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公开(公告)号：US20150189765A1
公开(公告)日：2015-07-02
申请号：US14506251
申请日：2014-10-03
Applicant: Metrospec Technology, L.L.C.
Inventor： Henry V. Holec , Wm. Todd Crandell , Eric Henry Holec
CPC classification number: H05K3/363 , B23K1/0016 , B23K37/04 , F21Y2107/30 , F21Y2115/10 , H01R4/02 , H01R12/61 , H05K1/0269 , H05K1/118 , H05K1/144 , H05K1/147 , H05K1/189 , H05K2201/0311 , H05K2201/058 , H05K2201/09481 , H05K2201/09918 , H05K2201/10106 , H05K2203/0195 , H05K2203/0228 , H05K2203/043 , H05K2203/16
Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.
Abstract translation: 本发明的实施例包括柔性电路板互连和相关的方法。 在一个实施例中，本发明包括将多个柔性电路板连接在一起的方法，包括在第一柔性电路板的上表面和第二柔性电路板的下表面之间施加焊料组合物的步骤; 将第一柔性电路板的上表面和第二柔性电路板的下表面保持在一起; 并且用热源回流焊料组合物，以将第一柔性电路板和第二柔性电路板结合在一起，以分别形成长度大于第一柔性电路板或第二柔性电路板的长度的柔性电路板条。 在一个实施例中，本发明包括用于将柔性电路板保持在一起的电路板夹，所述夹具包括u形紧固件; 连接到U形紧固件的弹簧张力臂; 以及连接到弹簧张力臂的连接机构。 本文还包括其它实施例。
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公开(公告)号：US20140197743A1
公开(公告)日：2014-07-17
申请号：US14216182
申请日：2014-03-17
Applicant: Metrospec Technology, L.L.C.
Inventor： Henry V. Holec , Wm. Todd Crandell
IPC: H05B33/08
CPC classification number: H05B33/083 , F21K9/20 , F21V23/005 , F21Y2107/30 , F21Y2115/10 , H05B33/0815 , H05B33/0896 , H05K1/0263 , H05K2201/09309 , H05K2201/10106 , H05K2201/10166
Abstract: In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.
Abstract translation: 在一些实施例中，固态照明电路可以包括以下特征中的一个或多个：（a）可操作地连接到电源的多个发射器（b）与限流装置可操作地耦合的电源，其中一个 或更多的发射器被切换电路旁路，以及（c）至少一个MOSFET开关，其可操作地耦合到分压器电路。
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公开(公告)号：US08710764B2
公开(公告)日：2014-04-29
申请号：US13791228
申请日：2013-03-08
Applicant: Metrospec Technology, L.L.C.
Inventor： Henry V. Holec , Wm. Todd Crandell
IPC: H05B37/02
CPC classification number: H05B33/083 , F21K9/20 , F21V23/005 , F21Y2107/30 , F21Y2115/10 , H05B33/0815 , H05B33/0896 , H05K1/0263 , H05K2201/09309 , H05K2201/10106 , H05K2201/10166
Abstract: In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.
Abstract translation: 在一些实施例中，固态照明电路可以包括以下特征中的一个或多个：（a）可操作地连接到电源的多个发射器（b）与限流装置可操作地耦合的电源，其中一个 或更多的发射器被切换电路旁路，以及（c）至少一个MOSFET开关，其可操作地耦合到分压器电路。
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