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公开(公告)号：US20130147670A1
公开(公告)日：2013-06-13
申请号：US13760196
申请日：2013-02-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shinichi NAKANO , Hiroyuki KUBO , Kuniaki YOSUI
CPC classification number: H01Q1/243 , G06K19/0723 , G06K19/07773 , G06K19/07781 , H01F38/14 , H01Q1/2216 , H01Q1/521 , H01Q7/06 , H04M1/026 , H04M1/7253 , H04M2250/04
Abstract: An RFID antenna is arranged in the vicinity of a metal portion of and on an outer surface side of a casing of a communication terminal device. The RFID antenna includes a magnetic core, and a coil conductor that is wound around the magnetic core. The coil conductor includes a first conductor portion positioned on a first main surface side of the magnetic core and a second conductor portion positioned on the second main surface side of the magnetic core and arranged at a different position than the first conductor portion when viewed in plan from the direction of the first and second main surfaces, and the coil conductor is arranged such that the first main surface side of the magnetic core is on the metal portion side and such that the first conductor portion of the coil conductor faces a leading end portion of the casing.
Abstract translation: 在通信终端装置的外壳的金属部分的外表面侧附近配置有RFID天线。 RFID天线包括磁芯和卷绕在磁芯上的线圈导体。 线圈导体包括位于磁芯的第一主表面侧的第一导体部分和位于磁芯的第二主表面侧的第二导体部分，并且当在计划中观察时布置在与第一导体部分不同的位置 从第一主表面和第二主表面的方向，线圈导体被布置成使得磁芯的第一主表面侧在金属部分侧，并且使得线圈导体的第一导体部分面向前端部分 的套管。
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公开(公告)号：US20130099994A1
公开(公告)日：2013-04-25
申请号：US13706409
申请日：2012-12-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI
CPC classification number: H01Q1/2283 , G06K7/10237 , H01Q1/2291 , H01Q1/243 , H01Q1/36 , H01Q7/00 , H01Q19/00 , H04B5/0093
Abstract: In an antenna apparatus, a first current is induced in a first booster conductor by a current flowing through a coil conductor of a power feed antenna, and the first current circulates along a circumference of the first booster conductor. A second current is induced in a second booster conductor by the current flowing through the coil conductor of the power feed antenna, and the second current circulates along a circumference of the second booster conductor. A third current is induced in the first booster conductor by the second current flowing through the second booster conductor, and the third current circulates along the circumference of the first booster conductor. Thus, the antenna apparatus is much less influenced by nearby metallic objects and a shape of an included radiation plate may be more freely determined without requiring a highly accurate positional relationship between the radiation plate and the coil conductor.
Abstract translation: 在天线装置中，通过流过馈电天线的线圈导体的电流在第一升压导体中感应出第一电流，并且第一电流沿第一升压导体的圆周循环。 通过流过馈电天线的线圈导体的电流在第二升压导体中感应出第二电流，并且第二电流沿着第二增压导体的圆周循环。 通过流过第二升压导体的第二电流在第一升压导体中感应第三电流，并且第三电流沿着第一升压导体的圆周循环。 因此，天线装置受到附近的金属物体的影响较小，并且可以更自由地确定所包含的辐射板的形状，而不需要辐射板和线圈导体之间的高度准确的位置关系。
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公开(公告)号：US20230100141A1
公开(公告)日：2023-03-30
申请号：US18071673
申请日：2022-11-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Ryutatsu MIZUKAMI , Shuichi KEZUKA , Kuniaki YOSUI , Tomohiro NAGAI
IPC: H01P3/08
Abstract: A transmission line includes an element body and a signal conductor layer in the element body and having a linear shape. The transmission line includes a first, second, and third impedance sections, an impedance conversion section, and a reflection section. The second impedance section, the reflection section, the first impedance section, the impedance conversion section, and the third impedance section are positioned in this order along the signal conductor layer. Characteristic impedance of the first impedance section is lower than characteristic impedance in the second impedance section and characteristic impedance in the third impedance section. A change amount of characteristic impedance per unit length in the reflection section is larger than a change amount of characteristic impedance per unit length in the impedance conversion section.
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公开(公告)号：US20200176164A1
公开(公告)日：2020-06-04
申请号：US16784283
申请日：2020-02-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kosuke NISHINO , Kuniaki YOSUI
Abstract: A stacked body includes a base including a plurality of insulating base material layers, a coil including a winding-shaped conductive pattern located on at least one of the plurality of the insulating base material layers, and an electrically isolated dummy pattern extending along at least a portion of the coil outside of the coil on at least one of the plurality of the insulating base material layers in a plan view, wherein the stacked body includes a step at which a thickness of the stacked body is different in a stacking direction, and the dummy pattern is located between the coil and the step at a portion defining the step where the thickness of the stacked body is larger.
