公开(公告)号：US20210029822A1

公开(公告)日：2021-01-28

申请号：US17066514

申请日：2020-10-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H05K1/02 ,  H05K1/03

Abstract: A transmission line includes connecting portions connected to the outside and a main body located between the connecting portions. Each of the connecting portions includes a terminal electrode connected to an external electrode, a signal conductor, and ground conductors. The main body includes the signal conductor and the ground conductors, and at least one of the plurality of connecting portions includes a first region including the terminal electrode, a second region adjacent to the first region along a signal propagation path, and a third region located between the second region and the main body. The first region, the second region, and the third region provide impedance matching at the connecting portion.

公开(公告)号：US20190208623A1

公开(公告)日：2019-07-04

申请号：US16297765

申请日：2019-03-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H05K1/02 ,  H01P3/02 ,  H01P5/02

Abstract: A multilayer substrate includes a differential line including first and second line conductors provided on or in a laminated body including base material layers. The differential line includes line portions and a connecting portion that connects the line portions. The connecting portion includes first parallel conductors extending in parallel or substantially in parallel with each other, first interlayer connecting conductors that connect the first parallel conductors in parallel, and connect the first line conductor to the first parallel conductors, second parallel conductors extending in parallel or substantially in parallel with each other, and second interlayer connecting conductors that connect the second parallel conductors in parallel, and connect the second line conductor to the second parallel conductors. The first parallel conductors cross the second parallel conductors as viewed in a laminating direction of the base material layers.

公开(公告)号：US20190057802A1

公开(公告)日：2019-02-21

申请号：US16166194

申请日：2018-10-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H01F27/28 ,  H05K1/16 ,  H01F41/04 ,  H05K3/00 ,  H05K3/46

Abstract: A multilayer substrate includes a laminated body including thermoplastic resin layers, a conductor pattern, a level-difference eliminating through hole, and a thickness adjustment member. The conductor pattern is on a main surface of one of the resin layers and is in the laminated body. The level-difference eliminating through hole is located at a position different from the conductor pattern in a planar view of the laminated body and penetrates the resin layer in a thickness direction. The thickness adjustment member is made of the same material as the resin layers, is located in the through hole, and has a thickness greater than a thickness of the resin layer.

公开(公告)号：US20180233429A1

公开(公告)日：2018-08-16

申请号：US15952279

申请日：2018-04-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Takahiro BABA ,  Yoshiyuki MASHIMO

IPC: H01L23/367 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/12 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/19 ,  H01L2224/2402 ,  H01L2224/24141 ,  H01L2224/24265 ,  H01L2224/25171 ,  H01L2224/32057 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/33051 ,  H01L2224/33519 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/141 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4632 ,  H05K3/4697 ,  H05K2201/10416

Abstract: A multilayer board includes a base including insulating layers stacked in a stacking direction, and a mounting surface at an end of the base in a first direction along the stacking direction, an electronic component inside the base, and a first heat dissipator extending through at least one of the insulating layers from a surface of the electronic component located at an end of the electronic component in the first direction to the mounting surface. When a section of the first heat dissipator is defined as a first section, and a section of the first heat dissipator located farther in a second direction along the layer stacking direction than the first section is defined as a second section, there is a combination of a first section and a second section in which the second section extends farther outward than the first section when viewed from the layer stacking direction.

公开(公告)号：US20180213643A1

公开(公告)日：2018-07-26

申请号：US15935249

申请日：2018-03-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshiro ADACHI ,  Kuniaki YOSUI

IPC: H05K1/09 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K3/40 ,  H05K3/06

Abstract: A resin multilayer substrate includes a first resin layer including a thermoplastic resin as a main material, a second resin layer including the thermoplastic resin as a main material and superposed on the first resin layer, a first interlayer-connection conductor passing through the first resin layer in a thickness direction, and a first conductor pattern at an area including a region in which the first interlayer-connection conductor is exposed at the surface of the first resin layer between the first resin layer and the second resin layer. The first conductor pattern includes a portion in or at which a portion of the first interlayer-connection conductor is disposed. The first conductor pattern includes a first portion covering the region exposed at the surface of the first resin layer; and a second portion disposed surrounding the first portion. The first portion and the second portion have different thicknesses from each other.

公开(公告)号：US20180182680A1

公开(公告)日：2018-06-28

申请号：US15903064

申请日：2018-02-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Shigeru TAGO ,  Masaki KAWATA

IPC: H01L23/12 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L23/12 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H05K1/18 ,  H05K3/46

Abstract: A resin circuit board includes a multilayer body, mounting land conductors, and second components. The multilayer body includes thermoplastic resin layers laminated together. The mounting land conductors are provided on a front surface of the multilayer body, and terminal conductors of a first component are bonded to the mounting land conductors by a thermal bonding method. The second components are disposed in the multilayer body and each has a modulus of elasticity greater than that of the multilayer body. When the multilayer body is seen in plan view, the second components are arranged such that a straight line connecting the second components passes through the center of gravity of the first component and such that the second components are superposed with the mounting land conductors.

