中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

30 records (took 0.017 seconds)

    OLEDS WITH IMPROVED LIGHT EXTRACTION USING ENHANCED GUIDED MODE COUPLING
    23.
    发明申请
    OLEDS WITH IMPROVED LIGHT EXTRACTION USING ENHANCED GUIDED MODE COUPLING 有权
    具有改进的光提取的OLEDs使用增强的引导模式耦合

    公开(公告)号：US20160116696A1

    公开(公告)日：2016-04-28

    申请号：US14920169

    申请日：2015-10-22

    Applicant: CORNING INCORPORATED

    Inventor： Robert Adam Modavis ,  Daniel Aloysius Nolan ,  Mark Alejandro Quesada ,  Wageesha Senaratne ,  Dean Michael Thelen

    IPC: G02B6/42 ,  H01L51/52 ,  G02B6/12

    CPC classification number: G02B6/4298 ,  G02B6/12004 ,  H01L51/5262 ,  H01L51/5268

    Abstract: An organic light emitting diode (OLED) device having enhanced light extraction is disclosed. The OLED device includes an upper waveguide structure having an organic layer and supports first guided modes, and a lower waveguide structure with a light-extraction waveguide that supports second guided modes substantially matched to the first guided modes. The lower waveguide structure includes a light-extraction waveguide interfaced with a light-extraction matrix. The light-extraction waveguide includes one or more light-redirecting features. The upper and lower waveguide structures are configured to facilitate mode coupling from the first guided modes to the second guide modes while substantially avoiding coupling the first guided modes to surface plasmon polaritons. The light traveling in the second guided modes is redirected to exit the OLED device by light-redirecting features of the light-extraction waveguide.

    Abstract translation: 公开了一种具有增强的光提取的有机发光二极管（OLED）器件。 OLED器件包括具有有机层并支持第一引导模式的上波导结构，以及具有支撑与第一引导模式基本匹配的第二引导模式的具有光提取波导的下波导结构。 下波导结构包括与光提取矩阵接口的光提取波导。 光提取波导包括一个或多个光重定向特征。 上和下波导结构被配置为便于从第一引导模式到第二引导模式的模式耦合，同时基本上避免将第一引导模式耦合到表面等离子体激元偏振器。 以第二引导模式行进的光被重定向以通过光引导波导的光重定向特征退出OLED器件。

    ELECTRONIC APPARATUS
    25.
    发明申请
    ELECTRONIC APPARATUS 有权

    公开(公告)号：US20230099647A1

    公开(公告)日：2023-03-30

    申请号：US17905373

    申请日：2021-02-25

    Applicant: Corning Incorporated

    Inventor： Sean Matthew Garner ,  David Andrew Pastel ,  Dean Michael Thelen

    IPC: H01L25/16 ,  H01L33/62

    Abstract: An electronic apparatus includes a substrate including a first major surface, a second major surface, and an edge surface. The edge surface includes a radius of curvature extending between the first major surface and the second major surface. The electronic apparatus includes an opto-electronic device positioned on the first major surface. The electronic apparatus includes an electrical component positioned on the second major surface. The electronic apparatus includes a first electrically-conductive trace attached to the edge surface. The first electrically-conductive trace electrically connects a first portion of the opto-electronic device to the electrical component and defines a first current path. The electronic apparatus includes a second electrically-conductive trace extending through an opening in the substrate. The second electrically-conductive trace electrically connects a second portion of the opto-electronic device to the electrical component and defines a second current path different than the first current path.

    PRECISION STRUCTURED GLASS ARTICLE HAVING EMI SHIELDING AND METHODS FOR MAKING THE SAME
    27.
    发明申请
    PRECISION STRUCTURED GLASS ARTICLE HAVING EMI SHIELDING AND METHODS FOR MAKING THE SAME 有权

    公开(公告)号：US20210125938A1

    公开(公告)日：2021-04-29

    申请号：US17043567

    申请日：2019-04-03

    Applicant: CORNING INCORPORATED

    Inventor： JIN SU KIM ,  Dean Michael Thelen

    IPC: H01L23/552 ,  H01L21/48

    Abstract: Structured glass articles include a glass substrate including a glass cladding layer fused to a glass core layer, a cavity formed in the glass substrate, and a shielding layer disposed within the cavity. In some embodiments, a passivation layer is disposed within the cavity such that the shielding layer is between the passivation layer and the glass substrate. A method for forming a glass fan-out includes depositing a shielding layer within a cavity in a glass substrate. The glass substrate includes a glass cladding layer fused to a glass core layer. A silicon chip may be deposited within the cavity. In some embodiments, the method also includes depositing a passivation layer within the cavity such that the shielding layer is between the passivation layer and the glass substrate.

    LAMINATED GLASS STRUCTURES FOR ELECTRONIC DEVICES AND ELECTRONIC DEVICE COVERS
    28.
    发明申请
    LAMINATED GLASS STRUCTURES FOR ELECTRONIC DEVICES AND ELECTRONIC DEVICE COVERS 有权

    公开(公告)号：US20210008832A1

    公开(公告)日：2021-01-14

    申请号：US17041876

    申请日：2019-03-27

    Applicant: CORNING INCORPORATED

    Inventor： Jin Su Kim ,  Dean Michael Thelen

    IPC: B32B7/027 ,  B32B17/06

    Abstract: A laminated glass structure is provided that includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, the laminated glass structure is characterized by a transmission power of at least 75% and at least 55% for signals at 28 GHz and 60 GHz, respectively, as calculated in a Three-Layer Model.

Patent Agency Ranking