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    PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
    22.
    发明申请
    PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE 审中-公开
    印刷线路板和半导体封装

    公开(公告)号：US20170053878A1

    公开(公告)日：2017-02-23

    申请号：US15239865

    申请日：2016-08-18

    Applicant: IBIDEN CO., LTD.

    Inventor： Kazuki KAJIHARA ,  Takema ADACHI ,  Teruyuki ISHIHARA ,  Kosuke IKEDA

    IPC: H01L23/00 ,  H01L21/48 ,  H01L25/10 ,  H01L23/498 ,  H01L23/31

    CPC classification number: H01L23/49822 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/5389 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1058 ,  H01L2924/00014

    Abstract: A printed wiring board includes a build-up layer including insulating and conductor layers, pads formed on surface of the build-up layer and including first pads to connect an electronic component and second pads to connect an external wiring board onto the surface of the build-up layer, a mold resin layer formed on the surface of the build-up layer such that the mold layer is covering the surface of the build-up layer and has a cavity exposing the first pads and openings exposing the second pads, and conductor posts formed in the openings and including plating material such that the posts are connected to the second pads. The plating material of the posts includes electroless plating layer and electrolytic plating layer, and the posts are formed such that each post has an end surface exposed from surface of the mold layer on the opposite side with respect to the second pads.

    Abstract translation: 印刷电路板包括包含绝缘层和导体层的堆积层，形成在堆积层的表面上的焊盘，并且包括用于连接电子部件的第一焊盘和将外部布线板连接到建筑物的表面上的第二焊盘 上层，形成在堆积层的表面上的模制树脂层，使得模制层覆盖积层的表面并且具有暴露第一焊盘和暴露第二焊盘的开口的腔，以及导体 形成在开口中并包括电镀材料的柱，使得柱连接到第二垫。 柱的电镀材料包括无电解镀层和电解镀层，并且柱形成为使得每个柱具有相对于第二焊盘在相对侧的表面暴露于模具层的端面。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    23.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    印刷线路板及其制造方法

    公开(公告)号：US20160316558A1

    公开(公告)日：2016-10-27

    申请号：US15084992

    申请日：2016-03-30

    Applicant: IBIDEN CO., LTD.

    Inventor： Shunsuke SAKAI ,  Toshiki FURUTANI ,  Kosuke IKEDA ,  Takema ADACHI ,  Takayuki KATSUNO

    IPC: H05K1/11 ,  H05K3/18 ,  H05K1/09 ,  H05K3/00 ,  H05K1/02 ,  H05K1/03

    CPC classification number: H05K1/11 ,  H01L21/486 ,  H01L23/12 ,  H01L23/145 ,  H01L23/49861 ,  H05K3/205 ,  H05K3/382 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0307

    Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R2, and the first and second roughnesses R1, R2 satisfy R1>R2.

    Abstract translation: 印刷布线板包括树脂绝缘层，布置在绝缘层中的布线导体层，使得布线层具有从绝缘层露出的第一表面，以及形成在绝缘层中的导体柱和布线层的第二表面 在相对于布线层的第一表面的相对侧，使得导体柱具有被绝缘层覆盖的侧表面和相对于布线层的相对侧上的绝缘层暴露的端面。 导体柱形成为使得导体柱的侧表面是具有第一粗糙度R1的表面粗糙度的粗糙化侧表面，导体柱的端面是具有第二粗糙度R2的表面粗糙度的粗糙化端面，并且第一 第二粗糙度R1，R2满足R1> R2。

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