Abstract:
A sensor comprises a beam, e.g. of silicon, which resonates at a frequency dependent on the force imposed on the beam. Light on a line induces resonance of the beam by means of the photothermal effect. The light reflected from the beam is amplitude modulated at the resonance frequency, and returns along the line. It is reflected by a semi-reflecting plane mirror onto a lens which focusses it onto a photodetector. The photodetector produces an output voltage modulated at the oscillation frequency, and is thus representative of the force imposed on beam 1.
Abstract:
Resonator measurement system having at least MEMS and/or NEMS, comprising: an optomechanical device comprising at least one resonating element at at least one resonance frequency of fr and at least one optical element whose optical index is sensitive to the displacement of the resonating element, excitation circuitry of exciting the resonating element at least at one operating frequency of fm, injection device for injecting a light beam whose intensity is modulated at frequency f1=fm+Δf in the optomechanical device, a photodetection device configured measure the intensity of a light beam coming out of the optomechanical device, the intensity of the measurement beam having at least one component at frequency Δf.
Abstract:
A resonator device 10 is disclosed. The resonator device may be used in a transducer or a sensor such as a pressure, force or acceleration sensor. The resonator device comprises a resonator 20 provided on a diaphragm 30. A cap 40 is provided which may be fusion bonded to the diaphragm 30 to enclose the resonator 20 and form a hermetically sealed package 10. The resonator device is excited by applying electromagnetic stimulation, such as infra-red or optical stimulation, which may be from a laser via a fibre 50. The resonator device may be interrogated by applying an electromagnetic signal into the optical cavity formed between the resonator 20 and the inside surface of the cap 40 to derive a frequency change of the resonator. As the resonator device incorporates a hermetically sealed package and is stimulated by electromagnetic radiation, it is robust and able to operate in harsh environments.
Abstract:
A strain sensor apparatus for a rotatable shaft including a radiation emitter/receiver, a vibration element attached to the shaft and a reflector that is positioned to reflect radiation onto the vibration element.
Abstract:
A device for measuring a vibration frequency of a mechanically vibrating string or rod, comprising a microwave transmitter for directing microwaves towards the vibrating string and a microwave receiver for receiving the microwaves amplitude modulated by the frequency of mechanical vibration. A member is arranged close to a vibration maximum of the vibrating string. The member is arranged on one side of the vibrating object and the microwave receiver is arranged on the other side thereof. The device is used for measuring temperature, pressure, torque, force or identity.
Abstract:
A device for measuring a vibration frequency of a mechanically vibrating string or rod, comprising a microwave transmitter for directing microwaves towards the vibrating string and a microwave receiver for receiving the microwaves amplitude modulated by the frequency of mechanical vibration. A member is arranged close to a vibration maximum of the vibrating string. The member is arranged on one side of the vibrating object and the microwave receiver is arranged on the other side thereof. The device is used for measuring temperature, pressure, torque, force or identity.
Abstract:
A process to form a laterally offset photodiode for an optically coupled resonator includes implanting a semiconductor substrate to form the laterally offset photodiode adjacent to the resonator. The resonator masks the implanting underneath the resonator when the semiconductor substrate is implanted. Also disclosed is an optically coupled resonator, a process for fabricating an optically coupled resonator, and a device including an optically coupled resonator having a laterally offset photodiode.
Abstract:
A very high temperature microbeam sensor of a resonant integrated microstructure having an electrostatic beam driver and an optical fiber pick-up for sensed light from the beam. The high temperature sensor has no components that are vulnerable to temperatures up to 600 degrees C. Associated components for detection, processing and driving are remote from the sensor environment. By using different materials in the beam assembly, such as tungsten for the beam, and sapphire for the substrate and the shell, the sensor can withstand temperatures up to 1000 degrees C. Also, optical fiber may be used for long distance connections between processing electronics and the driver in the sensing device, by locating a photo detector just outside the very or ultra high temperature sensing environment, and then using optical fiber for sending long distance signals from the processor to the driver photo detector, for eliminating electrical signal-to-noise problems.
Abstract:
In a method for monitoring strain variations of a strain responsive element of a micromachined sensor device while subjected to outside parameter conditions, at least two oscillation resonance modes of said element are activated and interrogated optically. Thereby correspondingly at least two resonance frequencies are obtained. From parameter/frequency characteristics of said device correspondingly at least two parameter values are derived.
Abstract:
A stress estimation method for a machine structure according to an embodiment is provided with a calculation step of calculating a relationship between the stress generated at the evaluation target position and a physical quantity including a sound pressure or vibration generated at a detection position different from the evaluation target position during vibration of the machine structure. The stress estimation method for a machine structure is provided with a detection step of detecting the physical quantity generated at the detection position during operation of the machine structure. The stress estimation method for a machine structure is provided with an estimation step of estimating the stress generated at the evaluation target position during operation of the machine structure on the basis of the relationship calculated in the calculation step and the physical quantity detected in the detection step.