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    Flexible circuit board interconnection and methods
    1.
    发明授权
    Flexible circuit board interconnection and methods 有权

    公开(公告)号：US11304308B2

    公开(公告)日：2022-04-12

    申请号：US16698127

    申请日：2019-11-27

    Applicant: Metrospec Technology, L.L.C.

    Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

    IPC: B23K1/00 ,  B23K37/04 ,  H05K3/36 ,  H01R4/02 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H01R12/61 ,  H05K1/18 ,  F21Y115/10 ,  F21Y107/30

    Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

    FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS
    3.
    发明申请
    FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS 审中-公开

    公开(公告)号：US20200275556A1

    公开(公告)日：2020-08-27

    申请号：US16698127

    申请日：2019-11-27

    Applicant: Metrospec Technology, L.L.C.

    Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

    IPC: H05K3/36 ,  B23K37/04 ,  H01R4/02 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H01R12/61 ,  B23K1/00 ,  H05K1/18

    Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

    FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS
    5.
    发明申请
    FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS 有权
    柔性电路板互连和方法

    公开(公告)号：US20150189765A1

    公开(公告)日：2015-07-02

    申请号：US14506251

    申请日：2014-10-03

    Applicant: Metrospec Technology, L.L.C.

    Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

    IPC: H05K3/36 ,  B23K37/04 ,  B23K1/00 ,  H05K1/18 ,  H05K1/14

    CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K37/04 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01R4/02 ,  H01R12/61 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0311 ,  H05K2201/058 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2203/0195 ,  H05K2203/0228 ,  H05K2203/043 ,  H05K2203/16

    Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

    Abstract translation: 本发明的实施例包括柔性电路板互连和相关的方法。 在一个实施例中，本发明包括将多个柔性电路板连接在一起的方法，包括在第一柔性电路板的上表面和第二柔性电路板的下表面之间施加焊料组合物的步骤; 将第一柔性电路板的上表面和第二柔性电路板的下表面保持在一起; 并且用热源回流焊料组合物，以将第一柔性电路板和第二柔性电路板结合在一起，以分别形成长度大于第一柔性电路板或第二柔性电路板的长度的柔性电路板条。 在一个实施例中，本发明包括用于将柔性电路板保持在一起的电路板夹，所述夹具包括u形紧固件; 连接到U形紧固件的弹簧张力臂; 以及连接到弹簧张力臂的连接机构。 本文还包括其它实施例。

    SELF-LEARNING MACHINE VISION SYSTEM
    6.
    发明申请
    SELF-LEARNING MACHINE VISION SYSTEM 审中-公开
    自学机器视觉系统

    公开(公告)号：US20130278750A1

    公开(公告)日：2013-10-24

    申请号：US13866297

    申请日：2013-04-19

    Applicant: METROSPEC TECHNOLOGY, L.L.C.

    Inventor： Eric Henry Holec

    IPC: H04N7/18

    CPC classification number: H04N7/18 ,  G06T7/001 ,  G06T2207/10016 ,  G06T2207/30141

    Abstract: Embodiments of the invention include systems and methods relating to self-learning machine vision systems. In an embodiment, the invention includes a self-learning machine vision system including a video input; a processor in communication with the video input; and a video output in communication with the processor. The processor is configured to process video data from the video input and identify a number of repeating units within the video data. The processor is further configured to identify repeating units that deviate from the other repeating units. The system can further display an image of the repeating units through the video output with indicia to indicate identified deviant repeating units. In an embodiment, the invention includes a method of identifying defects in a stream of produced items including processing video data from a video input with a computing system; identifying a number of repeating units within the video data; identifying repeating units that deviate from the other repeating units by comparing the repeating with one another; and displaying an image of the repeating units through a video output with indicia to indicate identified deviant repeating units. Other embodiments are also included herein.

    Abstract translation: 本发明的实施例包括与自学习机器视觉系统有关的系统和方法。 在一个实施例中，本发明包括一个包括视频输入的自学习机器视觉系统; 与视频输入通信的处理器; 以及与处理器通信的视频输出。 处理器被配置为处理来自视频输入的视频数据并识别视频数据内的多个重复单元。 处理器还被配置为识别偏离其他重复单元的重复单元。 该系统可以通过具有标记的视频输出进一步显示重复单元的图像，以指示识别的偏差重复单元。 在一个实施例中，本发明包括一种识别所生产物品流中的缺陷的方法，包括利用计算系统处理来自视频输入的视频数据; 识别视频数据内的多个重复单元; 通过比较重复而确定偏离其他重复单元的重复单元; 并通过具有标记的视频输出显示重复单元的图像，以指示识别的偏离重复单元。 本文还包括其它实施例。

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