Abstract:
The invention relates to a process for assembling and repositioning at least two parts by means of a repositionable hot melt adhesive, wherein said parts are held together in assembled position when said adhesive is at a temperature TA and can be repositioned in relation to one another when said adhesive is heated to a temperature TC, wherein said adhesive comprises at least a formulation, which: at the temperature TC has the form of a mixture of polymer chains comprising at least pendant diene units X and of coupling molecules comprising at least two dienophile end groups Y, wherein said X units and said Y groups are arranged to be able to react with one another and to bond together by means of the Diels-Alder reaction at a temperature TDA and to be able to regenerate by means of the retro-Diels-Alder reaction at a temperature TRDA, at a temperature TA has the form of a three-dimensional network, in which the polymer chains are linked to one another by the coupling molecules by means of the Diels-Alder reaction, where TA
Abstract:
A composition which includes: a polythiol compound; a compound having a carbon-carbon double bond at a terminal of a molecule thereof; a photo radical generator; and a thermal radical generator, a ratio (Ene/SH) of a total molar number (Ene) of the carbon-carbon double bond contained in terminals of a molecule of the compound having a carbon-carbon double bond at a terminal of a molecule thereof to a total molar number (SH) of thiol groups contained in the polythiol compound being higher than 0.20 but equal to or less than 0.70.
Abstract:
Thermosetting coating compositions contain crosslinkable materials, which may be selected from polymers, oligomers, or monomeric compounds, that have at least two, preferably at least three crosslinkable functional groups and crosslinkers selected from crosslinking materials, which may also be selected from polymers, oligomers, or monomeric compounds, that have functional groups reactive with the crosslinkable functional groups of the crosslinkable materials and, optionally, may also include photoinitiators that, on exposure to actinic radiation, initiate addition polymerization of crosslinkable functional groups of the crosslinkable materials, so that the crosslinkable functional groups and the crosslinkers have at least three kinds of mutually reactive combinations.
Abstract:
A moisture-curing hot-melt-adhesive composition in granulate, tablet or powder form can be produced by a.) fusing the reactive hot-melt-adhesive composition and heating the melt, subject to exclusion of moisture, b.) extruding this melt through one or more dies onto a cooled surface, subject to exclusion of moisture, c.) cooling the granulate, subject to exclusion of moisture, whereby the composition solidifies, d.) removing the cooled hot-melt-adhesive granulate, e.) filling the granulate into moisture-tight packages, subject to exclusion of moisture. These reactive hot-melt adhesives are pourable and free-flowing and therefore can be used with all conventional application machines for hot-melt adhesives.
Abstract:
Pressure sensitive adhesives are provided which possess high load bearing capabilities at elevated temperatures. The adhesives are prepared by polymerization of a syrup polymer composition having a first solute polymer having reactive, pendant functional groups, a second component having co-reactive functional groups, and a monomer mixture. The syrup polymer contains reactive electrophilic or nucleophilic functional groups that can subsequently crosslink by reaction with a second component having co-reactive functional groups.
Abstract:
This invention relates to star-branched polymers containing pendent olefinic groups which have been crosslinked using actinic radiation and the use of these polymers in adhesives and coating applications.
Abstract:
The invention provides oiled-face adherable, hot-melt adhesive composition which has constitutive components consisting of thermoplastic resin such as ethylene-acrylate ester resin, tacky resin such as rosin ester derivative and waxes such as paraffin wax and/or plasticizer such as naphthene oil, and also contains modified resin components obtained by introducing into the molecular chains of these components a phosphoric acid group or, if desired, a carboxyl or its anhydride group, for example, by grafting 2-hydroxy-3-(meth)acryloxypropyl phosphate.By providing the composition, adhesion and seal of metals with difficulty adhesive plastics are improved and a non-slip processing method of face-oiled metal scaffolding boards can be accomplished.
Abstract:
An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive first particles dispersed in the adhesive material and having a first shape; and a plurality of electrically conductive second particles dispersed in the adhesive material and having a second shape different from the first shape. A ratio of a total weight of the first particles to a total weight of the second particles is in a range from about 2 to about 10. The adhesive layer has an average thickness in a range from about 5 micrometers to about 35 micrometers. An electrical conductance of the adhesive layer in a thickness, but not in an in-plane, direction is at least 5% greater than a comparative adhesive layer having the same construction except that it does not include the second particles.
Abstract:
Provided are a pressure-sensitive adhesive tape, a method of manufacturing the same, and an electronic device having the same. The pressure-sensitive adhesive tape includes: a fiber accumulation type substrate in which a plurality of fibers are accumulated to form a plurality of pores therebetween; a metal coating layer coated on the outer circumferential surfaces of the plurality of fibers of the fiber accumulation type substrate; and an electrically conductive adhesive layer formed on one side or both sides of the fiber accumulation type substrate on which the metal coating layer is formed, wherein the electrically conductive adhesive layer is formed of an electrically conductive adhesive material filled in the plurality of pores and is electrically connected by an applied pressure.
Abstract:
A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin.