Patent search cpc:"H01L2224/73201" Page 3

21.

发明申请
FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT 审中-公开

公开(公告)号：US20170170133A1

公开(公告)日：2017-06-15

申请号：US15396844

申请日：2017-01-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： JEAN AUDET , LUC G. GUERIN , RICHARD LANGLOIS , STEPHAN L. MARTEL , SYLVAIN E. OUIMET

IPC: H01L23/00

CPC classification number: H01L24/08 , H01L23/49816 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/73 , H01L24/81 , H01L25/16 , H01L28/40 , H01L2224/0401 , H01L2224/08265 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/16265 , H01L2224/1703 , H01L2224/17051 , H01L2224/73201 , H01L2224/73204 , H01L2224/80815 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/81986 , H01L2224/92125 , H01L2924/15151 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/00014 , H01L2924/014

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

22.

发明申请
Multiple bond via arrays of different wire heights on a same substrate 有权

公开(公告)号：US20170154875A1

公开(公告)日：2017-06-01

申请号：US15430943

申请日：2017-02-13

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh , Rajesh Katkar

IPC: H01L25/065 , H01L49/02 , B81B7/00 , H01L23/00

CPC classification number: H01L25/0657 , B81B7/0074 , H01L21/4853 , H01L23/3675 , H01L23/42 , H01L23/481 , H01L23/49811 , H01L23/522 , H01L23/5383 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/24 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/16 , H01L25/50 , H01L28/10 , H01L28/20 , H01L28/40 , H01L2224/0239 , H01L2224/0332 , H01L2224/0333 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0347 , H01L2224/03614 , H01L2224/0391 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/04042 , H01L2224/05111 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05169 , H01L2224/05184 , H01L2224/05547 , H01L2224/05565 , H01L2224/05568 , H01L2224/05569 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/05684 , H01L2224/1134 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11903 , H01L2224/1191 , H01L2224/13022 , H01L2224/13023 , H01L2224/13025 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/13184 , H01L2224/13565 , H01L2224/13616 , H01L2224/1403 , H01L2224/14131 , H01L2224/14132 , H01L2224/14134 , H01L2224/16145 , H01L2224/16146 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/16265 , H01L2224/17181 , H01L2224/24147 , H01L2224/24227 , H01L2224/244 , H01L2224/32145 , H01L2224/3303 , H01L2224/33181 , H01L2224/45015 , H01L2224/45147 , H01L2224/48091 , H01L2224/48149 , H01L2224/4903 , H01L2224/73201 , H01L2224/73253 , H01L2224/73265 , H01L2224/81192 , H01L2224/81193 , H01L2224/81825 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06562 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12042 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/16251 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/3841 , H01L2924/00 , H01L2924/01029 , H01L2924/014 , H01L2924/00012 , H01L2924/01074 , H01L2924/01028 , H01L2924/01082 , H01L2224/05 , H01L2224/13 , H01L2224/81 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2224/45099

Abstract: Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

23.

发明授权
Component built-in board and method of manufacturing the same, and component built-in board mounting body 有权
Title translation: 组件内置板及其制造方法，以及组件内置板安装体

公开(公告)号：US09591767B2

公开(公告)日：2017-03-07

申请号：US14290173

申请日：2014-05-29

Applicant: FUJIKURA LTD.

Inventor： Kazuhisa Itoi , Masahiro Okamoto

IPC: H05K1/02 , H05K1/18 , H05K3/10 , H01L23/538 , H01L23/367 , H01L21/48 , H01L23/00 , H05K3/00 , H05K3/46

CPC classification number: H05K3/10 , H01L21/4857 , H01L23/367 , H01L23/3677 , H01L23/5389 , H01L24/19 , H01L2224/02311 , H01L2224/0401 , H01L2224/04105 , H01L2224/05569 , H01L2224/08237 , H01L2224/11312 , H01L2224/1132 , H01L2224/11334 , H01L2224/11416 , H01L2224/11418 , H01L2224/12105 , H01L2224/13009 , H01L2224/1329 , H01L2224/13294 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13316 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/1336 , H01L2224/1339 , H01L2224/16225 , H01L2224/16238 , H01L2224/16503 , H01L2224/2929 , H01L2224/32225 , H01L2224/73201 , H01L2224/73251 , H01L2224/73253 , H01L2224/80203 , H01L2224/80447 , H01L2224/80903 , H01L2224/81192 , H01L2224/81203 , H01L2224/8185 , H01L2224/81862 , H01L2224/81907 , H01L2224/83192 , H01L2224/83203 , H01L2224/8349 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2224/9221 , H01L2924/07811 , H01L2924/12042 , H01L2924/15153 , H05K1/0206 , H05K1/0207 , H05K1/186 , H05K3/0061 , H05K3/4602 , H05K3/4614 , H05K2201/0969 , H05K2201/10674 , Y10T29/49126 , H01L2924/00014 , H01L2924/0665 , H01L2924/0635 , H01L2924/069 , H01L2224/81 , H01L2224/83 , H01L2224/80 , H01L2224/16 , H01L2224/08 , H01L2224/32 , H01L2924/00

