公开(公告)号：US20150212285A1

公开(公告)日：2015-07-30

申请号：US14553478

申请日：2014-11-25

Applicant: FUJITSU LIMITED

Inventor： Norio Kainuma ,  Takashi Kubota

IPC: G02B6/42 ,  G02B6/43 ,  G02B6/13 ,  G01J1/04

CPC classification number: G01J1/0407 ,  G01J1/0204 ,  G01J1/0252 ,  G01J1/0411 ,  G01J1/0414 ,  G02B6/4204 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/428

Abstract: An optical module comprising: an optical waveguide transports light, the optical waveguide including a first mirror which reflects first light; an adhesive sheet formed over the optical waveguide, the adhesive sheet including a first gap above the first mirror; a first light-transmissive layer formed in the first gap; a lens sheet arranged over the adhesive sheet, the lens sheet including a first lens which is formed above the first light-transmissive layer; and a light-emitting device formed above the lens sheet, the light-emitting device including a light-emitting portion which emits the first light to the first lens.

Abstract translation: 一种光学模块，包括：光波导传输光，所述光波导包括反射第一光的第一反射镜; 在所述光波导上形成的粘合片，所述粘合片包括在所述第一反射镜上方的第一间隙; 形成在第一间隙中的第一透光层; 透镜片，布置在所述粘合片上，所述透镜片包括形成在所述第一透光层上方的第一透镜; 以及形成在所述透镜片的上方的发光装置，所述发光装置包括向所述第一透镜发射所述第一光的发光部。

公开(公告)号：US20140339403A1

公开(公告)日：2014-11-20

申请号：US14277127

申请日：2014-05-14

Applicant: Enplas Corporation

Inventor： Shimpei MORIOKA

IPC: G02B6/43 ,  G01J1/04 ,  G02B6/26

CPC classification number: G01J1/0425 ,  G01J1/0204 ,  G01J1/0407 ,  G01J1/0414 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/4286

Abstract: The present invention relates to an optical receptacle that can generate monitor light and can be also produced by integral molding, and an optical module having the optical receptacle. The optical receptacle has a first optical face on which light emitted from a light emitting element is incident, reflection surfaces that reflect the light to a light receiving element, a light splitting section that splits the light into monitor light heading for the light receiving element and signal light heading for an end face of an optical fiber, and a second optical face that emits the signal light toward the end face of the optical fiber. The light splitting section has a divided transmission surface and a divided reflection surface. The divided reflection surface is an inclining surface with respect to an optical axis of the light reflected by the reflection surfaces.

Abstract translation: 本发明涉及一种能够生成监视光并且还可以通过一体成型制造的光学插座，以及具有光学插座的光学模块。 光学插座具有从发光元件发射的光入射的第一光学面，将光反射到光接收元件的反射面，将光分解成朝向光接收元件的监视光的光分离部，以及 信号光朝向光纤的端面，以及第二光学面，其朝向光纤的端面发射信号光。 分光部分具有分开的透射表面和分开的反射表面。 分割反射面是相对于被反射面反射的光的光轴的倾斜面。

公开(公告)号：US20140263973A1

公开(公告)日：2014-09-18

申请号：US14200568

申请日：2014-03-07

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jens Geiger ,  Susanne Westenhöfer

IPC: G01J1/02

CPC classification number: G01J1/0204 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/4204

Abstract: Compact optoelectronic modules are described and can be used in various electronic or other appliances, such as television units. For example, a light emitting device, a first sensor or sensor module such as an infra-red sensor or an infra-red receiver module, and a second sensor or sensor module such as an ambient light sensor or ambient light sensor module, can be integrated into a single compact optoelectronic module. Multiple such optoelectronic modules can be fabricated in a wafer-level process.

Abstract translation: 紧凑型光电模块被描述并且可以用于各种电子设备或其他设备，例如电视机。 例如，发光装置，第一传感器或诸如红外传感器或红外接收器模块的传感器模块以及诸如环境光传感器或环境光传感器模块的第二传感器或传感器模块可以是 集成到单个紧凑型光电模块中。 可以在晶片级工艺中制造多个这样的光电模块。

公开(公告)号：US20140224967A1

公开(公告)日：2014-08-14

申请号：US14065477

申请日：2013-10-29

Applicant: Mitsubishi Electric Corporation

Inventor： Yuji Masuyama ,  Masaharu Nakaji ,  Yoshihiro Hisa

IPC: G01J1/02 ,  G01J1/44

CPC classification number: G01J1/0204 ,  G01J1/0271 ,  H01L31/0203 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor photodetector device includes a header, a high frequency amplifier, and a submount having a top surface. The high frequency amplifier is located on the header and has a top surface with a high frequency grounding pad disposed on the top surface of the amplifier. A semiconductor photodetector having a footprint smaller than the top surface of the submount is located on the top surface of the submount. The top surface of the submount has thereon an electrode pad to which the semiconductor photodetector is bonded, and an electrode pad disposed adjacent the electrode pad. The high frequency grounding pad is connected to the electrode pad by a wire.

