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公开(公告)号：US20140125980A1
公开(公告)日：2014-05-08
申请号：US14154612
申请日：2014-01-14
Applicant: Hitachi High-Technologies Corporation
Inventor： Toshiyuki Nakao , Shigenobu Maruyama , Akira Hamamatsu , Yuta Urano
IPC: G01N21/95
CPC classification number: G01N21/9501 , G01N21/8806 , G01N2021/8809 , G01N2021/8848 , H01L22/12
Abstract: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.
Abstract translation: 一种用于检查包括晶片表面上的缺陷的表面状态的缺陷检查方法和装置，其中照射到晶片表面的激光束的偏振状态连接到指定的偏振状态，具有指定偏振态的转换的激光束 被插入到晶片表面上，并且从照射具有指定的偏振状态的激光束的照射区域发射的散射光被分离为由于晶片上的缺陷而发生的第一散射光和由于正在发生的第二散射光 达到晶片上的表面粗糙度。 用于光路分割的光学元件大致同时分开第一和第二散射光。
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公开(公告)号：US20170261441A1
公开(公告)日：2017-09-14
申请号：US15529874
申请日：2015-12-16
Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
Inventor： Toshiyuki Nakao , Yuta Urano , Kaifeng Zhang , Hideaki Sasazawa
IPC: G01N23/04 , G01N23/18 , G01N23/083
CPC classification number: G01N23/04 , G01N23/044 , G01N23/083 , G01N23/18 , G01N2223/3306 , G01N2223/401 , G01N2223/408 , G01N2223/6116 , G01N2223/646 , G01N2223/6462
Abstract: A method including inspecting, using an X-ray transmission image, internal defects in a TSV formed in a semiconductor wafer, and detecting the X-rays, and processing an X-ray transmission image. Therein, the detection of X-rays is configured such that: the detection azimuth of the X-rays, and the detection elevation angle of the X-rays relative to the X-ray source are determined on the basis of information on the arrangement interval, depth, and planar shape of structures formed in the sample. The angle of rotation of a rotating stage on which the sample is mounted is adjusted in accordance with the detection azimuth which has been determined, and the X-rays that have been transmitted through the sample are detected with the position of the detector set to the detection elevation angle which has been determined.
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公开(公告)号：US09645094B2
公开(公告)日：2017-05-09
申请号：US15387786
申请日：2016-12-22
Applicant: Hitachi High-Technologies Corporation
Inventor： Toshifumi Honda , Yuta Urano , Takahiro Jingu , Akira Hamamatsu
CPC classification number: G01N21/8806 , G01J1/0474 , G01J1/44 , G01N21/9501 , G01N21/956 , G01N2201/06113 , G01N2201/068 , G01N2201/0683 , G01N2201/0697 , G01N2201/10 , G01N2201/12
Abstract: To detect an infinitesimal defect, highly precisely measure the dimensions of the detect, a detect inspection device is configured to comprise: a irradiation unit which irradiate light in a linear region on a surface of a sample; a detection unit which detect light from the linear region; and a signal processing unit which processes a signal obtained by detecting light and detecting a defect. The detection unit includes: an optical assembly which diffuses the light from the sample in one direction and forms an image in a direction orthogonal to the one direction; and a detection assembly having an array sensor in which detection pixels are positioned two-dimensionally, which detects the light diffused in the one direction and imaged in the direction orthogonal to the one direction, adds output signals of each of the detection pixels aligned in the direction in which the light is diffused, and outputs same.
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公开(公告)号：US20170115231A1
公开(公告)日：2017-04-27
申请号：US15398911
申请日：2017-01-05
Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
Inventor： Yuta Urano , Toshifumi Honda , Takahiro Jingu
CPC classification number: G01N21/8806 , G01N21/4795 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N2021/8835
Abstract: A defect inspection method includes an illumination light adjustment step of adjusting light emitted from a light source, an illumination intensity distribution control step of forming light flux obtained in the illumination light adjustment step into desired illumination intensity distribution, a sample scanning step of displacing a sample in a direction substantially perpendicular to a longitudinal direction of the illumination intensity distribution, a scattered light detection step of counting the number of photons of scattered light emitted from plural small areas in an area irradiated with illumination light to produce plural scattered light detection signals corresponding to the plural small areas, a defect judgment step of processing the plural scattered light detection signals to judge presence of a defect, a defect dimension judgment step of judging dimensions of the defect in each place in which the defect is judged to be present and a display step of displaying a position on sample surface and the dimensions of the defect in each place in which the defect is judged to be present.
