公开(公告)号：US20240174907A1

公开(公告)日：2024-05-30

申请号：US18283319

申请日：2021-03-30

Applicant: DOW GLOBAL TECHNOLOGIES LLC ,  DOW SILICONES CORPORATION

Inventor： Chao HE ,  Dorab BHAGWAGAR ,  Ling LING ,  Hongyu CHEN ,  Chen CHEN ,  Jiguang ZHANG

IPC: C09K5/14 ,  C08G77/442 ,  C08K9/06 ,  H01M10/625 ,  H01M10/653

CPC classification number: C09K5/14 ,  C08G77/442 ,  C08K9/06 ,  H01M10/625 ,  H01M10/653 ,  C08K2201/001 ,  H01M2220/20

Abstract: A curable polyolefin composition is provided. The curable polyolefin composition comprises: (A) a polyolefin having at least two aliphatic unsaturated bonds per molecule and having a viscosity at 25° C. of less than 2,500 mPa·s; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) a thermal conductive filler. The curable polyolefin composition can be cured to form a soft material with good thermal conductive properties.

公开(公告)号：US20240174816A1

公开(公告)日：2024-05-30

申请号：US18548625

申请日：2022-04-29

Applicant: Nanyang Technological University

Inventor： Hyunwoo BARK ,  Pooi See LEE

IPC: C08G77/26 ,  C08G77/12 ,  C08G77/14 ,  C08G77/38 ,  C08K9/08 ,  C09K5/06 ,  H10N10/13 ,  H10N10/852

CPC classification number: C08G77/26 ,  C08G77/12 ,  C08G77/14 ,  C08G77/38 ,  C08K9/08 ,  C09K5/063 ,  H10N10/13 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/011 ,  H10N10/852

Abstract: Disclosed herein is a composite material comprising a crosslinked polymeric matrix, the crosslinked polymeric matrix formed from a polymeric material comprising a plurality of carboxylic acid functional groups and a plurality of liquid metal particles having a surface functionalized with a plurality of amino and/or hydroxyl functional groups, where the plurality of liquid metal particles and the polymeric material are covalently bonded together by a plurality of amide and/or ester bonds formed from the plurality of carboxylic acid functional groups and the plurality of amino and/or hydroxyl functional groups. Also disclosed herein is a thermal interface layer using said composite material and a thermoelectric device also using said composite material.

公开(公告)号：US11993693B2

公开(公告)日：2024-05-28

申请号：US16976509

申请日：2019-03-22

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Company

Inventor： Tian Lan ,  Xindi Yu ,  Michael Q. Tran ,  Paul J. Brigandi ,  Jeffrey M. Cogen ,  Timothy J. Person ,  Yichi Zhang

IPC: C08K3/04 ,  C08F10/02 ,  C08J3/20 ,  C08L23/06 ,  H01B1/24 ,  H01B3/22 ,  H01B7/02

CPC classification number: C08K3/04 ,  C08F10/02 ,  C08J3/201 ,  H01B3/22 ,  H01B7/0275 ,  C08F2810/20 ,  C08K2201/001 ,  C08K2201/006

Abstract: A semiconductive composite material consisting essentially of a non-polar organic polymer and an electrical conducting effective amount of an ultra-low-wettability carbon black. Also a method of making the composite material; a crosslinked polyethylene product made by curing the composite material; manufactured articles comprising a shaped form of the inventive composite material or product; and methods of using the inventive composite material, product, or articles.

公开(公告)号：US20240172563A1

公开(公告)日：2024-05-23

申请号：US18552561

申请日：2022-03-25

Applicant: SABIC GLobal Technologies. B.V.

Inventor： Soma Guhathakurta ,  Theodorus Lambertus Hoeks ,  Tadhg Mahon

IPC: H10N30/85 ,  C08J5/18 ,  C08K9/08 ,  H10N30/092

CPC classification number: H10N30/852 ,  C08J5/18 ,  C08K9/08 ,  H10N30/092 ,  C08J2327/16 ,  C08K2201/001

Abstract: The invention is directed to a piezoelectric composite comprising (a) a polymer matrix; and (b) a plurality of coated piezoelectric filler particles that are dispersed in the polymer matrix. Further, each of the plurality of coated piezoelectric filler particles comprises a piezoelectric material having at least a portion of its outer surface coated with a polymeric material that has at least one polar functional group. The invention is further directed towards films containing such piezoelectric composites and methods of preparing such films.

公开(公告)号：US11987689B2

公开(公告)日：2024-05-21

申请号：US17889228

申请日：2022-08-16

Applicant: Micro Powders, Inc.

Inventor： Richard Czarnecki

IPC: C08K3/22 ,  C08K3/04 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: C08K3/22 ,  C08K3/042 ,  B82Y30/00 ,  B82Y40/00 ,  C08K2003/2227 ,  C08K2003/2237 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/011 ,  C08K2201/013 ,  C08K2201/017

Abstract: A soluble composite powder comprising homogenous composite particles, the homogenous composite particles comprising at least one soluble thermoplastic material and at least one submicron nanoparticle material. The at least one soluble thermoplastic material comprises from about 50 to 99 weight percent of the powder, and the at least one submicron nanoparticle material comprises from about 1 to 50 weight percent of the powder. The powder is soluble.