Abstract translation: 一种半导体光检测器件包括一个头部，一个高频放大器和一个具有顶面的底座。 高频放大器位于接头上，并具有顶表面，高频接地焊盘设置在放大器的顶表面上。 具有小于底座的顶表面的占地面积的半导体光电探测器位于基座的顶表面上。 底座的顶表面上有一个电极焊盘，半导体光电探测器与之接合，电极焊盘与电极焊盘相邻。 高频接地垫通过电线连接到电极焊盘。

公开(公告)号：US20140151585A1

公开(公告)日：2014-06-05

申请号：US13904168

申请日：2013-05-29

Applicant: Hon Hai Precision Industry Co., Ltd.

Inventor： YI HUNG

IPC: G01J1/04

CPC classification number: G01J1/0411 ,  G01J1/0204 ,  G01J1/0266 ,  G01J1/0407 ,  G01J1/0451

Abstract: A photoelectric conversion device includes a circuit board, a first light emitting module, a first light receiving module, a second light emitting module, a second light receiving module, and an optical coupling member. The light emitting modules and the light receiving modules are mounted on the circuit board. The optical coupling member includes a first reflective surface obliquely connected to the light incident surface, four converging lenses, a second reflective surface, and a third reflective surface. The converging lenses are formed on the light incident surface. The first reflective surface defines a recess for receiving the second and third reflective surfaces. The third converging lens is fed by the second reflective surface and the fourth converging lens is fed by the third reflective surface.

Abstract translation: 光电转换装置包括电路板，第一发光模块，第一光接收模块，第二发光模块，第二光接收模块和光耦合构件。 发光模块和光接收模块安装在电路板上。 光耦合构件包括倾斜地连接到光入射表面的第一反射表面，四个会聚透镜，第二反射表面和第三反射表面。 会聚透镜形成在光入射面上。 第一反射表面限定用于接收第二和第三反射表面的凹部。 第三会聚透镜由第二反射表面馈送，第四会聚透镜由第三反射表面馈送。

公开(公告)号：US20140125972A1

公开(公告)日：2014-05-08

申请号：US14051636

申请日：2013-10-11

Applicant: SONY CORPORATION

Inventor： Kazuhide Namba ,  Youji Sakioka ,  Hiroaki Ebihara ,  Daisuke Yoshioka ,  Ryota Moriwaka

IPC: G01J1/42

CPC classification number: H04N5/2353 ,  G01J1/0204 ,  G01J1/4214 ,  G01J1/4228 ,  G01J1/44 ,  G01J2001/0257 ,  G01J2001/4426 ,  G03B7/091 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H04N5/2256 ,  H04N5/2355 ,  H04N5/35581 ,  H04N5/374 ,  H04N5/37455 ,  H04N5/3765

Abstract: An imaging device includes an exposure control unit, a determination unit, and an illuminance calculation unit. The exposure control unit is configured to control a plurality of exposure times. The determination unit is configured to determine whether or not saturation occurs using at least one data item of a plurality of data items obtained during the plurality of exposure times. The illuminance calculation unit is configured to calculate, if the determination unit determines that the saturation occurs, an illuminance using a data item different from the at least one data item used in the determination.

Abstract translation: 成像装置包括曝光控制单元，确定单元和照度计算单元。 曝光控制单元被配置为控制多个曝光时间。 确定单元被配置为使用在多个曝光时间期间获得的多个数据项中的至少一个数据项来确定是否发生饱和。 照度计算单元被配置为如果确定单元确定饱和发生，则使用与确定中使用的至少一个数据项不同的数据项来计算照度。

公开(公告)号：US08610070B2

公开(公告)日：2013-12-17

申请号：US12799626

申请日：2010-04-28

Applicant: Thomas R. Schimert ,  Thomas P. Fagan, III ,  Athanasios J. Syllaios

Inventor： Thomas R. Schimert ,  Thomas P. Fagan, III ,  Athanasios J. Syllaios

IPC: H01L27/14 ,  G01J5/20 ,  H01L31/00

CPC classification number: G01J5/20 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0429 ,  G01J1/0488 ,  G01J4/04 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/023 ,  G01J5/024 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0825 ,  G01J5/0862

Abstract: Pixel-level monolithic optical element configurations for uncooled infrared detectors and focal plane arrays in which a monolithically integrated or fabricated optical element may be suspended over a microbolometer pixel membrane structure of an uncooled infrared detector element A monolithic optical element may be, for example, a polarizing or spectral filter element, an optically active filter element, or a microlens element that is structurally attached by an insulating interconnect to the existing metal interconnects such that the installation of the optical element substantially does not impact the thermal mass or thermal time constant of the microbolometer pixel structure, and such that it requires little if any additional device real estate area beyond the area originally consumed by the microbolometer pixel structure interconnects.