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公开(公告)号：US09606071B2
公开(公告)日：2017-03-28
申请号：US15132812
申请日：2016-04-19
Applicant: Hitachi High-Technologies Corporation
Inventor： Yukihiro Shibata , Hideki Fukushima , Yuta Urano , Toshifumi Honda
CPC classification number: G01N21/956 , G01N21/47 , G01N21/9501 , G01N2021/1765 , G01N2201/06113 , G01N2201/0636 , G06T7/001 , G06T7/32 , G06T2207/30148 , H04N5/2256 , H04N5/247
Abstract: A defect inspection device inspecting a sample includes a movable table on which the sample as an inspection object and a pattern chip are mounted, an illumination light irradiation unit which irradiates a surface of the sample or a surface of the pattern chip with linearly-formed illumination light, a detection optical system section where a plurality of detection optical systems are disposed at a plurality of positions above the table and which detect images of scattered light generated from the sample, and a signal processing unit which processes detected signals to detect a defect of the sample surface, and a plurality of repeating patterns for generating the scattered light according to positions of the objective lenses of the plurality of detection optical systems of the detection optical system section when the linearly-formed illumination light is irradiated by the illumination light irradiation unit are periodically formed in the pattern chip.
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Patent Agency Ranking
公开(公告)号：US09488596B2
公开(公告)日：2016-11-08
申请号：US14978372
申请日：2015-12-22
Applicant: Hitachi High-Technologies Corporation
Inventor： Toshifumi Honda , Yuta Urano , Hisashi Hatano
IPC: G01N21/95 , G01N21/956 , G01N21/88
CPC classification number: G01N21/9501 , G01N21/8851 , G01N21/956 , G01N2201/06
Abstract: In defect scanning carried out in a process of manufacturing a semiconductor or the like, a light detection optical system comprising a plurality of photosensors is used for detecting scattered light reflected from a sample. The photosensors used for detecting the quantity of weak background scattered light include a photon counting type photosensor having few pixels whereas the photosensors used for detecting the quantity of strong background scattered light include a photon counting type photosensor having many pixels or an analog photosensor. In addition, nonlinearity caused by the use of the photon counting type photosensor as nonlinearity of detection strength of defect scattered light is corrected in order to correct a detection signal of the defect scattered light.
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公开(公告)号：US09310318B2
公开(公告)日：2016-04-12
申请号：US14638305
申请日：2015-03-04
Applicant: Hitachi High-Technologies Corporation
Inventor： Yuta Urano , Toshifumi Honda , Yukihiro Shibata
IPC: G01J4/00 , G01N21/956 , G01N21/95 , G01N21/88
CPC classification number: G01N21/956 , G01N21/9501 , G01N21/95607 , G01N2021/8848 , G01N2021/9513 , G01N2021/95638
Abstract: To detect a bridge defect between lines of a line pattern formed on a sample at pitches narrower than the wavelength of inspection light, a defect inspection device is configured to comprise: a light source which emits laser; a vertical illumination unit which applies the laser to the sample from a vertical direction via an objective lens by converting the laser into linearly polarized light by using a polarization conversion unit in a state polarized in a direction orthogonal to the longitudinal direction of the line pattern; an oblique illumination unit which applies the laser to the sample from an oblique direction; a detection optical unit including an optical filter which selectively transmits a scattered light component from the defect by converting the polarization state of the reflected/scattered light; and a signal processing unit which detects the defect on the sample by processing a detection signal.
Abstract translation: 为了以窄于检查光的波长的间距检测在样品上形成的线图案的线之间的桥缺陷，缺陷检查装置被配置为包括：发射激光的光源; 垂直照明单元，其通过使用偏振转换单元在与线图案的纵向方向正交的方向上偏振的状态下将激光转换成线偏振光，通过物镜将垂直方向的激光施加到样本; 倾斜照明单元，其从倾斜方向向样品施加激光; 检测光学单元，包括：滤光器，其通过转换所述反射/散射光的偏振状态来选择性地透射来自所述缺陷的散射光分量; 以及信号处理单元，其通过处理检测信号来检测样本上的缺陷。
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公开(公告)号：US09255888B2
公开(公告)日：2016-02-09
申请号：US14359221
申请日：2012-10-22
Applicant: Hitachi High-Technologies Corporation
Inventor： Toshifumi Honda , Yuta Urano , Hisashi Hatano
IPC: G01N21/88 , G01N21/95 , G01N21/956
CPC classification number: G01N21/9501 , G01N21/8851 , G01N21/956 , G01N2201/06
Abstract: In defect scanning carried out in a process of manufacturing a semiconductor or the like, a light detection optical system comprising a plurality of photosensors is used for detecting scattered light reflected from a sample. The photosensors used for detecting the quantity of weak background scattered light include a photon counting type photosensor having few pixels whereas the photosensors used for detecting the quantity of strong background scattered light include a photon counting type photosensor having many pixels or an analog photosensor. In addition, nonlinearity caused by the use of the photon counting type photosensor as nonlinearity of detection strength of defect scattered light is corrected in order to correct a detection signal of the defect scattered light.
