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公开(公告)号:US20170357127A1
公开(公告)日:2017-12-14
申请号:US15617726
申请日:2017-06-08
Applicant: X-Celeprint Limited
Inventor: Ronald S. Cok , Christopher Bower , Matthew Meitl
IPC: G02F1/1335
CPC classification number: G02F1/133606 , G02F1/133603 , G02F1/13362 , G02F1/133621 , G02F2001/133614 , G02F2202/36 , G02F2203/01 , G02F2203/02 , G02F2203/05
Abstract: A light-emitting diode (LED) structure includes an LED substrate having a first side and a second side opposing the first side. One or more light-emitting diodes are disposed on the first side and arranged to emit light through the LED substrate. In certain embodiments, a wire-grid polarizer is disposed on the second side and arranged to polarize light emitted from the one or more light-emitting diodes. A plurality of different colored LEDs or an LED with one or more color-conversion materials can be provided on the LED substrate to provide white light. A spatially distributed plurality of the LED structures can be provided in a backlight for a liquid crystal display. A polarization-preserving transmissive diffuser can diffuse light emitted from the LED toward the liquid crystal layer and a polarization-preserving reflective diffuser can diffuse light emitted from the LED away from the liquid crystal layer.
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公开(公告)号:US20170154819A1
公开(公告)日:2017-06-01
申请号:US15430101
申请日:2017-02-10
Applicant: X-Celeprint Limited
Inventor: Christopher Bower , Matthew Meitl
IPC: H01L21/78
CPC classification number: H01L21/7813 , B81C99/008 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L24/83 , H01L2221/68368
Abstract: The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 1 1). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.
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公开(公告)号:US20170122502A1
公开(公告)日:2017-05-04
申请号:US14930363
申请日:2015-11-02
Applicant: X-Celeprint Limited
Inventor: Ronald S. Cok , Christopher Bower , Matthew Meitl
CPC classification number: H01L33/385 , F21K9/60 , F21V9/08 , F21Y2101/00 , F21Y2105/00 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , G02B26/04 , G02F1/167 , G09G3/22 , G09G3/32 , G09G2300/0452 , G09G2300/0842 , G09G2310/0264 , H01L23/4821 , H01L23/5381 , H01L25/0753 , H01L25/167 , H01L27/156 , H01L33/20 , H01L33/36 , H01L33/38 , H01L33/405 , H01L33/48 , H01L33/50 , H01L33/502 , H01L33/508 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/18 , H01L2224/73267 , H01L2224/92244 , H05B33/089 , H05K1/0306 , H05K1/09 , H05K1/181 , H05K1/182 , H05K5/0017 , H05K2201/0329 , H05K2201/10106 , H05K2201/10128 , H05K2201/10166
Abstract: A color-conversion structure includes an article comprising a color-conversion material disposed within a color-conversion layer. At least a portion of a tether is within or extends from the article. The color-conversion structure can be disposed over a sacrificial portion of a substrate to form a micro-transfer printable device and micro-transfer printed to a display substrate. The color-conversion structure can include an light-emitting diode or laser diode that is over or under the article. Alternatively, the article is located on a side of a display substrate opposite an inorganic light-emitting diode. A display includes an array of color-conversion structures disposed on a display substrate.
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公开(公告)号:US20170092863A1
公开(公告)日:2017-03-30
申请号:US14869369
申请日:2015-09-29
Applicant: X-Celeprint Limited
Inventor: Christopher Bower , Matthew Meitl , Ronald S. Cok
CPC classification number: H01L51/0013 , H01L27/3206 , H01L27/3225 , H01L51/0023 , H01L51/003 , H01L51/50 , H01L51/5206 , H01L51/5221 , H01L51/5253 , H01L51/56 , H01L2227/323
Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.
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25.
公开(公告)号:US09537069B1
公开(公告)日:2017-01-03
申请号:US14788632
申请日:2015-06-30
Applicant: X-Celeprint Limited
Inventor: Christopher Bower , Matthew Meitl
CPC classification number: H01L33/60 , H01L27/156 , H01L33/38 , H01L33/385 , H01L33/405 , H01L33/46 , H01L33/54
Abstract: An inorganic light-emitting diode structure includes a transparent substrate and an inorganic semiconductor having a conduction layer and a light-emitting layer over and in contact with only a portion of the conduction layer. A first metal contact is in electrical contact with the conduction layer and a second metal contact is in electrical contact with a second contact portion of the light-emitting layer so that a current supplied between the first metal contact and the second metal contact through the inorganic semiconductor causes the light-emitting layer to emit light. A dielectric layer is located over at least a portion of the light-emitting layer and a reflective layer is located over at least a portion of the dielectric layer. The reflective layer encapsulates the light-emitting layer exclusive of the portion of the conduction layer in contact with the light-emitting layer.
