公开(公告)号：US20220021115A1

公开(公告)日：2022-01-20

申请号：US17335301

申请日：2021-06-01

Applicant: Intel Corporation

Inventor： Ali Sadri ,  Debabani Choudhury ,  Bradley Jackson ,  Shengbo Xu ,  Tae Young Yang ,  Zhen Zhou ,  Cheng-Yuan Chin

IPC: H01Q3/44 ,  H01Q19/06 ,  H01Q21/06

Abstract: A lens antenna system is disclosed. The lens antenna system comprises a hybrid focal source antenna circuit configured to generate a source antenna beam for integration with different lens structures. In some embodiments, the hybrid focal source antenna circuit comprises a set of antenna elements coupled to one another. In some embodiments, the set of antenna elements comprises a first antenna element configured to be excited in a first spherical mode; and a second antenna element configured to be excited in a second, different, spherical mode. In some embodiments, the first spherical mode and the second spherical mode are co-polarized. In some embodiments, the lens antenna system further comprises a lens configured to shape the source antenna beam associated with the hybrid focal source antenna circuit, in order to provide an output antenna beam.

公开(公告)号：US20210368023A1

公开(公告)日：2021-11-25

申请号：US16973856

申请日：2019-01-17

Applicant: INTEL CORPORATION

Inventor： Shoumeng Yan ,  Xiao Dong Lin ,  Yao Zu Dong ,  Zhen Zhou ,  Bin Yang

IPC: H04L29/08

Abstract: Method, systems and apparatuses may provide for technology that divides an application into a plurality of portions that are each associated with one or more functions of the application and determine a plurality of transition probabilities between the plurality of portions. Some technology may also receive at least a first portion of the plurality of portions, and receive a relation file indicating the plurality of transition probabilities between the plurality of portions.

公开(公告)号：US10950536B2

公开(公告)日：2021-03-16

申请号：US16017710

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Jun Liao ,  Xiang Li ,  Kevin Stone ,  Daqiao Du ,  Tae-Young Yang ,  Ling Zheng ,  James A. McCall

IPC: H01L23/498 ,  H01R12/71 ,  H01R43/20 ,  H01R43/16 ,  H01R12/57 ,  H01R12/52 ,  H01R13/6467 ,  H01R12/70

Abstract: An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.

公开(公告)号：US20200350680A1

公开(公告)日：2020-11-05

申请号：US16399451

申请日：2019-04-30

Applicant: Intel Corporation

Inventor： Tae Young Yang ,  Zhen Zhou ,  Bradley Jackson ,  Shengbo Xu ,  Cheng-Yuan Chin ,  Debabani Choudhury ,  Ali Sadri

IPC: H01Q3/44 ,  H01Q19/06 ,  H01Q21/06

Abstract: A lens antenna system is disclosed. The lens antenna system comprises a hybrid focal source antenna circuit configured to generate a source antenna beam for integration with different lens structures. In some embodiments, the hybrid focal source antenna circuit comprises a set of antenna elements coupled to one another. In some embodiments, the set of antenna elements comprises a first antenna element configured to be excited in a first spherical mode; and a second antenna element configured to be excited in a second, different, spherical mode. In some embodiments, the first spherical mode and the second spherical mode are co-polarized. In some embodiments, the lens antenna system further comprises a lens configured to shape the source antenna beam associated with the hybrid focal source antenna circuit, in order to provide an output antenna beam.

公开(公告)号：US12142032B2

公开(公告)日：2024-11-12

申请号：US17572517

申请日：2022-01-10

Applicant: Intel Corporation

Inventor： Yuming Li ,  Zhen Zhou ,  Xiaodong Wang ,  Quan Yin

IPC: G06V10/82 ,  G06T7/11 ,  G06T7/194 ,  G06V10/764 ,  G06V20/52 ,  G06V20/58

Abstract: An embodiment of a semiconductor package apparatus may include technology to pre-process an image to simplify a background of the image, and perform object detection on the pre-processed image with the simplified background. For example, an embodiment of a semiconductor package may include technology to pre-process an image to subtract the background from the image and perform object detection on the pre-processed image with the background subtracted. Other embodiments are disclosed and claimed.