公开(公告)号：US11987686B2

公开(公告)日：2024-05-21

申请号：US17252957

申请日：2019-06-18

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Hiroki Kudoh ,  Taku Sasaki ,  Kana Hattori ,  Kazuyuki Yahara ,  Yasunari Kusaka

IPC: C08K3/04 ,  C08L83/04 ,  C08K3/22 ,  C08K7/04 ,  C08K7/18

CPC classification number: C08K3/04 ,  C08L83/04 ,  C08K2003/2227 ,  C08K7/04 ,  C08K7/18 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/004

Abstract: A thermally conductive sheet 10 comprises a polymer matrix 12 and an anisotropic filler 13, and the anisotropic filler 13 is oriented in a thickness direction. The anisotropic filler 13 is exposed on the surfaces 10A, 10B of the thermally conductive sheet 10, and the anisotropic filler 13 which is exposed is disposed in such a way as to fall down in a proportion of 3.5 to 45%.

公开(公告)号：US20240158604A1

公开(公告)日：2024-05-16

申请号：US18281605

申请日：2022-03-16

Applicant: SHPP GLOBAL TECHNOLOGIES B.V.

Inventor： Norberto SILVI ,  Paul Scott LONG ,  Walter THOMPSON ,  Matthew NIEMEYER ,  Scott DAVIS

IPC: C08K3/04

CPC classification number: C08K3/04 ,  C08K2201/001 ,  C08K2201/006 ,  C08K2201/014

Abstract: Aspects of the disclosure relate to a composition including: from about 35 wt % to about 70 wt % of at least one polyethylene polymer; from about 25 wt % to about 55 wt % of at least one graphite filler; and from about 2 wt % to about 15 wt % of a carbon powder filler having a BET surface area of at least 50 square meters per gram (m2/g). The polyethylene polymer has a density of at least 0.94 gram per cubic centimeter (g/cm3), a melt flow rate (MFR) of at least 10 g per 10 minutes (g/10 min) measured at 190° C. and 21.6 kilogram (kg), and an Environmental Stress-Cracking Resistance (ESCR) of at least 500 hours. The composition has a volume electrical resistivity of less than 5 ohm·centimeter (ohm·cm) and a MFR of at least 4 g/10 min measured at 280° C. and 21.6 kg.

公开(公告)号：US20240145126A1

公开(公告)日：2024-05-02

申请号：US18496296

申请日：2023-10-27

Applicant: DelStar Technologies, Inc.

Inventor： Rebecca Wilson ,  Geoffrey Henstock

IPC: H01B7/288 ,  C08K3/04

CPC classification number: H01B7/288 ,  C08K3/04 ,  C08K2201/001 ,  C08K2201/005

Abstract: A water swellable semi-conductive material comprising a semi-conductive layer and a semi-conductive water swellable polymeric layer which is positioned of the semi-conductive layer is provided. The semi-conductive water swellable polymeric layer is comprised of conductive particles dispersed within a crosslinked superabsorbent polymeric matrix. The material can be formed into a tape or other structure used to insulate and protect cables. The water swellable semi-conductive material can be applied to a cable or other conductive material to insulate and protect the cable from water ingress.

公开(公告)号：US20240141222A1

公开(公告)日：2024-05-02

申请号：US18280824

申请日：2021-03-10

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Yuuki HOSHIYAMA ,  Kento TSUCHIYA ,  Nobuhiko INUI

IPC: C09K5/14 ,  C08K7/18 ,  H01L23/373

CPC classification number: C09K5/14 ,  C08K7/18 ,  H01L23/3733 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/014 ,  C08K2201/016

Abstract: The heat-conducting resin sheet according to an aspect of the present invention comprises a thermally conductive plate-shaped particle, a thermally conductive spherical particle, and a resin, wherein the heat-conducting resin sheet has a thermal conductivity of 5 W/m·K or more and a 30% compressive strength B of 1500 kPa or less as measured at a compression rate of 1.0 mm/min. Furthermore, a volume ratio of the thermally conductive plate-shaped particle to the thermally conductive spherical particle (volume of thermally conductive plate-shaped particle/volume of thermally conductive spherical particle) is 30/70 to 90/10, and the total volume of the thermally conductive plate-shaped particle and the thermally conductive spherical particle is 30 to 90% by volume. According to the present invention, there can be provided a heat-conducting resin sheet that is excellent in the thermal conductivity and flexibility and can suppress the increase in the stress even when compressed quickly.

公开(公告)号：US11969983B2

公开(公告)日：2024-04-30

申请号：US17494913

申请日：2021-10-06

Applicant: Airbus Defence and Space GmbH

Inventor： Christian Karch ,  Blanka Lenczowski ,  Johannes Wolfrum ,  Yehoshua Yeshurun

IPC: B32B5/02 ,  B29C70/02 ,  B29C70/88 ,  B32B5/26 ,  B32B7/04 ,  B32B15/08 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/12 ,  B32B27/30 ,  B32B37/14 ,  B64D45/02 ,  B82Y30/00 ,  C08J5/00 ,  C08J5/24

CPC classification number: B32B5/022 ,  B29C70/021 ,  B29C70/885 ,  B32B5/26 ,  B32B7/04 ,  B32B15/08 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/12 ,  B32B27/308 ,  B32B37/14 ,  B64D45/02 ,  B82Y30/00 ,  C08J5/005 ,  C08J5/243 ,  B32B2250/40 ,  B32B2255/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/212 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2307/732 ,  B32B2571/00 ,  B32B2605/18 ,  C08K2201/001

Abstract: A structural component for an aircraft, spacecraft or rocket has a ply of fiber reinforced polymer, a first carbon nanotube mat; and a metallic layer, wherein the carbon nanotube mat and the metallic layer are arranged on the ply of fiber reinforced polymer to form a hybrid lightning strike protection layer. A component for manufacturing such a structural component, a method for manufacturing a component of this type, a method for manufacturing a structural component and an aircraft or spacecraft with such a structural component are described.