Abstract:
A successive approximation ADC capable of reducing deterioration in AD conversion accuracy due to noise is provided. An AD converter according to an embodiment includes: a DA converter that generates a comparison voltage based on a sampling value obtained by sampling an analog signal, and a successive approximation control signal; a reference voltage generation circuit that generates a reference voltage used for the successive approximation process; a comparator that compares the comparison voltage with the reference voltage and outputs a successive approximation result; a successive approximation processing unit that generates the successive approximation control signal based on the successive approximation result; and a storage unit that stores an expected value of the AD conversion process. The reference voltage generation circuit generates the reference voltage based on the expected value stored in the storage unit.
Abstract:
A touch processor circuit includes a capacitance-to-voltage converter and an analog-to-digital converter. The capacitance-to-voltage converter converts an input signal transmitted from a touch sensor into a conversion signal corresponding to a capacitance of the touch sensor. The analog-to-digital converter digitizes the conversion signal transmitted from the capacitance-to-voltage converter and generates a digital value. The analog-to-digital converter includes a first converter, a second converter, and a combination logic circuit. The first converter calculates upper bits of the digital value based on the conversion signal during a first time period. The second converter calculates lower bits of the digital value based on a residue component signal transmitted from the first converter during a second time period. The combination logic circuit combines the upper bits and the lower bits and generates the digital value.
Abstract:
A novel noise injection technique is presented to improve dynamic range with low resolution and low speed analog to digital converters. This technique combines incoming signal and noise signal with wave front de-multiplexer and split into several channels. Then low resolution and low speed analog to digital converters are used to sample each channels. All signals are recovered using wave front multiplexer. For advanced design, ground diagnostic signals with optimizing processor can be added to guarantee recovery quality.
Abstract:
A flicker noise measurement circuit includes a first section. The first section includes a plurality of first stages connected in series. The first section includes a first feedback switching element configured to selectively feedback an output of the plurality of first stages to an input of the plurality of first stages. The first section includes a first section connection switching element. The flicker noise measurement circuit includes a second section connected to the first section. The second section includes a plurality of second stages connected in series, wherein the first section connection switching element is configured to selectively connect the plurality of second stages to the plurality of first stages. The second section includes a second feedback switching element configured to selectively feedback an output of the plurality of second stages to the input of the plurality of first stages.
Abstract:
The present disclosure provides an R-2R ladder resistor circuit including: plural first resistance elements, one end of each being connected to an input terminal; plural second resistance elements, one end of each being connected to a reference potential; plural third resistance elements, one end of each being connected to an output terminal; and plural switching connection sections that are each in correspondence relationships with th first resistance elements, the second resistance elements, and the third resistance elements, and that connect the input terminal and the output terminal according to a bit signal, wherein, according to the bit signal, each switching connection section switchably connects another end of the third resistance element to another end of the first resistance element or to another end of the second resistance element, among the first resistance element, the second resistance element, and the third resistance element corresponding thereto.
Abstract:
A D/A converter is configured to output tri-level potentials from an output terminal. A high potential terminal and the output terminal are connected through a p-type MOS transistor. An intermediate potential terminal and the output terminal are connected through p-type and n-type MOS transistors, which are connected in series and have low threshold voltages. A low potential terminal and the output terminal are connected through an n-type MOS transistor. The p-type MOS transistor and the n-type MOS transistor connected to the intermediate potential terminal have a positive voltage and a negative voltage between gate-source paths in off-states, respectively, and a substrate bias effect and hence remain in the off-state stably.
Abstract:
A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.
Abstract:
A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. A first chip and a second chip are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip having a function of sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and a function of quantizing the sampled signals to obtain digital signals.
Abstract:
A solid-state imaging apparatus includes: a ramp signal generator for generating first and second time-changing ramp signals during first and second analog-to-digital conversion periods, respectively; comparators for comparing a reset signal of a pixel with the first ramp signal during the first analog-to-digital conversion period, and comparing a pixel signal with the second ramp signal during the second analog-to-digital conversion period; and memories for storing, as first and second digital data, count values of counting from a start of changing the first and second ramp signals until an inversion of outputs of the comparators, during the first and second analog-to-digital conversion periods, wherein the ramp signal generator supplies a current from a current generator to a first capacitor element by a sampling and holding operation of a switch, and generates the first and second ramp signals based on the same bias voltage held by the first capacitor element.
Abstract:
Methods and apparatus are provided for sampling an indicator of the internal state of an embedded system or integrated circuit, where the indicator is sampled in a manner synchronous to the internal clock of the embedded system or integrated circuit. The resulting samples can be used for determining secret data within the embedded system or integrated circuit, detecting failures, or detecting counterfeit devices.