Abstract: A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer.

Abstract translation: 一种组件内置板，其中堆叠有多个印刷布线基底，其具有形成在其树脂基底上的布线图案和通孔，并且包括内置于其中的电子部件，其中多个印刷的至少一部分布线基底包括布线图案中的热布线，并且在通孔中包括热通孔，多个印刷布线基底中的至少一个在其中形成有电子部件构建的开口，并且在其中形成有导热层并且紧贴在与内置于开口部的电子部件的电极形成面相反一侧的面上，电子部件通过形成有孔的层叠在导热层上的粘接层固定在开口部在面向导热层的开口的区域中。

24.

发明申请
Multiple bond via arrays of different wire heights on a same substrate 有权

公开(公告)号：US20160049390A1

公开(公告)日：2016-02-18

申请号：US14925807

申请日：2015-10-28

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh , Rajesh Katkar

IPC: H01L25/00 , H01L21/56 , H01L21/311 , H01L21/768 , H01L23/00

CPC classification number: H01L25/50 , H01L21/31111 , H01L21/4853 , H01L21/563 , H01L21/76898 , H01L23/49811 , H01L23/5384 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/24 , H01L24/32 , H01L24/33 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/85 , H01L24/89 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L2224/02311 , H01L2224/02317 , H01L2224/02371 , H01L2224/02372 , H01L2224/0239 , H01L2224/0331 , H01L2224/0332 , H01L2224/0333 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0347 , H01L2224/03614 , H01L2224/0391 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/04042 , H01L2224/05111 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05169 , H01L2224/05184 , H01L2224/05547 , H01L2224/05565 , H01L2224/05568 , H01L2224/05569 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/05684 , H01L2224/08146 , H01L2224/0823 , H01L2224/1134 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11903 , H01L2224/1191 , H01L2224/13022 , H01L2224/13023 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/13184 , H01L2224/13565 , H01L2224/13616 , H01L2224/1403 , H01L2224/14131 , H01L2224/14134 , H01L2224/16145 , H01L2224/16146 , H01L2224/16148 , H01L2224/16227 , H01L2224/17181 , H01L2224/24147 , H01L2224/24227 , H01L2224/244 , H01L2224/32145 , H01L2224/32225 , H01L2224/3303 , H01L2224/33181 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/4805 , H01L2224/48108 , H01L2224/48149 , H01L2224/4903 , H01L2224/49426 , H01L2224/73201 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81192 , H01L2224/81193 , H01L2224/81825 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06524 , H01L2225/06548 , H01L2924/00014 , H01L2924/01322 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/16152 , H01L2924/16251 , H01L2924/181 , H01L2924/19107 , H01L2924/381 , H01L2924/3841 , H01L2924/386 , H01L2924/00 , H01L2924/01029 , H01L2924/014 , H01L2924/00012 , H01L2924/01074 , H01L2924/01028 , H01L2924/01082 , H01L2224/05 , H01L2224/13 , H01L2224/16225 , H01L2224/81 , H01L2224/45616 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2224/45099

Abstract: An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.

25.

