Abstract:
The invention embodies a harvester (12) to convert energy from mechanical domain to electrical domain. The harvester comprises at least one inertial body (6), at least one beam (7, 9), a support (8) to said at least one beam (7, 9) and transducer means (10, 16), wherein said at least one beam (7, 9) configures the inertial body (6) into a pendulum structure being suspended from said support (8) so that the beam (7, 9) is allowed to bend according to the kinetic state changes of the inertial body (6), and is configured to interact with at least one transducer means (10) that is/are configured to produce change in the electrical state of said transducer means (10, 16) responsively to the kinetic state of the beam (7, 9). The invention also shows harvester module, matrix and a harvester system comprising at least one embodied harvester. The invention also shows a tire and a foot wear that comprises at least one harvester embodied.
Abstract:
A device (100) harvests energy from vibration and/or strain and utilises both capacitive (102a, 102b) and piezo-electric elements (105). The principle of operation is out-of-plane capacitive harvester, where the bias voltage for the capacitive element is generated with a piezoelectric element (105). The device utilizes a thin dielectric film (104) between the capacitor plates (102a, 102b) maximizing the harvested energy and enabling the harvester operation in semi-contact mode so that short circuits are prevented. For example when utilised in a wheel or the like, the capacitor is closed and opened at every strike or every turn of a wheel being thus independent of the harvester's mechanical resonance frequency.
Abstract:
The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part, sealed by means of a cover part, and an electronic circuit part, suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.
Abstract:
The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part, sealed by means of a cover part, and an electronic circuit part, suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.
Abstract:
The present invention relates to measuring devices used in measuring acceleration and, more precisely, to capacitive acceleration sensors. The object of the invention is to provide an improved method of manufacturing a capacitive acceleration sensor, and to provide a capacitive acceleration sensor, which is applicable for use in small capacitive acceleration sensor solutions, and which, in particular, is applicable for use in small and extremely thin capacitive acceleration sensor solutions measuring acceleration in relation to several axes.
Abstract:
The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part, sealed by means of a cover part, and an electronic circuit part, suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.
Abstract:
The invention relates to a method for manufacturing a silicon sensor structure and a silicon sensor. According to the method, into a single-crystal silicon wafer (10) is formed by etched openings at least one spring element configuration (7) and at least one seismic mass (8) connected to said spring element configuration (7). According to the invention, the openings and trenches (8) extending through the depth of the silicon wafer are fabricated by dry etch methods, and the etch process used for controlling the spring constant of the spring element configuration (7) is based on wet etch methods.
Abstract:
The invention relates to measuring devices used for the measuring of acceleration, and specifically to capacitive acceleration sensors. The capacitive acceleration sensor according to the present invention comprises a pair of electrodes composed of a movable electrode (4) and a stationary electrode (5), and, related to the pair of electrodes, an isolator protrusion having a special coating. The invention provides an improved, more durable sensor structure, which withstands wear caused by overload situations better than earlier structures.
Abstract:
This publication discloses a capacitor construction for use in pressure transducers, including a substrate plate having of a silicon wafer and a thinner glass wafer. A first fixed capacitor plate is provided for overlying the substrate plate plate. A silicon plate is adapted to encircle the substrate plate with its thinned center area acting as a moving capacitor plate by virtue of its diaphragm behavior and a top plate overlying the silicon plate includes a silicon wafer and a glass wafer bonded to the silicon wafer and having a thickness essentially smaller than that of the silicon wafer. According to the invention, over the supporting substrate plate and between the first capacitor plate and its encircling silicon plate, is provided another overlying capacitor overlying plate, which essentially encloses the first capacitor plate. With this design, a reduced temperature sensitivity is accomplished in the capacitor construction.