公开(公告)号：US09369808B2

公开(公告)日：2016-06-14

申请号：US14056232

申请日：2013-10-17

Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yong-Shiang Chang

IPC: H04R25/00 ,  H04R19/00 ,  B81C1/00 ,  H04R19/04 ,  H04R31/00

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C1/00182 ,  H04R19/04 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11

Abstract: An acoustic transducer with high sensitivity includes a base plate, a back plate and a vibrating membrane. The vibrating membrane is peripherally fixed to the base plate and covers an opening of the base plate. The back plate has a positioning member connected between the back plate and the vibrating membrane, so as to define at least one vibratile portion that is arranged annularly by a plurality of elastic members. Thereby, the vibratile portion has a reduced deformable width and increased rigidity, so can effectively improve its acoustically receiving sensitivity and signal-to-noise ratio.

Abstract translation: 具有高灵敏度的声学传感器包括基板，背板和振动膜。 振动膜周边固定在基板上并覆盖基板的开口。 背板具有连接在背板和振动膜之间的定位构件，以便限定由多个弹性构件环状布置的至少一个振动部。 因此，振动部具有减小的可变形宽度和增加的刚度，因此可以有效地提高其声学接收灵敏度和信噪比。

公开(公告)号：US09319772B2

公开(公告)日：2016-04-19

申请号：US14310723

申请日：2014-06-20

Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yong-Shiang Chang

IPC: H04R3/00 ,  H04R1/28 ,  H04R1/04 ,  B81B7/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R1/28 ,  B81B7/0032 ,  H01L2224/48137 ,  H01L2224/48221 ,  H04R1/04 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A multi-floor type MEMS microphone includes a housing formed by a stack of circuit boards and provided with a first cavity, a second cavity in vertical communication with the first cavity, and a sound hole in communication with the second cavity. The second cavity has a vertical cross-sectional area smaller than that of the first cavity. A MEMS transducer is disposed in the second cavity and electrically conducted with the housing, and an ASIC chip is disposed in the first cavity and electrically conducted with the housing. By this design, the volume of the back chamber of a vibrating diaphragm of the MEMS transducer can be increased in a limited space of the housing, and thus the sensitivity of the microphone can be improved.

Abstract translation: 多层型MEMS麦克风包括由电路板堆叠形成的壳体，其具有第一腔体，与第一空腔垂直连通的第二空腔和与第二空腔连通的声孔。 第二腔的垂直截面积小于第一腔。 MEMS换能器设置在第二腔中并与外壳电连接，并且ASIC芯片设置在第一空腔中并与外壳电连接。 通过这种设计，可以在壳体的有限空间中增加MEMS换能器的振动膜的后室的体积，从而可以提高麦克风的灵敏度。

公开(公告)号：US20170257708A1

公开(公告)日：2017-09-07

申请号：US15604670

申请日：2017-05-25

Applicant: Merry Electronics(Shenzhen) Co., Ltd.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yong-Shiang Chang

IPC: G01J3/50

CPC classification number: H04R19/005 ,  H04R7/06 ,  H04R19/04

Abstract: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions. The acoustic transducer further has a connecting portion that is connected to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The vibratile portions are geometrically different. Thereby, the vibratile portions can vibrate independently. This allows a designer to easily enhance the dynamic range of the acoustic transducer by geometrically modifying the vibrating membrane without increasing the total area of the vibrating membrane while maintaining a certain good degree of sensitivity and signal-to-noise ratio.

公开(公告)号：US09656853B2

公开(公告)日：2017-05-23

申请号：US14940167

申请日：2015-11-13

Applicant: Merry Electronics(Shenzhen) Co., Ltd.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yung-Shiang Chang

IPC: B81B3/00

CPC classification number: B81B3/0027 ,  B81B2201/0257 ,  B81B2203/04 ,  B81B2207/015 ,  B81C1/00238

Abstract: A micro-electro-mechanical system (MEMS) chip package including a circuit substrate, a driving chip and a MEMS sensor is provided. The circuit substrate has a first surface and a second surface opposite thereto. The driving chip is embedded within the circuit substrate and includes a first signal transmission electrode, a second signal transmission electrode and a third signal transmission electrode. The MEMS sensor is disposed on the first surface of the circuit substrate. The circuit substrate includes at least one first conductive wiring electrically connected with the first signal transmission electrode and at least one second conductive wiring electrically connected with the second signal transmission electrode. The first conductive wiring is merely exposed at the first surface and the second conductive wiring is merely exposed at the second surface. The MEMS sensor is electrically connected with the first signal transmission electrode through the first conductive wiring.

