公开(公告)号：US20240147150A1

公开(公告)日：2024-05-02

申请号：US18407322

申请日：2024-01-08

Applicant: AliveCor, Inc.

Inventor： David Nalin Kumar ,  Vinod Khosla

IPC: H04R1/46 ,  A61B7/02 ,  A61B7/04 ,  G06F3/14 ,  G10L25/66 ,  G16H50/20 ,  H04R1/04 ,  H04R1/40 ,  H04R3/00 ,  H04R19/04

CPC classification number: H04R1/46 ,  A61B7/026 ,  A61B7/04 ,  G06F3/14 ,  G10L25/66 ,  G16H50/20 ,  H04R1/04 ,  H04R1/406 ,  H04R3/005 ,  H04R19/04 ,  A61B2562/028 ,  H04R2201/003 ,  H04R2201/401

Abstract: A digital stethoscope includes a stethoscope housing defining a housing edge. The digital stethoscope also includes a surface region secured to the stethoscope housing at the housing edge, and a number of microphones. The digital stethoscope also includes a processing device disposed within the stethoscope housing and in communication with the microphones. The processing device receives the digital audio data from the microphones.

公开(公告)号：US20240147139A1

公开(公告)日：2024-05-02

申请号：US18336030

申请日：2023-06-16

Applicant: xMEMS Labs, Inc.

Inventor： Chao-Yu Chen ,  Chiung C. Lo ,  Jemm Yue Liang ,  Wen-Chien Chen ,  Jye Ren

IPC: H04R1/28 ,  H04R1/10 ,  H04R1/24 ,  H04R19/02

CPC classification number: H04R1/2811 ,  H04R1/1016 ,  H04R1/24 ,  H04R19/02 ,  H04R2201/003

Abstract: An acoustic device includes a first sound producing component and a back cavity structure. The first sound producing component has a first front side and a first back side, wherein the first sound producing component is a high frequency sound unit, and the first front side faces a sound propagating opening of the acoustic device. The back cavity structure is connected to the first back side of the first sound producing component. The first sound producing component produces a first acoustic wave from the first front side towards the sound propagating opening, and the first sound producing component produces a second acoustic wave from the first back side towards a back cavity of the back cavity structure. The back cavity structure is configured to flatten a peak or a dip of a frequency response of the first sound producing component.

公开(公告)号：US11974109B2

公开(公告)日：2024-04-30

申请号：US17826185

申请日：2022-05-27

Applicant: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.

Inventor： Euan James Boyd ,  Scott Lyall Cargill

IPC: H04R7/12 ,  H04R1/08 ,  H04R7/16

CPC classification number: H04R7/12 ,  H04R1/08 ,  H04R7/16 ,  H04R2201/003

Abstract: Provided is an MEMS device, including: a base, a rear cavity; a vibrating diaphragm, the vibrating diaphragm including an upper diaphragm and a lower diaphragm, and an accommodation space being formed between the upper and lower diaphragms; a counter electrode arranged in the accommodation space; and supporting members concentrically arranged and spaced apart. The supporting members are arranged between the upper and lower diaphragms and are spaced apart from the counter electrode, two opposite ends of each supporting member are connected to the upper and lower diaphragms, and at least one of the supporting members is provided with first cavities. An upper ventilation hole and a lower ventilation hole are respectively formed at a position of the upper diaphragm and a position of the lower diaphragm corresponding to one of the first cavities; and the upper ventilation hole, the first cavity and the lower ventilation hole communicate with each other.

公开(公告)号：US20240134041A1

公开(公告)日：2024-04-25

申请号：US18274191

申请日：2022-02-01

Applicant: SONAIR AS

Inventor： Tobias DAHL ,  Frode TYHOLDT ,  Jon TSCHUDI

IPC: G01S15/89 ,  G01S7/521 ,  H04R1/40 ,  H04R3/00 ,  H04R19/04

CPC classification number: G01S15/89 ,  G01S7/521 ,  H04R1/406 ,  H04R3/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2201/401

Abstract: A method and system of imaging at least one passive object within a surrounding structure is provided. The surrounding structure has multiple surfaces. The method includes: transmitting an ultrasonic signal into the surrounding structure using an array of ultrasonic transmitters and receiving reflections from the passive object using an array of ultrasonic receivers. The method also includes steering the ultrasonic signal such that it includes at least one reflection off a surrounding structure surface using stored data relating to a position of at least one of the surfaces.

公开(公告)号：US11956581B2

公开(公告)日：2024-04-09

申请号：US17902239

申请日：2022-09-02

Applicant: Cochlear Limited

Inventor： Joris Walraevens ,  Patrik Kennes ,  Vicente Osorio ,  Stijn Eeckhoudt ,  Koen Erik Van den Heuvel

IPC: A61N1/36 ,  A61N1/05 ,  H04R1/02 ,  H04R1/08 ,  H04R1/22 ,  H04R25/00 ,  H04R31/00

CPC classification number: H04R1/08 ,  A61N1/0541 ,  A61N1/36038 ,  H04R1/02 ,  H04R1/222 ,  H04R25/405 ,  H04R25/604 ,  H04R25/606 ,  H04R31/003 ,  H04R2201/003 ,  H04R2225/41 ,  H04R2225/67 ,  H04R2410/05

Abstract: Disclosed examples generally include methods and apparatuses related to microphone units, such as may be found in implantable medical devices (e.g., cochlear implants). Microphone units generally include a microphone element connected to a chamber having a concave floor with the chamber covered by a membrane. Microphone units can be configured to produce an output based on pressure waves (e.g., sound waves) that reach the membrane. In an example, a microphone unit has a pressurized gas within the chamber below the membrane such that, while in a static state, the membrane deflects away from the chamber floor.