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公开(公告)号：US20190035550A1
公开(公告)日：2019-01-31
申请号：US16145245
申请日：2018-09-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI
Abstract: A multilayer substrate includes a lamination body including first and second resin substrates and a bonding layer that are hot-pressed. The first resin substrate includes a first surface provided with a first conductor pattern including a surface defined by a plated film, and a second surface provided with a second conductor pattern including a surface defined by a plated film. The second resin substrate includes a third surface provided with a third conductor pattern including a surface defined by a plated film, and a fourth surface provided with a fourth conductor pattern including a surface defined by a plated film. The first conductor pattern is located closer to a first outermost layer than the second conductor pattern. T1
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Patent Agency Ranking
26.发明申请公开(公告)号：US20180213653A1
公开(公告)日：2018-07-26
申请号：US15928175
申请日：2018-03-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru TAGO , Kuniaki YOSUI , Yuki ITO
CPC classification number: H05K3/32 , H05K1/0271 , H05K1/111 , H05K1/116 , H05K1/181 , H05K3/0011 , H05K3/3436 , H05K3/4069 , H05K3/46 , H05K3/4632 , H05K2201/0129 , H05K2201/0141 , H05K2201/10734 , H05K2203/0285
Abstract: A resin substrate includes a thermoplastic resin base body, a mounting land conductor on a surface of the resin base body to be connected to a component, first and second reinforcement conductor patterns, and first interlayer connection conductors. The first and second reinforcement conductor patterns are each embedded in the resin base body and have a planar shape that includes a position overlapping the mounting land conductor when viewing the resin base body in plan view. The first interlayer connection conductors connect the first and second reinforcement conductor patterns in a thickness direction of the resin base body. The first interlayer connection conductors are arranged at positions different from the mounting land conductor when viewing the resin base body in plan view.
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27.发明申请公开(公告)号：US20170271243A1
公开(公告)日：2017-09-21
申请号：US15616996
申请日：2017-06-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Keisuke IKENO
IPC: H01L23/498 , H01L21/48 , H01L23/00
CPC classification number: H01L23/4985 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L23/12 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/562 , H01L24/17 , H01L24/81 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/17132 , H01L2224/81 , H01L2224/81191 , H01L2224/81205 , H01L2924/14 , H01L2924/35 , H05K1/02 , H05K3/32
Abstract: A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly in a floating state. When the element assembly is viewed from a normal direction of the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances D1 to Dn is defined as an average Dave, and an area within a circle having a center on the m-th external electrode and having a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am having a radius of Dm greater than the average Dave when viewed from the normal direction.
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公开(公告)号：US20170188459A1
公开(公告)日：2017-06-29
申请号：US15442769
申请日：2017-02-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Bunta OKAMOTO , Isamu MORITA , Jun SASAKI
CPC classification number: H05K1/115 , H05K1/0237 , H05K1/025 , H05K1/117 , H05K1/165 , H05K3/105 , H05K3/18 , H05K3/182 , H05K3/403 , H05K3/46 , H05K3/4617 , H05K3/4632 , H05K2201/041 , H05K2201/09354 , H05K2203/107
Abstract: A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.
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公开(公告)号：US20170069945A1
公开(公告)日：2017-03-09
申请号：US15356739
申请日：2016-11-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro BABA , Kuniaki YOSUI
IPC: H01P3/08
Abstract: A high-frequency signal transmission line includes a dielectric body, a signal conductor, and a ground conductor. The dielectric body extends along a high-frequency signal transmission direction. The signal conductor is in the dielectric body and extends along the high-frequency signal transmission direction. The ground conductor is in the dielectric body and is electromagnetically coupled to the signal conductor. The dielectric body includes, along the high-frequency signal transmission direction, a plurality of straight portions and a curved portion connecting the plurality of straight portions. In the curved portion, the signal conductor is located at a position on an inner side of a curve relative to a center position in a width direction of the dielectric body.
Abstract translation: 高频信号传输线包括电介质体，信号导体和接地导体。 电介质体沿高频信号传输方向延伸。 信号导体在电介质体内并沿高频信号传输方向延伸。 接地导体位于电介质体内并与信号导体电磁耦合。 电介质体沿着高频信号传输方向包括多个直线部分和连接多个直线部分的弯曲部分。 在弯曲部分中，信号导体位于相对于介电体的宽度方向的中心位置的曲线内侧的位置。
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公开(公告)号：US20160373147A1
公开(公告)日：2016-12-22
申请号：US15255201
申请日：2016-09-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Noboru KATO
Abstract: A branch circuit includes a common antenna port and separates a first communication signal including a signal in a low band and a signal in a high band and a second communication signal that is a signal in a frequency band between the low band and the high band. The branch circuit includes a first-communication-signal-line-side band elimination filter and a second-communication-signal-line-side band elimination filter and SAW filter.
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