公开(公告)号：USD956004S1

公开(公告)日：2022-06-28

申请号：US29752538

申请日：2020-09-28

Applicant: Auras Technology Co., Ltd.

Designer： Jen-Hao Lin ,  Tian-Li Ye ,  Chien-Yu Chen ,  Chien-An Chen

公开(公告)号：US20210127526A1

公开(公告)日：2021-04-29

申请号：US17026469

申请日：2020-09-21

Applicant: AURAS TECHNOLOGY CO., LTD.

Inventor： Chien-An Chen ,  Chien-Yu Chen

IPC: H05K7/20

Abstract: A cold plate is provided and includes a casing, a guiding baffle, a base, a first inlet passage, an outlet passage and a pump. The guiding baffle is disposed in the casing and defines a fluid storage chamber together with the casing. The fluid storage chamber is filled with a working medium. The guiding baffle includes a communication opening. The base, the casing and guiding baffle together define a working space. The working medium flows into the working space through the communication opening, and the base is used for absorbing thermal energy and transfers the thermal energy to the working medium. The first inlet passage communicates with the fluid storage chamber and allows the cooled working medium to flow into the fluid storage chamber. The outlet passage communicates with the working space to allow the heated working medium to be discharged from the working space.

公开(公告)号：US10785892B1

公开(公告)日：2020-09-22

申请号：US16516309

申请日：2019-07-19

Applicant: AURAS Technology Co., Ltd.

Inventor： Chien-An Chen ,  Chien-Yu Chen ,  Mu-Shu Fan ,  Shih-Chieh Kao ,  Che-Chia Chang

IPC: H05K7/20 ,  G06F1/20

Abstract: A heat dissipation system and a coolant distribution module for plural electronic components of an electronic computing device are provided. The heat dissipation system includes plural water-cooling heads, a heat dissipation device and the coolant distribution module. When a fluid medium flows through the heat dissipation device, the heat dissipation device exchanges heat with the fluid medium. The coolant distribution module is connected between the plural water-cooling heads and the heat dissipation device. The coolant distribution module includes a main body and a power module. The module main body includes a cooled fluid chamber. The cooled fluid chamber includes plural first outlets corresponding to the plural water-cooling heads. The power module is installed in the module main body. The power module drives the fluid medium to be outputted from the plural first outlets. Consequently, the fluid medium is transferred through a circulating loop.

公开(公告)号：US10152096B1

公开(公告)日：2018-12-11

申请号：US15871177

申请日：2018-01-15

Applicant: AURAS Technology Co., Ltd.

Inventor： Chien-An Chen ,  Mu-Shu Fan ,  Chien-Yu Chen

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/18 ,  H05K7/14 ,  G11B33/02

Abstract: A cooling liquid distribution device includes a storage tank, a liquid level detector and a liquid level displaying structure. The storage tank includes a first chamber for storing a cooling liquid. When a liquid level of the cooling liquid in the first chamber is detected by the liquid level detector, a liquid level detection result is generated. The liquid level displaying structure includes a second chamber, which is in fluid communication with the first chamber. Consequently, a liquid level of the cooling liquid in the second chamber is equal to the liquid level of the cooling liquid in the first chamber. The liquid level displaying structure is optically transmissible, and thus the liquid level of the cooling liquid in the second chamber is visible through the liquid level displaying structure. The storage amount of the cooling liquid can be realized by the user more easily.

公开(公告)号：US11723174B2

公开(公告)日：2023-08-08

申请号：US17462326

申请日：2021-08-31

Applicant: Auras Technology Co., Ltd.

Inventor： Chien-Yu Chen ,  Tian-Li Ye ,  Jen-Hao Lin

IPC: H05K7/20 ,  B23K31/02 ,  F28D15/02 ,  F28D15/04 ,  F28F9/18 ,  B23K101/14 ,  G06F1/20

CPC classification number: H05K7/20272 ,  B23K31/02 ,  F28D15/0233 ,  F28D15/046 ,  F28F9/18 ,  H05K7/2039 ,  H05K7/20263 ,  H05K7/20336 ,  B23K2101/14 ,  F28F2230/00 ,  F28F2245/00 ,  F28F2275/062 ,  G06F1/20

Abstract: A liquid cooling head manufacturing method includes the following steps. First, a liquid channel main body is provided. Then, a heat dissipation bottom plate and a heat sink are disposed in different recessed indentations in the liquid channel main body. The heat dissipation bottom plate and the heat sink are welded in the liquid channel main body and a cover plate is sealed on the liquid channel main body.