Abstract translation: 无机发光二极管结构包括透明基板和具有导电层和发光层的无机半导体,该导电层和发光层仅与导电层的一部分接触。 第一金属触点与导电层电接触,并且第二金属触点与发光层的第二接触部分电接触,使得在第一金属触点和第二金属接触之间提供的电流通过无机 半导体使发光层发光。 电介质层位于发光层的至少一部分上方,反射层位于电介质层的至少一部分上方。 反射层封装了与发光层接触的部分导电层的发光层。
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公开(公告)号:US09520537B2
公开(公告)日:2016-12-13
申请号:US14743981
申请日:2015-06-18
Applicant: X-Celeprint Limited
Inventor: Christopher Bower , Matthew Meitl , David Gomez , Salvatore Bonafede , David Kneeburg , Alin Fecioru , Carl Prevatte
IPC: H01L29/20 , H01L33/00 , H01L33/38 , G09G3/32 , H01L25/075 , H01L33/50 , H01L33/60 , H05B33/08 , G02B26/04 , G02F1/167 , H01L25/16 , H01L33/36 , H01L33/48 , H05K1/03 , H05K1/09 , H05K1/18 , H05K5/00 , H01L33/62 , H01L33/20 , H01L33/40
CPC classification number: H01L33/385 , F21K9/50 , F21V9/08 , F21Y2101/025 , F21Y2105/003 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , G02B26/04 , G02F1/167 , G09G3/22 , G09G3/32 , G09G2300/0452 , G09G2300/0842 , G09G2310/0264 , H01L23/4821 , H01L23/5381 , H01L25/0753 , H01L25/167 , H01L27/156 , H01L33/20 , H01L33/36 , H01L33/38 , H01L33/405 , H01L33/48 , H01L33/50 , H01L33/502 , H01L33/508 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/18 , H01L2224/73267 , H01L2224/92244 , H05B33/089 , H05K1/0306 , H05K1/09 , H05K1/181 , H05K1/182 , H05K5/0017 , H05K2201/0329 , H05K2201/10106 , H05K2201/10128 , H05K2201/10166
Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
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公开(公告)号:US20160343771A1
公开(公告)日:2016-11-24
申请号:US14754573
申请日:2015-06-29
Applicant: X-Celeprint Limited
Inventor: Christopher Bower , Robert R. Rotzoll , Matthew Meitl , Ronald S. Cok
IPC: H01L27/15
CPC classification number: H01L21/77 , G09F9/33 , H01L25/0753 , H01L25/167
Abstract: A small-aperture-ratio display includes a display substrate and a plurality of spatially separated pixel elements distributed over the display substrate. Each pixel element includes one or more light emitters. An active electrical component is electrically connected to each of the pixel elements and each active electrical component is located on the display substrate at least partly between the pixel elements. The display substrate has a contiguous display substrate area that includes the pixel elements, the light emitters each have a light-emissive area, and the substrate area is greater than or equal to one-quarter the combined light-emissive areas of the light emitters.
