公开(公告)号：US09895711B2

公开(公告)日：2018-02-20

申请号：US15005516

申请日：2016-01-25

Applicant: Tokyo Electron Limited

Inventor： Jian Zhang ,  Yoshifumi Amano ,  Eiichiro Okamoto ,  Yuki Ito

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B05C11/00

CPC classification number: B05C11/00 ,  B08B2203/0229 ,  H01L21/6715 ,  H01L21/68792

Abstract: A substrate liquid processing apparatus including: a substrate rotary-holding unit configured to rotate a substrate while holding the substrate; and a processing liquid supply unit configured to supply a processing liquid to a bottom surface of the substrate held by the substrate rotary-holding unit. The substrate rotary-holding unit includes: a base plate disposed spaced apart from the substrate below the substrate; a cover member supported by the base plate and disposed outside an outer periphery of the substrate; and a discharge port formed between the base plate and the cover member and configured to discharge an air stream occurring below the substrate. The support portion of the base plate and the cover member protrudes outwards from a top surface of the base plate to be connected to the cover member.

公开(公告)号：US20170287703A1

公开(公告)日：2017-10-05

申请号：US15454154

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/02 ,  G03B17/08 ,  G03B13/32 ,  H01L21/67 ,  B08B3/08

CPC classification number: H01L21/02087 ,  B08B3/08 ,  G03B13/32 ,  G03B17/08 ,  H01L21/6704 ,  H01L21/6708 ,  H01L21/67253 ,  H01L21/67259 ,  H01L22/12 ,  H01L22/20

Abstract: Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.

公开(公告)号：US09308559B2

公开(公告)日：2016-04-12

申请号：US13711784

申请日：2012-12-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yoshifumi Amano

IPC: B08B3/00 ,  B08B3/04 ,  H01L21/67

CPC classification number: B08B3/04 ,  H01L21/67051

Abstract: Provided is a substrate processing apparatus including a substrate holding unit configured to hold a wafer W horizontally, a rotation driving unit configured to rotate the substrate holding unit, a first chemical liquid nozzle configured to discharge a first chemical liquid to a first chemical liquid supplying position on the peripheral portion of the wafer W, and a second chemical liquid nozzle configured to discharge a second chemical liquid to a second chemical liquid supplying position on the peripheral portion of the wafer W. The rotation driving unit rotates the substrate holding unit in a first rotation direction when the first chemical liquid nozzle discharges the first chemical liquid, and rotates the substrate holding unit in a second rotation direction when the second chemical liquid nozzle discharges the second chemical liquid.

Abstract translation: 本发明提供一种基板处理装置，具备：水平地保持晶片W的基板保持单元;旋转驱动单元，其使基板保持单元旋转;第一药液喷嘴，其构成为将第一药液排出到第一药液供给位置 在晶片W的周边部分上设置有第二药液喷嘴，该第二药液喷嘴被配置为将第二化学液体排出到晶片W的周边部分上的第二化学液体供给位置。旋转驱动单元使基板保持单元第一 当第一化学液体喷嘴排出第一化学液体时旋转方向，并且当第二化学液体喷嘴排出第二化学液体时，使基板保持单元沿第二旋转方向旋转。

公开(公告)号：US12300524B2

公开(公告)日：2025-05-13

申请号：US17242709

申请日：2021-04-28

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

公开(公告)号：USD929534S1

公开(公告)日：2021-08-31

申请号：US29710426

申请日：2019-10-23

Applicant: TOKYO ELECTRON LIMITED

Designer： Yoshifumi Amano ,  Kazuhiro Aiura

公开(公告)号：US11018035B2

公开(公告)日：2021-05-25

申请号：US16154936

申请日：2018-10-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

公开(公告)号：US20200337118A1

公开(公告)日：2020-10-22

申请号：US16842848

申请日：2020-04-08

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Akira Fujita

IPC: H05B1/02 ,  H01L21/67

Abstract: A substrate processing apparatus includes a holder and a heating device. The holder is configured to hold a central portion of a bottom surface of a substrate to be rotated. The heating device is configured to supply a heated fluid to the bottom surface of the substrate. The heating device includes multiple fins, a heat source, a fluid introduction unit and a fluid discharge unit. The multiple fins are arranged along a circumferential direction of the substrate to be located under the substrate at an outer side than the holder. The heat source is configured to heat the multiple fins. The fluid introduction unit is configured to introduce the fluid to the multiple fins. The fluid discharge unit is configured to discharge the fluid, which is heated while passing through the multiple fins, to the bottom surface of the substrate.

公开(公告)号：US10217628B2

公开(公告)日：2019-02-26

申请号：US15454154

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67 ,  G03B13/32 ,  G03B17/08

Abstract: Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.

公开(公告)号：US20190043742A1

公开(公告)日：2019-02-07

申请号：US16154936

申请日：2018-10-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

公开(公告)号：US10046372B2

公开(公告)日：2018-08-14

申请号：US15209982

申请日：2016-07-14

Applicant: Tokyo Electron Limited

Inventor： Kazuya Goda ,  Yoshifumi Amano ,  Nobuya Yamamoto ,  Go Ayabe

IPC: B08B13/00 ,  B08B3/04 ,  H01L21/67

Abstract: A liquid processing apparatus includes a plurality of liquid processing units, a plurality of individual exhaust paths, a common exhaust path, a first outside air intake section, a first regulation valve, a second outside air intake section, and a second regulation valve. The liquid processing units perform a liquid processing on a processing target object. An exhaust gas from an inside of the liquid processing unit flows in the individual exhaust paths. The exhaust gas from the individual exhaust paths flows in the common exhaust path. The first outside air intake section is formed at the most upstream side to introduce outside air. The first regulation valve is provided in the first outside air intake section. The second outside air intake section is formed at a downstream side of the common exhaust path from the connection. The second regulation valve is provided in the second outside air intake section.