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公开(公告)号：US10972844B1
公开(公告)日：2021-04-06
申请号：US16831829
申请日：2020-03-27
Applicant: Merry Electronics(Shenzhen) Co., Ltd.
Inventor： Yen Ta Chiang , Hung-Chi Lin , Chao-Sen Chang
IPC: H04R3/00 , G10L21/0216 , H04R1/10 , H04R25/00 , H04R1/04
Abstract: The invention provides an earphone and a set of earphones. The earphone includes a processing circuit and a filtering module. The processing circuit acquires a first speech signal and performs a pre-processing operation on the first speech signal to generate a second speech signal. The filtering module includes high-pass, low-pass, and band-pass filters. The processing circuit is further configured to: receive first, second, and third signals respectively from the high-pass, low-pass, and band-pass filters; perform a noise reduction operation on the second and third signals to generate a fourth signal; and perform a signal synthesis operation on the first and fourth signals to synthesize the first and fourth signals to form an output speech signal.
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公开(公告)号：US20200322731A1
公开(公告)日：2020-10-08
申请号：US16909973
申请日：2020-06-23
Applicant: Merry Electronics(Shenzhen) Co., Ltd.
Inventor： Jen-Yi Chen , Chao-Sen Chang , Yung-Hsiang Chang
Abstract: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions and a plurality of elastic structures. The elastic structures are concentrically arranged along peripheries of the vibratile portions. The acoustic transducer further has a connecting portion extending from the back plate to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The elastic structures include a first elastic structure and a second elastic structures arranged alongside of the boundary, and a third elastic structure arranged along an outer periphery of the vibrating membrane. The vibratile portions are geometrically different from each other and different in rigidity, and the vibratile portions can vibrate independently to respond to various sound pressure levels.
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公开(公告)号：US20170257708A1
公开(公告)日：2017-09-07
申请号：US15604670
申请日：2017-05-25
Applicant: Merry Electronics(Shenzhen) Co., Ltd.
Inventor： Jen-Yi Chen , Chao-Sen Chang , Chun-Chieh Wang , Yong-Shiang Chang
IPC: G01J3/50
CPC classification number: H04R19/005 , H04R7/06 , H04R19/04
Abstract: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions. The acoustic transducer further has a connecting portion that is connected to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The vibratile portions are geometrically different. Thereby, the vibratile portions can vibrate independently. This allows a designer to easily enhance the dynamic range of the acoustic transducer by geometrically modifying the vibrating membrane without increasing the total area of the vibrating membrane while maintaining a certain good degree of sensitivity and signal-to-noise ratio.
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公开(公告)号：US09656853B2
公开(公告)日：2017-05-23
申请号：US14940167
申请日：2015-11-13
Applicant: Merry Electronics(Shenzhen) Co., Ltd.
Inventor： Jen-Yi Chen , Chao-Sen Chang , Chun-Chieh Wang , Yung-Shiang Chang
IPC: B81B3/00
CPC classification number: B81B3/0027 , B81B2201/0257 , B81B2203/04 , B81B2207/015 , B81C1/00238
Abstract: A micro-electro-mechanical system (MEMS) chip package including a circuit substrate, a driving chip and a MEMS sensor is provided. The circuit substrate has a first surface and a second surface opposite thereto. The driving chip is embedded within the circuit substrate and includes a first signal transmission electrode, a second signal transmission electrode and a third signal transmission electrode. The MEMS sensor is disposed on the first surface of the circuit substrate. The circuit substrate includes at least one first conductive wiring electrically connected with the first signal transmission electrode and at least one second conductive wiring electrically connected with the second signal transmission electrode. The first conductive wiring is merely exposed at the first surface and the second conductive wiring is merely exposed at the second surface. The MEMS sensor is electrically connected with the first signal transmission electrode through the first conductive wiring.
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5.发明授权公开(公告)号：US11800298B2
公开(公告)日：2023-10-24
申请号：US17738025
申请日：2022-05-06
Applicant: Merry Electronics(Shenzhen) Co., Ltd.
Inventor： Jen-Yi Chen , Yueh-Kang Lee , Chao-Sen Chang
CPC classification number: H04R1/04 , B81B7/0061 , G01H3/00 , H04R3/00 , H04R7/04 , B81B2201/0257 , B81B2203/0127 , H04R2201/003
Abstract: A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.
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Patent Agency Ranking
公开(公告)号：US10972840B2
公开(公告)日：2021-04-06
申请号：US16452546
申请日：2019-06-26
Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
Inventor： Jen-Yi Chen , Yueh-Kang Lee , Kai-Yu Jiang , Chao-Sen Chang
Abstract: A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.
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公开(公告)号：US10710868B2
公开(公告)日：2020-07-14
申请号：US16262927
申请日：2019-01-31
Applicant: Merry Electronics(Shenzhen) Co., Ltd.
Inventor： Kai-Yu Jiang , Jen-Yi Chen , Chao-Sen Chang
Abstract: A MEMS sensor including an electrode plate, a diaphragm structure, a support structure, and a pressure relief film. The electrode plate has a conductive portion. The diaphragm structure is disposed at a side of the electrode plate with an interval, and has a sensing film. The support structure is disposed between the diaphragm structure and the electrode plate, and surrounds an electrical coupling zone and a gas flow zone. The support structure includes an inner wall and an outer wall. An outer edge of the gas flow zone is surrounded by the inner wall. An outer edge of the electrical coupling zone is surrounded by the outer wall. The pressure relief film covers the gas flow zone.
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公开(公告)号：US20190222940A1
公开(公告)日：2019-07-18
申请号：US15913938
申请日：2018-03-07
Applicant: Merry Electronics(Shenzhen) Co., Ltd.
Inventor： Jen-Yi Chen , Chao-Sen Chang , Kai-Yu Jiang , Jui-Chin Peng
IPC: H04R17/02 , H01L41/047 , H01L41/053 , H01L41/113
Abstract: A piezoelectric transducer including a substrate, a piezoelectric layer and a stiffening structure is provided. The substrate has a chamber. The piezoelectric layer has a displacement zone, a plurality of sensing zones, a plurality of gaps, a plurality of top electrodes, and a plurality of bottom electrodes. The displacement zone is located over the chamber. The sensing zones are surroundingly connected to an outer edge of the displacement zone and are located over the chamber. The gaps are each formed between any adjacent two of the plurality of sensing zones, and each of the gaps communicates with the chamber. The top electrodes are each disposed on a top surface of each of the sensing zones. The bottom electrodes are each disposed on a bottom surface of each of the sensing zones. The stiffening structure is disposed on a bottom of the displacement zone.
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公开(公告)号：US11561129B2
公开(公告)日：2023-01-24
申请号：US17381207
申请日：2021-07-21
Applicant: Merry Electronics(Shenzhen) Co., Ltd.
Inventor： Jen-Yi Chen , Yueh-Kang Lee , Chao-Sen Chang , Kai-Yu Jiang
Abstract: A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.
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公开(公告)号：US20220408197A1
公开(公告)日：2022-12-22
申请号：US17738025
申请日：2022-05-06
Applicant: Merry Electronics(Shenzhen) Co., Ltd.
Inventor： Jen-Yi Chen , Yueh-Kang Lee , Chao-Sen Chang
Abstract: A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.
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