公开(公告)号：US20180123206A1

公开(公告)日：2018-05-03

申请号：US15856122

申请日：2017-12-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H01P3/08 ,  H05K1/14 ,  H01L23/66 ,  H01P5/02 ,  H05K1/11 ,  H01L23/12 ,  H05K1/02

CPC classification number: H01P3/08 ,  H01L23/12 ,  H01L23/66 ,  H01L2924/0002 ,  H01P3/085 ,  H01P5/028 ,  H05K1/0251 ,  H05K1/0253 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/0191 ,  H05K2201/058 ,  H05K2201/0919 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/10189 ,  H01L2924/00

Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.

公开(公告)号：US20170104259A1

公开(公告)日：2017-04-13

申请号：US15386157

申请日：2016-12-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Noboru KATO

IPC: H01Q1/22 ,  G06K19/077 ,  H04B5/00 ,  H01Q7/06 ,  H01Q1/38

CPC classification number: H01Q1/2216 ,  G06K19/07777 ,  H01Q1/2208 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q7/06 ,  H04B5/0037 ,  H04B5/0081

Abstract: An antenna apparatus includes a power supply coil, a booster electrode sheet, a magnetic sheet, and a ground substrate arranged in this order from the top. The power supply coil includes a spiral coil conductor located on a flexible substrate. The booster electrode sheet includes a booster electrode located on an insulating substrate. The booster electrode includes a conductor region covering the coil conductor, a conductor aperture covering a coil window, and a slit portion connecting the outer edge of the conductor region and the conductor aperture in plan view. The magnetic sheet covers the booster electrode sheet so that the magnetic sheet covers a region slightly larger than a region including the conductor aperture and the slit portion of the booster electrode.

公开(公告)号：US20170084974A1

公开(公告)日：2017-03-23

申请号：US15366159

申请日：2016-12-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro BABA ,  Kuniaki YOSUI ,  Nobuo IKEMOTO ,  Fumie MATSUDA

IPC: H01P3/08 ,  H01P11/00

CPC classification number: H01P3/08 ,  H01P3/085 ,  H01P3/088 ,  H01P11/003 ,  H05K1/02

Abstract: A transmission line includes, in a dielectric body, a first ground conductor, and first and second signal conductors arranged in a width direction of the dielectric body. The first ground conductor includes a first signal conductor ground portion disposed closer to a first side of the dielectric body in a thickness direction than the first signal conductor, a second signal conductor ground portion disposed closer to a second side of the dielectric body in the thickness direction than the second signal conductor, and an intermediate portion that connects the first signal conductor ground portion to the second signal conductor ground portion. The intermediate portion is disposed between a first transmission line including the first signal conductor and the first signal conductor ground portion and a second transmission line including the second signal conductor and the second signal conductor ground portion.

公开(公告)号：US20170077579A1

公开(公告)日：2017-03-16

申请号：US15361604

申请日：2016-11-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro BABA ,  Satoshi SASAKI ,  Kuniaki YOSUI

IPC: H01P3/08

CPC classification number: H01P3/08 ,  H01P3/082 ,  H05K1/02

Abstract: In a transmission line, first and second signal conductors are located inside a dielectric base body. The first and second signal conductors are located between first and second ground conductors in a thickness direction of the dielectric base body. A main conductor portion of the second ground conductor is located between the first and second signal conductors in a width direction of the dielectric base body. First and second auxiliary conductor portions of the second ground conductor respectively extend from the main conductor portion to first-signal-conductor-side and second-signal-conductor-side lateral surfaces of the dielectric base body. A first lateral-surface conductor connects the first auxiliary conductor portion to a plating-connection conductor connected to the first ground conductor. A second lateral-surface conductor connects the second auxiliary conductor portion to a plating-connection conductor connected to the first ground conductor.

Abstract translation: 在传输线中，第一和第二信号导体位于电介质基体的内部。 第一和第二信号导体沿电介质基体的厚度方向位于第一和第二接地导体之间。 第二接地导体的主导体部分在电介质基体的宽度方向上位于第一和第二信号导体之间。 第二接地导体的第一和第二辅助导体部分分别从电介质基体的主导体部分延伸到第一信号导体侧和第二信号导体侧侧面。 第一侧面导体将第一辅助导体部分连接到连接到第一接地导体的电镀连接导体。 第二侧面导体将第二辅助导体部分连接到连接到第一接地导体的电镀连接导体。