公开(公告)号：US20190036004A1

公开(公告)日：2019-01-31

申请号：US16071992

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Thomas L. SOUNART ,  Aleksandar ALEKSOV ,  Valluri R. RAO ,  Baris BICEN

IPC: H01L41/113 ,  H01L41/047 ,  H01L41/253 ,  H01L41/29 ,  H01L41/316 ,  H01L41/332 ,  H01L41/317 ,  H01L27/20 ,  G01L1/16

Abstract: Embodiments of the invention include a piezoelectric sensor system. According to an embodiment of the invention, the piezoelectric sensor system may include a piezoelectric sensor, a signal conditioning circuit, and a light source each formed on an organic or flexible substrate. In embodiments of the invention, the piezoelectric sensor may be a discrete component or the piezo electric sensor may be integrated into the substrate. According to an embodiment, a piezoelectric sensor that is integrated into the substrate may comprise, a cavity formed into the organic substrate and a moveable beam formed over the cavity and anchored to the organic substrate. Additionally, the piezoelectric sensor may include a piezoelectric region formed over an end portion of the moveable beam and extending at least partially over the cavity. The piezoelectric sensor may also include a top electrode formed over a top surface of the piezoelectric region.

公开(公告)号：US20190006298A1

公开(公告)日：2019-01-03

申请号：US16127820

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Brandon M. RAWLINGS ,  Feras EID

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/014 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/00014

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

公开(公告)号：US20180315690A1

公开(公告)日：2018-11-01

申请号：US15773030

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Mathew J. MANUSHAROW ,  Krishna BHARATH ,  William J. LAMBERT ,  Robert L. SANKMAN ,  Aleksandar ALEKSOV ,  Brandon M. RAWLINGS ,  Feras EID ,  Javier SOTO GONZALEZ ,  Meizi JIAO ,  Suddhasattwa NAD ,  Telesphor KAMGAING

IPC: H01L23/498 ,  H01F27/28 ,  H01L49/02 ,  H01F41/04 ,  H01L21/48 ,  H01G4/33 ,  H01L23/66

CPC classification number: H01F27/40 ,  H01F17/0006 ,  H01L28/00

Abstract: Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.

公开(公告)号：US20180097693A1

公开(公告)日：2018-04-05

申请号：US15283129

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H04L12/24 ,  H01H57/00 ,  H01L41/047 ,  H01L41/187 ,  A61B5/0205 ,  A61B5/00

CPC classification number: H04L41/0816 ,  A61B5/02055 ,  A61B5/021 ,  A61B5/02405 ,  A61B5/08 ,  A61B5/145 ,  A61B5/4266 ,  A61B5/4824 ,  A61B5/7282 ,  A61B5/7285 ,  A61B2560/0462 ,  H01H57/00 ,  H01L41/0471 ,  H01L41/187 ,  H01L41/1873 ,  H01L41/1876 ,  H04L41/0886

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

公开(公告)号：US20170288635A1

公开(公告)日：2017-10-05

申请号：US15088814

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Feras EID ,  Baris BICEN ,  Telesphor KAMGAING ,  Vijay K. NAIR ,  Johanna M. SWAN ,  Georgios C. DOGIAMIS ,  Valluri R. RAO

IPC: H03H9/02 ,  H03H9/17

CPC classification number: H03H9/02259 ,  H03H9/17 ,  H03H9/2463 ,  H03H2009/02291 ,  H03H2009/155

Abstract: Embodiments of the invention include a piezoelectric resonator which includes an input transducer having a first piezoelectric material, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure. In one example, the vibrating structure is positioned above a cavity of an organic substrate. The output transducer includes a second piezoelectric material. In operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.

公开(公告)号：US20170286731A1

公开(公告)日：2017-10-05

申请号：US15586820

申请日：2017-05-04

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Feras EID ,  Vijay K. NAIR ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN ,  Valluri R. RAO

IPC: G06K7/10 ,  H03H9/17 ,  H03H9/205 ,  H03H9/30

CPC classification number: G06K7/10297 ,  G06K7/10316 ,  G06K19/0672 ,  G06K19/0675 ,  H03H9/30

Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.

公开(公告)号：US20170133296A1

公开(公告)日：2017-05-11

申请号：US15410625

申请日：2017-01-19

Applicant: Intel Corporation

Inventor： Chandra M. Jha ,  Feras EID ,  Johanna M. SWAN ,  Ashish GUPTA

IPC: H01L23/373 ,  H01L23/00

CPC classification number: H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1133 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11826 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13147 ,  H01L2224/13193 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2745 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/3511 ,  Y10T428/249921 ,  Y10T428/26 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.

公开(公告)号：US20170098593A1

公开(公告)日：2017-04-06

申请号：US15384158

申请日：2016-12-19

Applicant: Intel Corporation

Inventor： Feras EID ,  Jessica GULLBRAND ,  Melissa A. COWAN

IPC: H01L23/467 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01L23/467 ,  B05B17/0653 ,  B81C1/00238 ,  F04D33/00 ,  F15D1/008 ,  F15D1/08 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49838 ,  H01L2221/68345 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/10378

Abstract: Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.

公开(公告)号：US20160358841A1

公开(公告)日：2016-12-08

申请号：US14728705

申请日：2015-06-02

Applicant: INTEL CORPORATION

Inventor： Feras EID ,  Jessica GULLBRAND ,  Melissa A. COWAN

IPC: H01L23/467 ,  B05B17/06 ,  H01L21/683 ,  H05K1/18 ,  H05K1/02 ,  H01L21/48 ,  F15D1/00 ,  H01L23/498

CPC classification number: H01L23/467 ,  B05B17/0653 ,  B81C1/00238 ,  F04D33/00 ,  F15D1/008 ,  F15D1/08 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49838 ,  H01L2221/68345 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/10378

Abstract: Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.

Abstract translation: 实施例包括形成在封装衬底的层内的合成喷射装置，以便提供用于感测或冷却应用的受控气流。 喷射装置包括在顶部和底部空腔之间的导电材料的电磁驱动振动膜。 具有开口的顶盖覆盖顶部空腔，并且永久磁铁位于底部空腔下方。 通过膜传导的交流信号导致膜在由永磁体引起的磁场的存在下振动。 通过用封装成形工艺制造，与使用硅芯片或晶片加工相比，射流（1）的成本更高， （2）容易地集成为封装衬底的其他层的一部分并与其一起; 和（3）可以由安装在包装上的芯片驱动。 实施例还包括具有用于形成射流的方法和方法。

公开(公告)号：US20250079300A1

公开(公告)日：2025-03-06

申请号：US18240318

申请日：2023-08-30

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Neelam PRABHU GAUNKAR ,  Henning BRAUNISCH ,  Wenhao LI ,  Feras EID ,  Georgios C. DOGIAMIS

IPC: H01L23/522 ,  H01F1/03 ,  H01F41/16

Abstract: Magnetic inductors for microelectronics packages are provided. Magnetic inductive structures include a magnetic region, a magnetic region base region, and a conductive region that forms a channel within the magnetic region. The magnetic region has a different chemical composition than the base region. Additional structures are provided in which the magnetic region is recessed into a package substrate core. Further inductor structures are provided in which the conductive region includes through-core vias and the conductive region at least partially encircles a portion of a package substrate core. Additionally, methods of manufacture are provided for semiconductor packages that include magnetic inductors.