Abstract translation: 在制造半导体等的过程中进行的缺陷扫描中，使用包含多个光电传感器的光检测光学系统来检测从样品反射的散射光。 用于检测弱背景散射光量的光传感器包括具有少量像素的光子计数型光电传感器，而用于检测强背景散射光量的光电传感器包括具有许多像素的光子计数型光电传感器或模拟光电传感器。 此外，为了校正缺陷散射光的检测信号，对使用光子计数型光电传感器作为非线性的缺陷散射光的检测强度引起的非线性进行了修正。
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公开(公告)号：US20150241361A1
公开(公告)日：2015-08-27
申请号：US14422583
申请日：2013-07-29
Applicant: Hitachi High-Technologies Corporation
Inventor： Yuta Urano , Toshifumi Honda , Yukihiro Shibata
IPC: G01N21/956 , G01N21/95
CPC classification number: G01N21/956 , G01N21/9501
Abstract: A defect-inspection device includes an irradiation unit having an objective-pupil-optical unit that allows illumination light linearly condensed by a first light-condensing unit to pass through, and an objective lens that allows the illumination light having passed through the objective-pupil-optical unit to pass through; an irradiation-position-control unit that controls a passing position of the illumination light in the objective-pupil-optical unit disposed at a pupil surface of the objective lens; a detection unit having a second light-condensing unit that condenses light irradiated by the irradiation unit and generated from a sample, a specular-reflection light-blocking unit that blocks specular-reflection light from the sample and light components generated near the pupil surface among the light beams condensed by the second light-condensing unit, and an image-forming unit that images the light that is condensed by the second light-condensing unit and is not blocked by the specular-reflection light-blocking unit into a detector; and a defect-determination unit that detects a defect on a surface of the sample on the basis of a signal of the image imaged by the image-forming unit.
Abstract translation: 缺陷检查装置包括具有允许由第一聚光单元直线聚光的照明光通过的物镜光瞳单元的照射单元和允许照明光通过物镜的物镜 光通单位通过; 照射位置控制单元，其控制设置在物镜的光瞳表面处的物镜光学单元中的照明光的通过位置; 检测单元，具有：第二聚光单元，其冷凝由所述照射单元照射并由样品产生的光;镜面反射阻光单元，其阻挡来自所述样品的镜面反射光;以及在所述瞳孔表面附近产生的光分量 由第二聚光单元聚光的光束和图像形成单元，其将由第二聚光单元聚光并且不被镜面反射光阻挡单元遮挡的光成像到检测器中; 以及缺陷确定单元，其基于由图像形成单元成像的图像的信号来检测样本的表面上的缺陷。
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公开(公告)号：US20140328459A1
公开(公告)日：2014-11-06
申请号：US14371427
申请日：2012-12-12
Applicant: Hitachi High-Technologies Corporation
Inventor： Yuta Urano , Toshifumi Honda , Yasuko Aoki
IPC: G01N23/04
CPC classification number: G01N23/04 , G01N23/043 , G01N23/16 , G01N23/18 , G01N2223/642 , G01N2223/643 , G01N2223/646 , G01N2223/652 , G01T1/20
Abstract: The X-ray inspection device includes: an X-ray source with a focal spot size greater than the diameter of a defect for irradiating a sample with X-rays; an X-ray TDI detector arranged near the sample and having long pixels in a direction parallel to the scanning direction of the sample for detecting the X-rays emitted by the X-ray source and passing through the sample as an X-ray transmission image; and a defect-detecting unit for detecting defects based on the X-ray transmission image detected by the X-ray TDI detector.
Abstract translation: X射线检查装置包括：焦点尺寸大于用X射线照射样品的缺陷的直径的X射线源; X射线TDI检测器，其布置在样本附近，并且在与样品的扫描方向平行的方向上具有长像素，用于检测由X射线源发射的X射线并作为X射线透射图像通过样品 ; 以及缺陷检测单元，用于基于由X射线TDI检测器检测到的X射线透射图像来检测缺陷。
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