公开(公告)号：US20190071305A1

公开(公告)日：2019-03-07

申请号：US16118055

申请日：2018-08-30

Applicant: Infineon Technologies AG

Inventor： Johann Strasser ,  Alfons Dehe ,  Gerhard Metzger-Brueckl ,  Juergen Wagner ,  Arnaud Walther

IPC: B81B7/02 ,  B81C1/00 ,  B81B3/00

Abstract: A production method for a double-membrane MEMS component includes: providing a layer arrangement on a carrier substrate, wherein the layer arrangement comprises a first membrane structure, a sacrificial material layer adjoining the first membrane structure, and a counterelectrode structure in the sacrificial material layer and at a distance from the first membrane structure, wherein at least one through opening is formed in the sacrificial material layer as far as the first membrane structure; forming a filling material structure in the at least one through opening by applying a first filling material layer on the wall region of the at least one through opening; applying a second membrane structure on the layer arrangement with the sacrificial material; and removing the sacrificial material from an intermediate region to expose the filling material structure in the intermediate region.

公开(公告)号：US20190039884A1

公开(公告)日：2019-02-07

申请号：US16050795

申请日：2018-07-31

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Marc Fueldner ,  Andreas Wiesbauer

IPC: B81B7/02 ,  B81B3/00 ,  H04R19/04 ,  H04R19/00

Abstract: In accordance with an embodiment, a MEMS sensor includes a MEMS arrangement having a movable electrode and a stator electrode arranged opposite the movable electrode. The MEMS sensor includes a first bias voltage source, which is connected to the stator electrode and which is configured to apply a first bias voltage to the stator electrode. The MEMS sensor further includes a common-mode read-out circuit connected to the stator electrode by a capacitive coupling and comprising a second bias voltage source, which is configured to apply a second bias voltage to a side of the capacitive coupling that faces away from the stator electrode.

公开(公告)号：US10189699B2

公开(公告)日：2019-01-29

申请号：US15819767

申请日：2017-11-21

Applicant: Infineon Technologies AG

Inventor： Arnaud Walther ,  Alfons Dehe ,  Johann Strasser ,  Gerhard Metzger-Brueckl

IPC: B81B3/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.

公开(公告)号：US10186468B2

公开(公告)日：2019-01-22

申请号：US15086573

申请日：2016-03-31

Applicant: Infineon Technologies AG

Inventor： Stephan Pindl ,  Daniel Lugauer ,  Dominic Maier ,  Alfons Dehe

IPC: H01L23/31 ,  H01L21/20 ,  H01L21/18 ,  H01L33/00 ,  H01L21/762 ,  H01L23/057 ,  H01L23/053 ,  G01N27/02 ,  G01N33/00 ,  H01L21/56 ,  H01L23/538 ,  H05K1/18 ,  G01N27/12 ,  H01L23/00 ,  H01L23/29

Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

公开(公告)号：US10171925B2

公开(公告)日：2019-01-01

申请号：US15452058

申请日：2017-03-07

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen

IPC: H04R31/00 ,  B81B3/00 ,  H04R19/00 ,  H04R1/08 ,  B81C1/00

Abstract: A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.

公开(公告)号：US10129676B2

公开(公告)日：2018-11-13

申请号：US15044663

申请日：2016-02-16

Applicant: Infineon Technologies AG

Inventor： Arnaud Walther ,  Alfons Dehe

IPC: H04R29/00 ,  B81C1/00 ,  G01K7/02 ,  H04R3/00 ,  H04R19/00 ,  H04R19/04 ,  B81B7/02 ,  G01K1/14 ,  H04R7/10

Abstract: A MEMS microphone and a method for manufacturing a MEMS microphone are disclosed. Embodiments of the invention provide a MEMS microphone including a MEMS microphone structure having at least one counter electrode structure and a diaphragm structure deflectable with respect to the counter electrode structure and a thermocouple arranged at the MEMS microphone structure.

公开(公告)号：US20180234774A1

公开(公告)日：2018-08-16

申请号：US15897946

申请日：2018-02-15

Applicant: Infineon Technologies AG

Inventor： Arnaud Walther ,  Alfons Dehe ,  Gerhard Metzger-Brueckl ,  Johann Strasser ,  Carsten Ahrens

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R19/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  B81B3/001 ,  B81B3/0021 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/04 ,  B81C1/00182 ,  H04R19/005 ,  H04R31/003 ,  H04R2201/003

Abstract: A microelectromechanical microphone includes a reference electrode, a first membrane arranged on a first side of the reference electrode and displaceable by sound to be detected, and a second membrane arranged on a second side of the reference electrode, said second side being situated opposite the first side of the reference electrode, and displaceable by sound to be detected. A region of one from the first and second membranes that is displaceable by sound relative to the reference electrode, independently of said region's position relative to the reference electrode, can comprise a planar section and also an undulatory section adjoining the planar section and arranged in a region of overlap one of the first membrane or the second membrane with the other one of the first membrane and or the second membrane.

公开(公告)号：US10034100B2

公开(公告)日：2018-07-24

申请号：US15290877

申请日：2016-10-11

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Marc Fueldner

IPC: H04R25/00 ,  H04R19/04 ,  H04R19/00 ,  H04R31/00 ,  H04R7/00

Abstract: A sound transducer structure includes a membrane and a counter electrode. The membrane includes a first main surface in a sound transducing region made of a membrane material, and an edge region. The counter electrode includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. A plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume. The membrane and the counter electrode are arranged to provide a capacity therebetween. The membrane comprises a corrugation groove extending in the sound transducing region from the first main surface of the membrane into the free volume.

公开(公告)号：US20180201504A1

公开(公告)日：2018-07-19

申请号：US15923599

申请日：2018-03-16

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: B81C1/00 ,  H04R31/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81C1/00825 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00873 ,  B81C2201/017 ,  B81C2201/053 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack over a first main surface of a substrate, forming a polymer layer over a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

公开(公告)号：US20180164215A1

公开(公告)日：2018-06-14

申请号：US15376738

申请日：2016-12-13

Applicant: Infineon Technologies AG

Inventor： Christoph Glacer ,  Alfons Dehe ,  David Tumpold ,  Gueclue Onaran

IPC: G01N21/64 ,  G01N21/84

Abstract: A gas analyzer may include: a gas chamber configured to receive a gas to be analyzed therein, a radiation source configured to emit electromagnetic radiation into the gas chamber, the electromagnetic radiation being adapted to selectively excite gas molecules of a specific type that is to be detected in the gas received in the gas chamber, a collimator configured to collimate the electromagnetic radiation emitted by the radiation source, and a sensor configured to detect a physical quantity indicative of a degree of interaction between the electromagnetic radiation emitted by the radiation source and the gas to be analyzed.