Abstract translation: 用于非制冷红外探测器和焦平面阵列的像素级单片光学元件配置，其中单片集成或制造的光学元件可以悬挂在非制冷红外探测器元件的微测辐射热计像素膜结构上。单片光学元件可以是例如 偏振或光谱滤光器元件，光学有源滤光器元件或微透镜元件，其通过绝缘互连结构地附接到现有金属互连，使得光学元件的安装基本上不影响光学元件的热质量或热时间常数 微照度计像素结构，并且使得其需要很少的额外的设备房地产区域超出由微测热计像素结构原始消耗的区域互连。

公开(公告)号：US08519321B2

公开(公告)日：2013-08-27

申请号：US12624660

申请日：2009-11-24

Applicant: Anthony F. Barna ,  Lawrence P. Nardo ,  Charles W. Melvin, Jr. ,  Jason P. Walton ,  A. Arthur Kressner

Inventor： Anthony F. Barna ,  Lawrence P. Nardo ,  Charles W. Melvin, Jr. ,  Jason P. Walton ,  A. Arthur Kressner

IPC: G06M7/00

CPC classification number: G01J1/02 ,  G01D4/008 ,  G01D5/34715 ,  G01J1/0204 ,  G01J1/0219 ,  G01J1/0228 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0403 ,  G01J1/0411 ,  G01J1/42 ,  Y02B90/245 ,  Y02B90/247 ,  Y04S20/40 ,  Y04S20/50

Abstract: An optical sensor for detecting motion or movement in an area of interest and a method of operation is provided. The system includes a CMOS sensor having an array of pixels that captures images in an area of interest. The system monitors the average pixel value for the array to define a first state. If the average pixel value changes beyond a defined threshold, the system defines a second state. For each change in state, a signal is generated. In one embodiment, the optical sensor is used with a meter having a dial with an indicator. The optical sensor generates a signal each time the indicator passes through the area of interest to allow for the remote monitoring of a consumable commodity.

Abstract translation: 提供了一种用于检测感兴趣区域中的运动或移动的光学传感器和操作方法。 该系统包括具有捕获感兴趣区域中的图像的像素阵列的CMOS传感器。 系统监视阵列的平均像素值以定义第一状态。 如果平均像素值改变超过定义的阈值，则系统定义第二状态。 对于每次状态改变，都会产生一个信号。 在一个实施例中，光学传感器与具有带指示器的表盘的仪表一起使用。 每当指示器通过感兴趣的区域时，光学传感器就产生一个信号，以便对可消耗的商品进行远程监控。

公开(公告)号：US20130161495A1

公开(公告)日：2013-06-27

申请号：US13495257

申请日：2012-06-13

Applicant: I-THUN LIN

Inventor： I-THUN LIN

IPC: G01J1/04

CPC classification number: G01J1/0271 ,  G01J1/0204 ,  G01J1/0411 ,  G01J1/0425 ,  G01J1/0451 ,  G01J2001/4247 ,  G02B6/4214 ,  G02B6/423

Abstract: A photoelectric converter includes a circuit board, a laser diode, a plurality of optical sensors mounted on the circuit board, a transmission body, and a first lens set, a second lens set, and a plurality of optical fibers mounted on the transmission body. The transmission body defines a reflection groove and a plurality of optical signal splitting holes. A first sidewall of the reflection groove is inclined relative to the transmission direction of the optical signals. A bottom surface of each optical signal splitting hole is inclined relative to the first sidewall and to the second surface. The optical signals transmitted by the first lens set are reflected by the first sidewall. Most of the reflected optical signals are transmitted to the optical fibers via the second lens set, and a small remaining portion of optical signals are reflected by the bottom surface to the optical sensors.

Abstract translation: 光电转换器包括电路板，激光二极管，安装在电路板上的多个光学传感器，透射体，以及安装在透射体上的第一透镜组，第二透镜组和多个光纤。 传输体限定反射槽和多个光信号分离孔。 反射槽的第一侧壁相对于光信号的透射方向倾斜。 每个光信号分离孔的底面相对于第一侧壁和第二表面倾斜。 由第一透镜组发射的光信号被第一侧壁反射。 大多数反射的光信号经由第二透镜组被传输到光纤，并且光信号的小剩余部分被底表面反射到光学传感器。

公开(公告)号：US08422136B2

公开(公告)日：2013-04-16

申请号：US12316057

申请日：2008-12-09

Applicant: Masahiro Hasegawa

Inventor： Masahiro Hasegawa

IPC: G02B27/10

CPC classification number: B32B38/0004 ,  B32B37/12 ,  B32B38/04 ,  B32B2307/416 ,  B32B2310/0843 ,  B32B2315/08 ,  B32B2457/14 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0209 ,  G01J1/04 ,  G01J1/0403 ,  G01J1/0411 ,  G02B3/0012 ,  G02B3/0056 ,  G02B3/0062 ,  G02B13/0035 ,  G02B13/0085 ,  H01L2224/02372 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2924/00014 ,  Y10T156/1052 ,  H01L2224/05099

Abstract: An electronic element wafer module is provided, comprising: an electronic element wafer arranged with a plurality of electronic elements having a through hole electrode; a resin adhesion layer formed in a predetermined area on the electronic element wafer; a transparent cover member covering the electronic element wafer and fixed on the resin adhesion layer; and a plurality of resin optical elements adhered and fixed on the transparent cover member to be integrated in such a manner to correspond to the respective plurality of electronic elements.