METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE, AND MICROMECHANICAL STRUCTURE
    21.
    发明申请
    METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE, AND MICROMECHANICAL STRUCTURE 有权
    制造微观结构的方法和微观结构

    公开(公告)号:US20130042681A1

    公开(公告)日:2013-02-21

    申请号:US13586226

    申请日:2012-08-15

    Abstract: A method for manufacturing a micromechanical structure, and a micromechanical structure. The micromechanical structure encompasses a first micromechanical functional layer, made of a first material, that comprises a buried conduit having a first end and a second end; a micromechanical sensor structure having a cap in a second micromechanical functional layer that is disposed above the first micromechanical functional layer; an edge region in the second micromechanical functional layer, such that the edge region surrounds the sensor structure and defines an inner side containing the sensor structure and an outer side facing away from the sensor structure; such that the first end is located on the outer side and the second end on the inner side.

    Abstract translation: 微机械结构的制造方法和微机械结构。 微机械结构包括由第一材料制成的第一微机械功能层,其包括具有第一端和第二端的埋管; 微机械传感器结构,其具有位于第一微机械功能层上方的第二微机械功能层中的盖; 所述第二微机械功能层中的边缘区域使得所述边缘区域围绕所述传感器结构并限定包含所述传感器结构的内侧和远离所述传感器结构的外侧; 使得第一端位于内侧的外侧和第二端。

    Proof mass for maximized, bi-directional and symmetric damping in high g-range acceleration sensors
    22.
    发明授权
    Proof mass for maximized, bi-directional and symmetric damping in high g-range acceleration sensors 有权
    用于在高g范围加速度传感器中实现最大化,双向和对称阻尼的质量

    公开(公告)号:US08191420B2

    公开(公告)日:2012-06-05

    申请号:US12806415

    申请日:2010-08-12

    Abstract: A new high G-range damped acceleration sensor is proposed with a proof mass optimized for maximized, bi-directional and symmetrical damping to accommodate acceleration ranges above and beyond several thousand G's. In order to achieve the maximum, bi-directional and symmetrical damping, the high G-range acceleration sensor is designed to have minimum amount of mass in the proof mass while maximizing its surface areas. Such high G-range damped acceleration sensor can be applied to any application in which damping (or suppression of ringing) is desired at quite high frequencies.

    Abstract translation: 提出了一种新的高G范围阻尼加速度传感器,其具有针对最大化,双向和对称阻尼优化的检测质量,以适应​​超过数千G的加速度范围。 为了实现最大的双向和对称阻尼,高G范围加速度传感器被设计为在最大化其表面积的同时在检验质量中具有最小量的质量。 这种高G范围阻尼加速度传感器可以应用于在相当高的频率下需要阻尼(或抑制振铃)的任何应用。

    MICROELECTROMECHANICAL SENSOR
    23.
    发明申请
    MICROELECTROMECHANICAL SENSOR 有权
    微电子传感器

    公开(公告)号:US20120073371A1

    公开(公告)日:2012-03-29

    申请号:US13241665

    申请日:2011-09-23

    Applicant: Horst Theuss

    Inventor: Horst Theuss

    Abstract: In various embodiments, a microelectromechanical system may include a mass element; a substrate; a signal generator; and a fixing structure configured to fix the mass element to the substrate; wherein the mass element is fixed in such a way that, upon an acceleration of the microelectromechanical system, the mass element can be moved relative to the substrate in at least two spatial directions, and wherein a signal is generated by the movement of the mass element by means of the signal generator.

    Abstract translation: 在各种实施例中,微机电系统可以包括质量元件; 底物; 信号发生器; 以及固定结构,其构造成将所述质量元件固定到所述基板; 其中所述质量元件被固定为使得在所述微机电系统的加速时,所述质量元件能够在至少两个空间方向上相对于所述衬底移动,并且其中通过所述质量元件的运动产生信号 通过信号发生器。

    VIBRATION DAMPING MOUNT
    25.
    发明申请

    公开(公告)号:US20180252739A1

    公开(公告)日:2018-09-06

    申请号:US15904500

    申请日:2018-02-26

    Inventor: Alan MALVERN

    CPC classification number: G01P1/003 B81B7/0016 B81B7/0058 G01P2015/0882

    Abstract: A MEMS sensor package includes a MEMS sensor fixed to a vibration damping mount. The mount includes a silicon substrate defining an outer frame; a moveable support to which the MEMS sensor is fixed; and a vibration damping structure connected between the outer frame and the moveable support to damp movement of the support. The MEMS sensor and vibration damping mount are enclosed by a casing that is backfilled with gas.

    Inertial sensor
    29.
    发明授权

    公开(公告)号:US09804188B2

    公开(公告)日:2017-10-31

    申请号:US14763020

    申请日:2013-11-13

    Abstract: An inertial sensor not susceptible to temperature change and vibration disturbance in an implementation environment of the inertial sensor is provided. In the present invention, for example, as illustrated in FIG. 9, an extending portion EXU is provided so as to connect to a fixing portion FU3, this extending portion EXU and a third region P3 which configures part of a mass body MS are connected via a support beam BM3 and a support beam BM4, and the support beam BM3 and the support beam BM4 are disposed oppositely with respect to a virtual line IL1. With this, natural frequency of an unwanted mode due to rotation and torsion of the mass body MS can be shifted to a high frequency band.

    DAMPED LINEAR ACCELEROMETER
    30.
    发明申请

    公开(公告)号:US20170261528A1

    公开(公告)日:2017-09-14

    申请号:US15454249

    申请日:2017-03-09

    CPC classification number: G01P1/003 G01P15/123 G01P2015/0817 G01P2015/0882

    Abstract: Linear accelerometer comprising a fixed part, a rotationally moving part in the plane of the accelerometer around an axis of rotation orthogonal to the plane of the accelerometer, the moving part comprising a centre of gravity distinct from the point of intersection of the axis of rotation and the plane of the accelerometer, means forming pivot link between the moving part and the fixed part, means for detecting the displacement of the moving part with respect to the fixed part, means for viscous damping the displacement of the moving part in said plane, said viscous damping means comprising interdigitated combs, at least one first comb on the moving part and at least one second comb on the fixed part (2), the first comb and the second comb being interdigitated.

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