公开(公告)号：US20160368760A1

公开(公告)日：2016-12-22

申请号：US14940167

申请日：2015-11-13

Applicant: Merry Electronics(Shenzhen) Co., Ltd.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yung-Shiang Chang

IPC: B81B3/00

CPC classification number: B81B3/0027 ,  B81B2201/0257 ,  B81B2203/04 ,  B81B2207/015 ,  B81C1/00238

Abstract: A micro-electro-mechanical system (MEMS) chip package including a circuit substrate, a driving chip and a MEMS sensor is provided. The circuit substrate has a first surface and a second surface opposite thereto. The driving chip is embedded within the circuit substrate and includes a first signal transmission electrode, a second signal transmission electrode and a third signal transmission electrode. The MEMS sensor is disposed on the first surface of the circuit substrate. The circuit substrate includes at least one first conductive wiring electrically connected with the first signal transmission electrode and at least one second conductive wiring electrically connected with the second signal transmission electrode. The first conductive wiring is merely exposed at the first surface and the second conductive wiring is merely exposed at the second surface. The MEMS sensor is electrically connected with the first signal transmission electrode through the first conductive wiring.

Abstract translation: 提供了包括电路基板，驱动芯片和MEMS传感器的微电子机械系统（MEMS）芯片封装。 电路基板具有与其相对的第一表面和第二表面。 驱动芯片嵌入在电路基板内，包括第一信号传输电极，第二信号传输电极和第三信号传输电极。 MEMS传感器设置在电路基板的第一表面上。 电路基板包括与第一信号传输电极电连接的至少一个第一导电布线和与第二信号传输电极电连接的至少一个第二导电布线。 第一导电布线仅在第一表面露出，而第二导电布线仅在第二表面露出。 MEMS传感器通过第一导电布线与第一信号传输电极电连接。

公开(公告)号：US09162869B1

公开(公告)日：2015-10-20

申请号：US14448461

申请日：2014-07-31

Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yong-Shiang Chang

IPC: H04R23/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: H04R19/04 ,  B81B3/0021 ,  B81B7/0064 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00333 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/086 ,  H04R19/005 ,  H04R23/00 ,  H04R31/00 ,  H04R2201/003 ,  H01L2924/00014

Abstract: A MEMS microphone package structure having a non-planar substrate includes the non-planar substrate, a cover plate, and a sound wave transducer. The non-planar substrate has a carrying bottom portion and a sidewall. The carrying bottom portion has a sound hole. The cover plate covers the non-planar substrate from above and connects to the sidewall. Both the cover plate and the sidewall have a metal layer for shielding the microphone from electromagnetic interference. The sound wave transducer is located corresponding to the sound hole. Hence, the sidewall reinforces the non-planar substrate, such that the carrying bottom portion is thinned without weakening the non-planar substrate, so as to increase the capacity of a back chamber of the microphone without changing the appearance and dimensions of the package structure.

Abstract translation: 具有非平面基板的MEMS麦克风封装结构包括非平面基板，盖板和声波换能器。 非平面基板具有承载底部和侧壁。 承载底部具有声孔。 盖板从上方覆盖非平面基板并连接到侧壁。 盖板和侧壁均具有用于屏蔽麦克风免受电磁干扰的金属层。 声波传感器对应于声孔。 因此，侧壁加强了非平面基板，使得承载底部部分变薄而不削弱非平面基板，从而增加了麦克风的后室的容量，而不改变封装结构的外观和尺寸 。

公开(公告)号：US09036838B2

公开(公告)日：2015-05-19

申请号：US13939454

申请日：2013-07-11

Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yong-Shiang Chang

IPC: H04R25/00 ,  H04R7/16

CPC classification number: H04R7/16 ,  H04R7/06 ,  H04R7/20 ,  H04R19/005

Abstract: A dual-diaphragm acoustic transducer includes a substrate defining an opening, an inner diaphragm and an outer diaphragm concentrically mounted at one same side of the substrate corresponding to the opening of the substrate, and a plurality of elastic supporting members connected between the outer perimeter of the inner diaphragm and the inner perimeter of the outer diaphragm. Thus, when a sound wave enters the opening of the substrate, the sound wave pressure forces the outer diaphragm to displace and to carry the inner diaphragm to move, and the inner diaphragm itself will also be forced by the sound wave pressure to have a larger displacement than the outer diaphragm, enhancing the sensitivity. Further, using the inner and outer diaphragms to respond to different sound wave pressures can enhance the sound wave pressure sensing range.

