发明申请
    HEAT DISSIPATION DEVICE 有权
    散热装置

    公开(公告)号:US20160150672A1

    公开(公告)日:2016-05-26

    申请号:US14548295

    申请日:2014-11-20

    Inventor: Yuan-Yi Lin

    Abstract: A heat dissipation device includes a heat dissipation member, a heat transfer member, and a reinforcing member. The heat transfer member has one side attached to the heat dissipation member, and two opposite lateral edges thereof are respectively provided with at least one connection portion and at least one through hole. The reinforcing member is connected to the other side of the heat transfer member, and two opposite lateral edges thereof are respectively formed with at least one mating connection portion for correspondingly connecting to the connection portion. The reinforcing member is provided at a central portion with an opening. With these arrangements, the heat transfer member can bear a larger locking force when the heat dissipation member is locked thereto, and is also prevented from deformation.

    Abstract translation: 散热装置包括散热构件,传热构件和加强构件。 传热构件具有一个附接到散热构件的一侧,并且其两个相对的横向边缘分别设置有至少一个连接部分和至少一个通孔。 加强构件连接到传热构件的另一侧,并且其两个相对的侧边缘分别形成有至少一个配合连接部分,用于相应地连接到连接部分。 加强构件设置在具有开口的中央部分。 通过这些布置,当散热构件被锁定时,传热构件可承受较大的锁定力,并且也防止变形。

    ASSEMBLING STRUCTURE OF HEAT DISSIPATION DEVICE
    29.
    发明申请
    ASSEMBLING STRUCTURE OF HEAT DISSIPATION DEVICE 有权
    组装散热装置的结构

    公开(公告)号:US20140353008A1

    公开(公告)日:2014-12-04

    申请号:US13904000

    申请日:2013-05-28

    Inventor: Yuan-Yi Lin

    Abstract: An assembling structure of heat dissipation device is applied to a circuit board. A heat generation unit is disposed on one side of the circuit board. The assembling structure of the heat dissipation device includes a heat dissipation unit, at least one latch member and at least one retainer member. The heat dissipation unit is attached to one side of the heat generation unit, which side is distal from the circuit board. At least one latch section outward extends from an edge of the heat dissipation unit. The latch member is fixedly disposed on the circuit board and formed with at least one opening and at least one perforation. The latch section is correspondingly latched in the opening. An elastic member is fitted on the retainer member. The retainer member correspondingly passes through the perforation to fix the latch member on the circuit board.

    Abstract translation: 将散热装置的组装结构应用于电路板。 发电单元设置在电路板的一侧。 散热装置的组装结构包括散热单元,至少一个闩锁构件和至少一个保持构件。 散热单元安装在发热单元的一侧,该侧远离电路板。 从散热单元的边缘向外延伸的至少一个闩锁部分。 闩锁构件固定地布置在电路板上并形成有至少一个开口和至少一个穿孔。 闩锁部分相应地锁定在开口中。 弹性构件安装在保持构件上。 保持构件相应地穿过穿孔,以将闩锁构件固定在电路板上。

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