公开(公告)号：US11233079B2

公开(公告)日：2022-01-25

申请号：US16613571

申请日：2018-05-18

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Nan Guo ,  Zhenyu Chen ,  Takehiko Tanaka ,  Jingfei He ,  Zhen Huang ,  Zhongyu Luan ,  Feifan Chen

IPC: H01L27/146 ,  H04M1/02 ,  H04N5/225 ,  H05K1/18

Abstract: A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.

公开(公告)号：US11049898B2

公开(公告)日：2021-06-29

申请号：US15617843

申请日：2017-06-08

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu Wang ,  Nan Guo ,  Jingfei He ,  Zhenyu Chen ,  Bojie Zhao ,  Takehiko Tanaka ,  Feifan Chen ,  Ye Wu ,  Zhen Huang ,  Zhongyu Luan

IPC: H01L27/146 ,  H05K1/18 ,  H04N5/225 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02

Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.

公开(公告)号：US10148859B2

公开(公告)日：2018-12-04

申请号：US15705217

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  H05K1/18 ,  H05K1/02 ,  G02B5/20 ,  G02B7/00 ,  G02B3/00 ,  G02B7/02 ,  H04M1/02 ,  H01L27/146

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US20180288296A1

公开(公告)日：2018-10-04

申请号：US15705217

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  H05K1/02 ,  G02B5/20 ,  G02B7/00 ,  G02B7/02 ,  H04M1/02 ,  H05K1/18 ,  G02B3/00 ,  H01L27/146

CPC classification number: G02B7/021 ,  B29C45/14639 ,  B29L2031/3481 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B13/001 ,  G02B13/004 ,  H01L21/565 ,  H01L25/0655 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US20180286913A1

公开(公告)日：2018-10-04

申请号：US15617843

申请日：2017-06-08

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu Wang ,  Nan Guo ,  Jingfei He ,  Zhenyu Chen ,  Bojie Zhao ,  Takehiko Tanaka ,  Feifan Chen ,  Ye Wu ,  Zhen Huang ,  Zhongyu Luan

IPC: H01L27/146 ,  H05K1/18 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H04N5/369

Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.

公开(公告)号：US20180012923A1

公开(公告)日：2018-01-11

申请号：US15705225

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H01L27/146

CPC classification number: G02B7/021 ,  B29C45/14639 ,  B29L2031/3481 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B13/001 ,  G02B13/004 ,  H01L21/565 ,  H01L25/0655 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US12211864B2

公开(公告)日：2025-01-28

申请号：US17631605

申请日：2020-07-30

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Zhongyu Luan ,  Zhen Huang ,  Li Liu ,  Kai Chen

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/433 ,  H04N23/52 ,  H04N23/54

Abstract: Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board. The accommodating space is configured so that the photosensitive chip is bent downward during a process of assembling the photosensitive assembly. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process, so as to improve the imaging quality.

公开(公告)号：US11822099B2

公开(公告)日：2023-11-21

申请号：US17114466

申请日：2020-12-07

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H01L31/16 ,  G02B3/00 ,  H05K3/28 ,  H01L25/00 ,  H04N23/45 ,  H04N23/51 ,  H04N23/55 ,  G02B7/00

CPC classification number: G02B3/0075 ,  G02B7/006 ,  H01L25/50 ,  H04N23/45 ,  H04N23/51 ,  H04N23/55 ,  H05K3/284

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US11652132B2

公开(公告)日：2023-05-16

申请号：US17345929

申请日：2021-06-11

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu Wang ,  Nan Guo ,  Jingfei He ,  Zhenyu Chen ,  Bojie Zhao ,  Takehiko Tanaka ,  Feifan Chen ,  Ye Wu ,  Zhen Huang ,  Zhongyu Luan

IPC: H05K1/18 ,  H05K3/28 ,  H04N23/55 ,  H04N23/57 ,  H05K3/00 ,  H04N5/225 ,  H01L27/146 ,  H05K1/02

CPC classification number: H01L27/14683 ,  H01L27/14618 ,  H04N23/55 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/284 ,  H04N23/57 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/1316

Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.

公开(公告)号：US11388320B2

公开(公告)日：2022-07-12

申请号：US16322946

申请日：2017-06-02

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Zhenyu Chen ,  Zhongyu Luan ,  Zhen Huang ,  Nan Guo ,  Fengsheng Xi ,  Takehiko Tanaka ,  Bojie Zhao ,  Heng Jiang ,  Ye Wu ,  Zilong Deng

IPC: H04N5/225 ,  H05K1/02

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.