Abstract translation: 双隔膜声换能器包括限定开口的基板，同心地安装在与基板的开口相对应的基板的同一侧的内隔膜和外隔膜，以及连接在基板的外周边之间的多个弹性支撑构件 内隔膜和外隔膜的内周。 因此，当声波进入基板的开口时，声波压力迫使外隔膜移位并携带内隔膜移动，并且内隔膜本身也将被声波压力强制以具有较大的 位移比外隔膜增加灵敏度。 此外，使用内膜和外隔膜响应不同的声波压力可以增强声波压力感测范围。

公开(公告)号：US20170057808A1

公开(公告)日：2017-03-02

申请号：US14927497

申请日：2015-10-30

Applicant: Merry Electronics(Shenzhen) Co., Ltd.

Inventor： Chao-Sen Chang ,  Yung-Shiang Chang ,  Jen-Yi Chen ,  Chun-Chieh Wang

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B7/0064 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2203/0154 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: Provided is a micro-electro-mechanical system (MEMS) chip package, including a circuit substrate, a MEMS chip, a driving chip, a cover, an insulator, and at least one first pad. The circuit substrate has a first surface and a second surface opposite to each other. The circuit substrate has a sound port passing through the first surface and the second surface. The MEMS chip is disposed on the first surface of the circuit substrate. The driving chip is electrically connected to the MEMS chip. The cover is disposed on the first surface of the circuit substrate. The cover covers the MEMS chip and the driving chip. The insulator covers the cover. The first pad is electrically connected to the driving chip by a first electrical path.

Abstract translation: 提供了一种微机电系统（MEMS）芯片封装，包括电路基板，MEMS芯片，驱动芯片，盖，绝缘体和至少一个第一焊盘。 电路基板具有彼此相对的第一表面和第二表面。 电路基板具有通过第一表面和第二表面的声音端口。 MEMS芯片设置在电路基板的第一表面上。 驱动芯片电连接到MEMS芯片。 盖设置在电路基板的第一表面上。 封面覆盖了MEMS芯片和驱动芯片。 绝缘体覆盖盖子。 第一焊盘通过第一电路与驱动芯片电连接。

公开(公告)号：US09193581B1

公开(公告)日：2015-11-24

申请号：US14448529

申请日：2014-07-31

Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.

Inventor： Chao-Sen Chang ,  Yong-Shiang Chang ,  Jen-Yi Chen ,  Chun-Chieh Wang

IPC: H04R19/00 ,  B81B7/00 ,  B81C1/00

CPC classification number: H04R1/2807 ,  B81B7/0061 ,  B81B7/0077 ,  B81B2207/012 ,  B81C1/00333 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R2201/003 ,  H04R2410/03

Abstract: An MEMS microphone package structure includes a substrate, a carrier and an acoustic transducer. The carrier covers the substrate from above and connects to the substrate. The carrier has an n-shaped cross section and includes a flat plate portion, a sidewall connected to the flat plate portion, and two oblique blocks protruded from the inner surface of the sidewall. The oblique blocks each have an inclined surface for connecting the flat plate portion and the bottom surface of the sidewall. The acoustic transducer is posited on the bottom surface of the flat plate portion and electrically connected to the substrate through a plurality of electrical conduction paths passing through the inclined surfaces. The electrical conduction paths are conducive to simplification of wirings of the substrate and the thinning of the substrate. Therefore, simplify the manufacturing process to reduce the manufacturing time and cost.

Abstract translation: MEMS麦克风封装结构包括基板，载体和声换能器。 载体从上方覆盖基板并连接到基板。 载体具有n形横截面，并且包括平板部分，连接到平板部分的侧壁和从侧壁的内表面突出的两个倾斜块体。 倾斜块各自具有用于连接平板部分和侧壁的底表面的倾斜表面。 声换能器被放置在平板部分的底表面上，并通过穿过倾斜表面的多个导电路径与基板电连接。 导电路径有助于简化衬底的布线和衬底的变薄。 因此，简化制造过程，减少制造时间和成本。