公开(公告)号：US20220416428A1

公开(公告)日：2022-12-29

申请号：US17357658

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Tae Young Yang ,  Shuhei Yamada ,  Tolga Acikalin ,  Johanny Escobar Pelaez ,  Kenneth Foust ,  Jason Mix ,  Renzhi Liu

IPC: H01Q9/04 ,  H01Q1/22

Abstract: Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.

公开(公告)号：US20210217179A1

公开(公告)日：2021-07-15

申请号：US16957401

申请日：2018-02-26

Applicant: Intel Corporation

Inventor： Yuming Li ,  Zhen Zhou ,  Xiaodong Wang ,  Quan Yin

IPC: G06T7/194 ,  G06T7/11

Abstract: An embodiment of a semiconductor package apparatus may include technology to pre-process an image to simplify a background of the image, and perform object detection on the pre-processed image with the simplified background. For example, an embodiment of a semiconductor package may include technology to pre-process an image to subtract the background from the image and perform object detection on the pre-processed image with the background subtracted. Other embodiments are disclosed and claimed.

公开(公告)号：US11043743B2

公开(公告)日：2021-06-22

申请号：US16399451

申请日：2019-04-30

Applicant: Intel Corporation

Inventor： Tae Young Yang ,  Zhen Zhou ,  Bradley Jackson ,  Shengbo Xu ,  Cheng-Yuan Chin ,  Debabani Choudhury ,  Ali Sadri

IPC: H01Q3/44 ,  H01Q19/06 ,  H01Q21/06

Abstract: A lens antenna system is disclosed. The lens antenna system comprises a hybrid focal source antenna circuit configured to generate a source antenna beam for integration with different lens structures. In some embodiments, the hybrid focal source antenna circuit comprises a set of antenna elements coupled to one another. In some embodiments, the set of antenna elements comprises a first antenna element configured to be excited in a first spherical mode; and a second antenna element configured to be excited in a second, different, spherical mode. In some embodiments, the first spherical mode and the second spherical mode are co-polarized. In some embodiments, the lens antenna system further comprises a lens configured to shape the source antenna beam associated with the hybrid focal source antenna circuit, in order to provide an output antenna beam.

公开(公告)号：US11024094B2

公开(公告)日：2021-06-01

申请号：US16650298

申请日：2017-12-21

Applicant: Intel Corporation

Inventor： Chao Huang ,  Zhen Zhou ,  Manuj Sabharwal

IPC: G06T19/00 ,  G06F3/01

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to map a virtual environment to a physical environment using a weighted linear mapping technique. Example methods disclosed herein include accessing dimensional data corresponding to the virtual environment. Disclosed example methods further include determining areas of relative importance in the virtual environment. Disclosed example methods also include accessing dimensional data corresponding to the physical environment and generating a mapped environment based on the dimensional data corresponding to the virtual environment, the dimensional data corresponding to the physical environment, and the areas of relative importance.

公开(公告)号：US10278302B2

公开(公告)日：2019-04-30

申请号：US14757972

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Anne M. Sepic ,  Zhen Zhou ,  Evan M. Fledell

IPC: H05K7/10 ,  G01R1/04 ,  H01R12/70 ,  H01R12/50 ,  H05K3/30 ,  H05K1/18

Abstract: Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first socket body portion and a second socket body portion. The first socket body portion and the second socket body portion comprise respective zones, wherein, of the two zones, only one such zone has a first electro-mechanical characteristic. The first electro-mechanical characteristic is selected from the group consisting of an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure. In another embodiment, modular socket sub-assemblies each comprise a respective one of the first zone and the second zone.