公开(公告)号：US11950053B2

公开(公告)日：2024-04-02

申请号：US17739202

申请日：2022-05-09

Applicant: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.

Inventor： Zhengyu Shi ,  Linlin Wang ,  Rui Zhang

IPC: H04R19/04 ,  B81B3/00 ,  H04R7/04 ,  H04R7/18

CPC classification number: H04R19/04 ,  B81B3/0045 ,  H04R7/04 ,  H04R7/18 ,  B81B2201/0257 ,  H04R2201/003

Abstract: The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

公开(公告)号：US20240101410A1

公开(公告)日：2024-03-28

申请号：US17952357

申请日：2022-09-26

Applicant: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.

Inventor： Taimoor Ali

IPC: B81B3/00 ,  H04R23/00

CPC classification number: B81B3/0021 ,  H04R23/008 ,  B81B2201/0257 ,  B81B2201/047 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/053 ,  H04R2201/003

Abstract: An MEMS optical microphone, including a casing including an inner cavity and a sound inlet that communicates the inner cavity with outside; an MEMS module including a diaphragm suspended in the inner cavity, an aperture is provided penetrating through the diaphragm, and a size of the aperture increases or decreases with acoustic pressure applied to the diaphragm; an optoelectronic module including an electromagnetic radiation source and a sensor arranged on opposite sides of the diaphragm, the sensor is configured to receive a light beam emitted by the electromagnetic radiation source, the light beam covers the aperture, and a size of the light beam is larger than a maximum size of the aperture; and an integrated circuit module electrically connected with the MEMS module and the optoelectronic module. Dynamic range of the MEMS optical microphone is improved, wider range of sound signals can be sensed, and higher sensitivity can be realized.

公开(公告)号：US11943583B1

公开(公告)日：2024-03-26

申请号：US18462446

申请日：2023-09-07

Applicant: xMEMS Labs, Inc.

Inventor： Neal Edwin Breitbarth

IPC: H04R1/34 ,  H04R1/10 ,  H04R1/24 ,  H04R19/02

CPC classification number: H04R1/345 ,  H04R1/1008 ,  H04R1/1075 ,  H04R1/24 ,  H04R19/02 ,  H04R2201/003

Abstract: A speaker system includes a first acoustic transducer, a second acoustic transducer and a spreading structure. The first acoustic transducer is configured to generate a first acoustic wave. The second acoustic transducer is configured to generate a second acoustic wave. The spreading structure is disposed over the first acoustic transducer and configured to guide the first acoustic wave to propagate through a sound passage formed within the spreading structure. A directionality of the first acoustic wave is spread at a sound outlet of the spreading structure after the first acoustic wave propagates through the sound passage in the spreading structure.

公开(公告)号：US20240089644A1

公开(公告)日：2024-03-14

申请号：US18517963

申请日：2023-11-22

Applicant: Harman International Industries, Incorporated

Inventor： Sullivan DO ,  Yu DU

IPC: H04R1/04 ,  B81B7/02 ,  H04R1/22 ,  H04R1/28 ,  H04R19/04

CPC classification number: H04R1/04 ,  B81B7/02 ,  H04R1/222 ,  H04R1/2896 ,  H04R19/04 ,  B81B2201/0257 ,  H04R2201/003

Abstract: In at least one embodiment, a microphone assembly including a substrate, a printed circuit board (PCB), a micro-electro-mechanical systems (MEMS) transducer, a first lid, and a second lid is provided. The substrate defines a first port that extends completely therethrough. The PCB defines a sound opening that extends completely therethrough. The MEMS transducer is positioned on a first side of the substrate. The first lid defines a second port and covers the MEMS transducer and the first port. The first lid and the substrate define a front volume of air that surrounds the MEMS transducer. The second lid is positioned on the second side of the PCB. A cavity of the second lid, the sound opening of the PCB, the sound opening of the PCB, and the first port of the substrate define a back volume of air that is greater than the front volume of air.

公开(公告)号：US20240083744A1

公开(公告)日：2024-03-14

申请号：US18517221

申请日：2023-11-22

Applicant: Infineon Technologies AG

Inventor： Dietmar Straeussnigg ,  Niccoló De Milleri ,  Andreas Wiesbauer

IPC: B81B7/00 ,  B81B7/02 ,  H04R3/06

CPC classification number: B81B7/008 ,  B81B7/02 ,  H04R3/06 ,  B81B2201/0257 ,  H04R2201/003 ,  H04R2410/03

Abstract: A circuit includes a cross-talk compensation component including a power profile reconstruction component for reconstructing the power profile of a digital microphone coupled to a microelectromechanical (MEMS) device, wherein the power profile represents power consumption of the digital microphone over time between at least two operational modes of the digital microphone, and a reconstruction filter for modeling thermal and/or acoustic properties of the digital microphone; and a subtractor having a first input for receiving a signal from the digital microphone, a second input coupled to the cross-talk compensation component, and an output for providing a digital output signal.