公开(公告)号：US20220369012A1

公开(公告)日：2022-11-17

申请号：US17878031

申请日：2022-07-31

Applicant: Merry Electronics(Shenzhen) Co., Ltd.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Kai-Yu Jiang ,  Yung-Hsiang Chang

IPC: H04R1/08 ,  H04R1/04 ,  H04R1/02

Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.

公开(公告)号：US10943870B2

公开(公告)日：2021-03-09

申请号：US16525538

申请日：2019-07-29

Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.

Inventor： Chao-Sen Chang

IPC: H01L23/538 ,  G01L5/00 ,  H01L23/13 ,  H01L23/31 ,  H04R1/04 ,  H04R19/04 ,  B81B7/00 ,  H01L23/00

Abstract: A microphone package structure includes a substrate, a metal housing, a MEMS microphone component and at least one integrated circuit component. The substrate has a first surface and a second surface that are opposite to each other. The metal housing is located on the first surface such that the substrate and the metal housing collectively define a hollow chamber. The MEMS microphone component is located on the metal housing and within the hollow chamber. The at least one integrated circuit component is located within a region of the second surface on which the metal housing has a vertical projection.

公开(公告)号：US20200059734A1

公开(公告)日：2020-02-20

申请号：US16162397

申请日：2018-10-17

Applicant: Merry Electronics(Shenzhen) Co., Ltd.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Kai-Yu Jiang

IPC: H04R17/00 ,  B81B3/00 ,  H04R19/02 ,  B81B7/02 ,  B81B7/04

Abstract: A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.

公开(公告)号：US20160368760A1

公开(公告)日：2016-12-22

申请号：US14940167

申请日：2015-11-13

Applicant: Merry Electronics(Shenzhen) Co., Ltd.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yung-Shiang Chang

IPC: B81B3/00

CPC classification number: B81B3/0027 ,  B81B2201/0257 ,  B81B2203/04 ,  B81B2207/015 ,  B81C1/00238

Abstract: A micro-electro-mechanical system (MEMS) chip package including a circuit substrate, a driving chip and a MEMS sensor is provided. The circuit substrate has a first surface and a second surface opposite thereto. The driving chip is embedded within the circuit substrate and includes a first signal transmission electrode, a second signal transmission electrode and a third signal transmission electrode. The MEMS sensor is disposed on the first surface of the circuit substrate. The circuit substrate includes at least one first conductive wiring electrically connected with the first signal transmission electrode and at least one second conductive wiring electrically connected with the second signal transmission electrode. The first conductive wiring is merely exposed at the first surface and the second conductive wiring is merely exposed at the second surface. The MEMS sensor is electrically connected with the first signal transmission electrode through the first conductive wiring.

Abstract translation: 提供了包括电路基板，驱动芯片和MEMS传感器的微电子机械系统（MEMS）芯片封装。 电路基板具有与其相对的第一表面和第二表面。 驱动芯片嵌入在电路基板内，包括第一信号传输电极，第二信号传输电极和第三信号传输电极。 MEMS传感器设置在电路基板的第一表面上。 电路基板包括与第一信号传输电极电连接的至少一个第一导电布线和与第二信号传输电极电连接的至少一个第二导电布线。 第一导电布线仅在第一表面露出，而第二导电布线仅在第二表面露出。 MEMS传感器通过第一导电布线与第一信号传输电极电连接。

公开(公告)号：US09162869B1

公开(公告)日：2015-10-20

申请号：US14448461

申请日：2014-07-31

Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yong-Shiang Chang

IPC: H04R23/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: H04R19/04 ,  B81B3/0021 ,  B81B7/0064 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00333 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/086 ,  H04R19/005 ,  H04R23/00 ,  H04R31/00 ,  H04R2201/003 ,  H01L2924/00014

Abstract: A MEMS microphone package structure having a non-planar substrate includes the non-planar substrate, a cover plate, and a sound wave transducer. The non-planar substrate has a carrying bottom portion and a sidewall. The carrying bottom portion has a sound hole. The cover plate covers the non-planar substrate from above and connects to the sidewall. Both the cover plate and the sidewall have a metal layer for shielding the microphone from electromagnetic interference. The sound wave transducer is located corresponding to the sound hole. Hence, the sidewall reinforces the non-planar substrate, such that the carrying bottom portion is thinned without weakening the non-planar substrate, so as to increase the capacity of a back chamber of the microphone without changing the appearance and dimensions of the package structure.

Abstract translation: 具有非平面基板的MEMS麦克风封装结构包括非平面基板，盖板和声波换能器。 非平面基板具有承载底部和侧壁。 承载底部具有声孔。 盖板从上方覆盖非平面基板并连接到侧壁。 盖板和侧壁均具有用于屏蔽麦克风免受电磁干扰的金属层。 声波传感器对应于声孔。 因此，侧壁加强了非平面基板，使得承载底部部分变薄而不削弱非平面基板，从而增加了麦克风的后室的容量，而不改变封装结构的外观和尺寸 。

公开(公告)号：US09036838B2

公开(公告)日：2015-05-19

申请号：US13939454

申请日：2013-07-11

Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yong-Shiang Chang

IPC: H04R25/00 ,  H04R7/16

CPC classification number: H04R7/16 ,  H04R7/06 ,  H04R7/20 ,  H04R19/005

Abstract: A dual-diaphragm acoustic transducer includes a substrate defining an opening, an inner diaphragm and an outer diaphragm concentrically mounted at one same side of the substrate corresponding to the opening of the substrate, and a plurality of elastic supporting members connected between the outer perimeter of the inner diaphragm and the inner perimeter of the outer diaphragm. Thus, when a sound wave enters the opening of the substrate, the sound wave pressure forces the outer diaphragm to displace and to carry the inner diaphragm to move, and the inner diaphragm itself will also be forced by the sound wave pressure to have a larger displacement than the outer diaphragm, enhancing the sensitivity. Further, using the inner and outer diaphragms to respond to different sound wave pressures can enhance the sound wave pressure sensing range.

Abstract translation: 双隔膜声换能器包括限定开口的基板，同心地安装在与基板的开口相对应的基板的同一侧的内隔膜和外隔膜，以及连接在基板的外周边之间的多个弹性支撑构件 内隔膜和外隔膜的内周。 因此，当声波进入基板的开口时，声波压力迫使外隔膜移位并携带内隔膜移动，并且内隔膜本身也将被声波压力强制以具有较大的 位移比外隔膜增加灵敏度。 此外，使用内膜和外隔膜响应不同的声波压力可以增强声波压力感测范围。