公开(公告)号：US11523537B2

公开(公告)日：2022-12-06

申请号：US17114814

申请日：2020-12-08

Applicant: Auras Technology Co., Ltd.

Inventor： Chien-Yu Chen ,  Tian-Li Ye ,  Jen-Hao Lin ,  Chien-An Chen

IPC: H05K7/20

Abstract: A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.

公开(公告)号：US10674629B1

公开(公告)日：2020-06-02

申请号：US16394010

申请日：2019-04-25

Applicant: AURAS Technology Co., Ltd.

Inventor： Chien-An Chen ,  Chien-Yu Chen ,  Wei-Hao Chen

IPC: H05K7/20 ,  F25D11/00 ,  F25D21/04 ,  F25D21/14 ,  F25D23/02 ,  F25D27/00 ,  G06F1/20

Abstract: A water-cooling head includes a casing, an inclined flow-guiding structure and a bottom plate assembly. The casing includes an inlet and an outlet. A liquid is fed into the inlet. The inclined flow-guiding structure is disposed within the casing, and includes plural first openings. A bottom end of the inclined flow-guiding structure is located under the inlet. A top end of the inclined flow-guiding structure is arranged beside the outlet. The top end is located at a level higher than the bottom end. A second opening is formed in the bottom end. The bottom plate assembly is assembled with the casing, and located under the inclined flow-guiding structure. The bottom plate assembly includes a fin group. After the liquid is transferred to the fin group through the second opening or the plural first openings, the liquid is exited from the outlet.

公开(公告)号：US10537042B2

公开(公告)日：2020-01-14

申请号：US15679630

申请日：2017-08-17

Applicant: AURAS Technology Co., Ltd.

Inventor： Mu-Shu Fan ,  Chien-Yu Chen

IPC: H05K7/20 ,  G06F1/20 ,  F04D17/16 ,  F04D29/52 ,  F04D29/58 ,  F04D19/00 ,  F04D17/02 ,  F04D25/06 ,  H01L23/473

Abstract: An electronic device with a heat-dissipating function and a liquid-cooling radiator module are provided. The electronic device includes a first circuit board, a second circuit board and a liquid-cooling radiator module. The second circuit board is mounted on the first circuit board. The liquid-cooling radiator module is attached on the second circuit board and in thermal contact with an electronic component of the second circuit board. The liquid-cooling radiator module includes plural airflow channels and a fan. The plural airflow channels are in parallel with the second circuit board. The fan produces airflow toward the plural airflow channel. After the airflow passes through the plural airflow channels, the airflow is outputted in a direction parallel with the second circuit board. Since the airflow is not obstructed by the adjacent function circuit boards, the heat-dissipating efficiency is enhanced.

公开(公告)号：US20190338783A1

公开(公告)日：2019-11-07

申请号：US16011693

申请日：2018-06-19

Applicant: AURAS Technology Co., Ltd.

Inventor： Mu-Shu Fan ,  Che-Chia Chang ,  Chien-Yu Chen

IPC: F04D29/38 ,  F28D1/047 ,  F28D1/02 ,  H05K7/20 ,  F04D25/06 ,  F04D29/058 ,  F04D29/054

Abstract: A dual-impeller driving device and a liquid-cooling heat dissipation device with the dual-impeller driving device are provided. The dual-impeller driving device includes a double-sided circuit board, a first stator, a first magnetic element, a first impeller, a second stator, a second magnetic element, a second impeller and a shaft. The first stator is located beside a first active surface of the double-sided circuit board. The first magnetic element is located near the first stator. The first impeller is combined with the first magnetic element. The second stator is located beside a second active surface of the double-sided circuit board. The second magnetic element is located near the second stator. The second impeller is combined with the second magnetic element. The shaft is penetrated through the double-sided circuit board. The first impeller and the second impeller are rotated about the shaft.

公开(公告)号：US10303229B2

公开(公告)日：2019-05-28

申请号：US15904482

申请日：2018-02-26

Applicant: AURAS Technology Co., Ltd.

Inventor： Mu-Shu Fan ,  Chien-Yu Chen

IPC: F28D1/06 ,  G06F1/20

Abstract: A water-cooling heat dissipation module includes a hot-water heat exchange structure, a cold-water heat exchange structure, a fluid communication structure and a fan. The fluid communication structure is in communication with the hot-water heat exchange structure and the cold-water heat exchange structure. The fan and the hot-water heat exchange structure are opposed to each other with respect to the cold-water heat exchange structure. An airflow produced by the fan blows the cold-water heat exchange structure and the hot-water heat exchange structure sequentially. Consequently, the cold-water heat exchange structure will not receive the heat from the hot-water heat exchange structure through the airflow.