Abstract translation: 小孔径比显示器包括显示基板和分布在显示基板上的多个空间分离的像素元件。 每个像素元件包括一个或多个发光器。 有源电气部件电连接到每个像素元件,并且每个有源电子部件至少部分地位于显示器基板之间的像素元件之间。 显示基板具有包括像素元件的连续显示基板区域,每个发光体都具有发光区域,并且基板面积大于或等于发光体组合的发光区域的四分之一。
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公开(公告)号:US09444015B2
公开(公告)日:2016-09-13
申请号:US14743910
申请日:2015-06-18
Applicant: X-Celeprint Limited
Inventor: Christopher Bower , Matthew Meitl , David Gomez , Salvatore Bonafede , David Kneeburg , Alin Fecioru , Carl Prevatte
IPC: H05B33/08 , H01L33/38 , G09G3/32 , H01L25/075 , H01L33/50 , H01L33/60 , G02B26/04 , G02F1/167 , H01L25/16 , H01L33/36 , H01L33/48 , H05K1/03 , H05K1/09 , H05K1/18 , H05K5/00 , H01L33/62 , F21Y105/00 , F21Y113/00 , H01L33/20 , H01L33/40
CPC classification number: H01L33/385 , F21K9/50 , F21V9/08 , F21Y2101/025 , F21Y2105/003 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , G02B26/04 , G02F1/167 , G09G3/22 , G09G3/32 , G09G2300/0452 , G09G2300/0842 , G09G2310/0264 , H01L23/4821 , H01L23/5381 , H01L25/0753 , H01L25/167 , H01L27/156 , H01L33/20 , H01L33/36 , H01L33/38 , H01L33/405 , H01L33/48 , H01L33/50 , H01L33/502 , H01L33/508 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/18 , H01L2224/73267 , H01L2224/92244 , H05B33/089 , H05K1/0306 , H05K1/09 , H05K1/181 , H05K1/182 , H05K5/0017 , H05K2201/0329 , H05K2201/10106 , H05K2201/10128 , H05K2201/10166
Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
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29.
公开(公告)号:US20160064363A1
公开(公告)日:2016-03-03
申请号:US14836168
申请日:2015-08-26
Applicant: X-Celeprint Limited
Inventor: Christopher Bower , Matthew Meitl , Julian Carter , Ronald S. Cok
CPC classification number: H01L25/167 , H01L25/0753 , H01L27/3216 , H01L27/3225 , H01L27/3244 , H01L2924/0002 , H05B33/0845 , H05B33/0896 , H01L2924/00
Abstract: The disclosed technology relates generally hybrid displays with pixels that include both inorganic light emitting diodes (ILEDs) and organic light emitting diodes (OLEDs). The disclosed technology provides a hybrid display that uses a mixture of ILEDs and OLEDs in each pixel. In certain embodiments, each pixel in the hybrid display includes a red ILED, a blue ILED, and a green OLED. In this instance, the OLED process would not require a high resolution shadow mask, thereby enhancing the manufacturability of OLEDs for larger format displays. Additionally, the OLED process in this example would not require any fine lithography. The OLED subpixel (e.g., green subpixel) can be larger and the ILEDs can be small (e.g., micro-red and micro-blue ILEDs). The use of small ILEDs allows for other functions to be added to the pixel, such as micro sensors and micro integrated circuits.
Abstract translation: 所公开的技术通常涉及具有包括无机发光二极管(ILED)和有机发光二极管(OLED))的像素的混合显示器。 所公开的技术提供了在每个像素中使用ILED和OLED的混合物的混合显示器。 在某些实施例中,混合显示器中的每个像素包括红色ILED,蓝色ILED和绿色OLED。 在这种情况下,OLED工艺将不需要高分辨率荫罩,从而增强用于较大格式显示器的OLED的可制造性。 此外,在该示例中的OLED工艺将不需要任何精细光刻。 OLED子像素(例如,绿色子像素)可以更大并且ILED可以较小(例如,微红色和微蓝色ILED)。 使用小型ILED可以将其他功能添加到像素中,如微型传感器和微型集成电路。
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公开(公告)号:US20160020130A1
公开(公告)日:2016-01-21
申请号:US14803980
申请日:2015-07-20
Applicant: X-Celeprint Limited
Inventor: Christopher Bower , Matthew Meitl , David Gomez , Salvatore Bonafede , David Kneeburg
IPC: H01L21/683 , H01L23/00 , H01L21/67 , H01L21/56
CPC classification number: B41F16/00 , B25J15/00 , B41F16/0046 , B41F16/006 , B41F16/0073 , B41K3/04 , B41K3/12 , H01L21/3065 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/67103 , H01L21/683 , H01L21/6835 , H01L23/293 , H01L23/3171 , H01L24/75 , H01L24/83 , H01L24/97 , H01L25/50 , H01L31/1892 , H01L2221/68318 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2221/68381 , H01L2224/32225 , H01L2224/32245 , H01L2224/75315 , H01L2224/7598 , H01L2224/83001 , H01L2224/83011 , H01L2224/83013 , H01L2224/83024 , H01L2224/832 , H01L2224/83894 , H01L2224/83895 , H01L2924/10253 , H01L2924/1032 , H01L2924/10328 , H01L2924/10329 , H01L2924/10332 , H01L2924/10335 , H01L2924/10336 , H01L2924/10337 , H01L2924/10338 , H01L2924/1034
Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.
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