发明授权
MEMS anchor and spacer structure 有权
Title translation: MEMS锚和间隔结构

公开(公告)号：US09213181B2

公开(公告)日：2015-12-15

申请号：US13474532

申请日：2012-05-17

Applicant: Timothy J. Brosnihan , Mark B. Andersson , Eugene E. Fike, III , Joyce Wu , J. Lodewyk Steyn

Inventor： Timothy J. Brosnihan , Mark B. Andersson , Eugene E. Fike, III , Joyce Wu , J. Lodewyk Steyn

IPC: G02B26/00 , G02B26/02 , G09G3/34 , H01L23/544 , B81C1/00 , B81B7/00 , H01L23/00

CPC classification number: G02B26/02 , B81B7/0067 , B81B2201/038 , B81B2201/047 , B81C1/00 , B81C1/00039 , B81C1/00261 , B81C2203/054 , G09G3/3413 , G09G3/3433 , G09G3/3466 , G09G2320/041 , G09G2360/144 , H01L23/544 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/97 , H01L2223/54426 , H01L2224/1132 , H01L2224/114 , H01L2224/11462 , H01L2224/131 , H01L2224/16238 , H01L2224/2612 , H01L2224/29011 , H01L2224/32238 , H01L2224/73201 , H01L2224/81121 , H01L2224/81192 , H01L2224/81815 , H01L2224/83007 , H01L2224/83121 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1461 , H01L2924/15788 , Y10T428/24157 , Y10T428/24744 , H01L2924/014 , H01L2924/00014 , H01L2924/00

Abstract: A display apparatus includes a first substrate, a plurality of microelectromechanical systems (MEMS) light modulators formed from a structural material coupled to the first substrate and a second substrate separated from the first substrate. A plurality of spacers extend from the first substrate to keep the second substrate a minimum distance away from the plurality of light modulators. The spacers include a first polymer layer having a surface in contact with the first substrate, a second polymer layer encapsulating the first polymer layer and a layer of the structural material encapsulating the second polymer layer. The spacers can be used as fluid barriers and configured to surround more than one but less than all of the MEMS light modulators in the display apparatus.

Abstract translation: 显示装置包括第一基板，由耦合到第一基板的结构材料形成的多个微机电系统（MEMS）光调制器和与第一基板分离的第二基板。多个间隔件从第一基板延伸以使第二基板保持离开多个光调制器的最小距离。间隔物包括具有与第一基底接触的表面的第一聚合物层，包封第一聚合物层的第二聚合物层和包封第二聚合物层的结构材料层。间隔件可以用作流体屏障并且被配置为围绕显示装置中的多于一个但是不到所有的MEMS光调制器。

26.

发明申请
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND COMPONENT BUILT-IN BOARD MOUNTING BODY 有权
Title translation: 组件内置板及其制造方法和组件内置板安装体

公开(公告)号：US20140268574A1

公开(公告)日：2014-09-18

申请号：US14290173

申请日：2014-05-29

Applicant: FUJIKURA LTD.

Inventor： Kazuhisa Itoi , Masahiro Okamoto

IPC: H05K1/02 , H05K3/10

CPC classification number: H05K3/10 , H01L21/4857 , H01L23/367 , H01L23/3677 , H01L23/5389 , H01L24/19 , H01L2224/02311 , H01L2224/0401 , H01L2224/04105 , H01L2224/05569 , H01L2224/08237 , H01L2224/11312 , H01L2224/1132 , H01L2224/11334 , H01L2224/11416 , H01L2224/11418 , H01L2224/12105 , H01L2224/13009 , H01L2224/1329 , H01L2224/13294 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13316 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/1336 , H01L2224/1339 , H01L2224/16225 , H01L2224/16238 , H01L2224/16503 , H01L2224/2929 , H01L2224/32225 , H01L2224/73201 , H01L2224/73251 , H01L2224/73253 , H01L2224/80203 , H01L2224/80447 , H01L2224/80903 , H01L2224/81192 , H01L2224/81203 , H01L2224/8185 , H01L2224/81862 , H01L2224/81907 , H01L2224/83192 , H01L2224/83203 , H01L2224/8349 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2224/9221 , H01L2924/07811 , H01L2924/12042 , H01L2924/15153 , H05K1/0206 , H05K1/0207 , H05K1/186 , H05K3/0061 , H05K3/4602 , H05K3/4614 , H05K2201/0969 , H05K2201/10674 , Y10T29/49126 , H01L2924/00014 , H01L2924/0665 , H01L2924/0635 , H01L2924/069 , H01L2224/81 , H01L2224/83 , H01L2224/80 , H01L2224/16 , H01L2224/08 , H01L2224/32 , H01L2924/00

Abstract: A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer.

Abstract translation: 一种组件内置板，其中堆叠有多个印刷布线基底，其具有形成在其树脂基底上的布线图案和通孔，并且包括内置于其中的电子部件，其中多个印刷的至少一部分布线基底包括布线图案中的热布线，并且在通孔中包括热通孔，多个印刷布线基底中的至少一个在其中形成有电子部件构建的开口，并且在其中形成有导热层并且紧贴在与内置于开口部的电子部件的电极形成面相反一侧的面上，电子部件通过形成有孔的层叠在导热层上的粘接层固定在开口部在面向导热层的开口的区域中。

27.

发明申请
STACK PACKAGE 审中-公开
Title translation: 堆叠包

公开(公告)号：US20130087887A1

公开(公告)日：2013-04-11

申请号：US13687024

申请日：2012-11-28

Applicant: SK HYNIX INC.

Inventor： Si Han KIM , Myung Geun PARK

IPC: H01L29/92

CPC classification number: H01L29/92 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L27/0805 , H01L28/40 , H01L2224/02371 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/04073 , H01L2224/05548 , H01L2224/06188 , H01L2224/08147 , H01L2224/08148 , H01L2224/08195 , H01L2224/08265 , H01L2224/16105 , H01L2224/16145 , H01L2224/16265 , H01L2224/1703 , H01L2224/171 , H01L2224/291 , H01L2224/32105 , H01L2224/32237 , H01L2224/48091 , H01L2224/48227 , H01L2224/73201 , H01L2224/73207 , H01L2224/73251 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19103 , H01L2924/19104 , H01L2924/00014 , H01L2924/014 , H01L2224/10 , H01L2224/48

Abstract: A stack package includes a first semiconductor chip first pads and second pads disposed thereon and a second semiconductor chip having third pads and fourth pads electrically connected with the second pads disposed thereon. Capacitors are interposed between the first semiconductor chip and the second semiconductor chip, and include first electrodes electrically connected with the first pads of the first semiconductor chip, second electrodes electrically connected with the third pads of the second semiconductor chip, and dielectrics interposed between the first electrodes and the second electrodes.

Abstract translation: 堆叠封装包括第一半导体芯片第一焊盘和设置在其上的第二焊盘，以及具有第三焊盘的第二半导体芯片和与其上设置的第二焊盘电连接的第四焊盘。电容器插入在第一半导体芯片和第二半导体芯片之间，并且包括与第一半导体芯片的第一焊盘电连接的第一电极，与第二半导体芯片的第三焊盘电连接的第二电极，以及介于第一半导体芯片之间的电介质电极和第二电极。

28.

发明申请
Semiconductor Devices and Methods of Manufacture Thereof 审中-公开

公开(公告)号：US20180102351A1

公开(公告)日：2018-04-12

申请号：US15836580

申请日：2017-12-08

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shu-Ting Tsai , Dun-Nian Yaung , Jen-Cheng Liu , Szu-Ying Chen , U-Ting Chen

IPC: H01L25/00 , H01L23/48

CPC classification number: H01L25/50 , H01L21/76805 , H01L21/76898 , H01L23/481 , H01L24/08 , H01L24/24 , H01L24/73 , H01L24/80 , H01L24/82 , H01L24/92 , H01L25/0657 , H01L2224/08145 , H01L2224/2405 , H01L2224/24146 , H01L2224/24147 , H01L2224/245 , H01L2224/73201 , H01L2224/73251 , H01L2224/80894 , H01L2224/80895 , H01L2224/80896 , H01L2224/82101 , H01L2224/82106 , H01L2224/82931 , H01L2224/82947 , H01L2224/9202 , H01L2224/9212 , H01L2224/9222 , H01L2225/06544 , H01L2225/06565 , H01L2924/00014 , H01L2924/0002 , H01L2924/00 , H01L2924/00012 , H01L2924/01074 , H01L2924/01029 , H01L2924/01013 , H01L2224/08 , H01L2224/24 , H01L2224/80 , H01L2224/82 , H01L2224/8203 , H01L2224/821 , H01L2224/80001

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a first semiconductor chip including a first substrate and a first conductive feature formed over the first substrate, and a second semiconductor chip bonded to the first semiconductor chip. The second semiconductor chip includes a second substrate and a second conductive feature formed over the second substrate. A conductive plug is disposed through the first conductive feature and is coupled to the second conductive feature. The conductive plug includes a first portion disposed over the first conductive feature, the first portion having a first width, and a second portion disposed beneath or within the first conductive feature. The second portion has a second width. The first width is greater than the second width.