公开(公告)号：US20050136231A1

公开(公告)日：2005-06-23

申请号：US10739807

申请日：2003-12-18

Applicant: Jessica Voss-Kehl ,  Kurt Halverson ,  Caroline Ylitalo ,  Matthew Lehmann ,  Steven Botzet

Inventor： Jessica Voss-Kehl ,  Kurt Halverson ,  Caroline Ylitalo ,  Matthew Lehmann ,  Steven Botzet

IPC: H05K3/10 ,  H05K3/12 ,  H05K3/22 ,  B32B15/04 ,  B29C67/00 ,  B32B27/32

CPC classification number: H05K3/105 ,  H05K3/12 ,  H05K3/125 ,  H05K3/22 ,  H05K2201/0125 ,  H05K2201/0257 ,  H05K2201/0329 ,  H05K2203/013 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2857 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31938

Abstract: Methods of creating fine featured circuits by printing a circuit trace onto polymer shrink films or other biaxially-oriented polymer films are disclosed. The shrink films are heated and shrunk after printing, annealing the circuit trace to form conductive features. Compositions suitable for printing onto the films and articles made using the method and composition are also disclosed.

Abstract translation: 公开了通过将电路迹线印刷到聚合物收缩膜或其它双轴取向聚合物膜上来制造精细特征电路的方法。 收缩膜在印刷后被加热和收缩，对电路迹线退火以形成导电特征。 还公开了适用于印刷在使用该方法和组合物制成的薄膜和制品上的组合物。

公开(公告)号：US06810579B2

公开(公告)日：2004-11-02

申请号：US10207988

申请日：2002-07-31

Applicant: Tien-Min Lu

Inventor： Tien-Min Lu

IPC: H01H1100

CPC classification number: H05K3/12 ,  H01H2209/002 ,  H01H2217/012 ,  H01H2229/002 ,  H01H2229/004 ,  H01H2229/036 ,  H01H2229/038 ,  H01H2229/05 ,  H05K1/0393 ,  H05K2201/0125 ,  H05K2201/0145 ,  H05K2203/1105 ,  Y10T29/49105 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/4987

Abstract: A method for manufacturing membranes after having defined the button key position circuit and matrix layout under the conditions of without jumping and without generating ghost keys includes the steps of: heating and pre-shrinking the PET of a membrane, printing a circuit made from silver paste on the membrane, printing an insulation layer on the printed silver paste circuit or printing carbon powders, folding the membrane and welding the membrane by supersonic wave, and finally punching structural holes on the membrane to complete the membrane production.

公开(公告)号：US20040209508A1

公开(公告)日：2004-10-21

申请号：US10847989

申请日：2004-05-17

Inventor： Arjang Fartash ,  Christopher D. Combs ,  Raiyomand Aspandiar ,  Tom E. Pearson

IPC: H01R013/62

CPC classification number: H05K3/303 ,  H05K3/301 ,  H05K3/3415 ,  H05K2201/0125 ,  H05K2201/09072 ,  H05K2201/10598 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49153

Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.

Abstract translation: 一种用于在随后位于双面印刷电路板的相对侧上的其它部件的回流期间在双面印刷电路板的一侧上保持组装的部件的装置及其制造和使用方法。 保持器包括热收缩构件和保持构件。 由热收缩材料形成的热收缩构件被构造成从预先组装在其一侧上的部件接收通过形成在双面印刷电路板中的开口延伸的柱。 保持构件与热收缩构件联接，并且双面印刷电路板基本上设置在保持构件和部件之间。 当双面印刷电路板的相反侧被填充和回流时，热收缩构件被构造成可收缩地接合柱，将倒置的部件保持在双面印刷电路板上。

公开(公告)号：US06478909B1

公开(公告)日：2002-11-12

申请号：US09545975

申请日：2000-04-10

Applicant: Mark E. Tuttle

Inventor： Mark E. Tuttle

IPC: B32B3100

CPC classification number: H01L24/12 ,  C09J5/02 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0125 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A method for surface mounting electrical components to a substrate, such as a printed circuitboard, involves use of an anisotropically conductive adhesive or Z-Axis adhesive between facing conductive surface areas on the component and substrate. Pressure is applied to the conductive adhesive by a nonconducting adhesive that is first cured between oppositely facing nonconductive surface areas of the component and substrate. This fixes the thickness of each layer of the conductive adhesive at a dimension no greater than its design conductive thickness. In a first submethod, the nonconducting adhesive is a fast setting adhesive subjected to mechanical pressure only as it is assembled on the substrate prior to the subsequent curing of the conductive adhesive. In a second submethod, it is a high shrinkage adhesive that applies compressive force between the component and substrate as it cures and shrinks dimensionally while at a temperature below the subsequent curing temperature of the conductive adhesive.

Abstract translation: 用于将电气部件表面安装到诸如印刷电路板的基板的方法涉及在组件和基板上的面向导电表面区域之间使用各向异性导电粘合剂或Z轴粘合剂。 通过首先在部件和基底的相对面对的非导电表面区域之间固化的不导电粘合剂将压力施加到导电粘合剂上。 这将导电粘合剂的各层的厚度固定在不大于其设计导电厚度的尺寸。 在第一种方法中，不导电粘合剂是仅在其后固化导电粘合剂之前被组装在基底上的机械压力的快速固化粘合剂。 在第二种方法中，它是一种高收缩性粘合剂，当其在低于导电粘合剂的随后固化温度的温度下时，其在组件和基底之间施加压缩力，因为其在尺寸上固化和收缩。

公开(公告)号：US06233821B1

公开(公告)日：2001-05-22

申请号：US09267659

申请日：1999-03-15

Applicant: Satoshi Takahashi ,  Akira Tsutsumi ,  Noriaki Kudo ,  Akihiro Arai ,  Koji Arai ,  Koichi Uno ,  Satoshi Oaku ,  Osamu Ichihara ,  Hiromasa Ota

Inventor： Satoshi Takahashi ,  Akira Tsutsumi ,  Noriaki Kudo ,  Akihiro Arai ,  Koji Arai ,  Koichi Uno ,  Satoshi Oaku ,  Osamu Ichihara ,  Hiromasa Ota

IPC: H05K302

CPC classification number: H05K3/28 ,  H05K3/002 ,  H05K3/022 ,  H05K2201/0125 ,  H05K2201/0154 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49156 ,  Y10T428/12438 ,  Y10T428/24917

Abstract: The present invention aims to obtain a flexible printed wiring board with good flatness. According to the present invention, a copper-clad film 3 is formed by applying a polyamic acid solution on one surface of a copper foil 2 and thermally contracting the polyamic acid layer la so that the other surface of the copper foil 2 may form a convex surface of a curling surface to form a polyimide film 1. A polyamic acid solution is applied on the other surface of the copper foil 2 of the copper-clad film 3, and then the polyamic acid layer 5a is thermally contracted to form a protective film 5, whereby a flexible printed wiring board 10 is obtained.

Abstract translation: 本发明的目的在于获得具有良好平坦度的柔性印刷电路板。根据本发明，通过在铜箔2的一个表面上涂敷聚酰胺酸溶液并将聚酰胺酸层 使得铜箔2的另一个表面可以形成卷曲表面的凸面以形成聚酰亚胺膜1.将聚酰胺酸溶液涂布在覆铜膜3的铜箔2的另一个表面上， 然后热收缩聚酰胺酸层5a以形成保护膜5，从而获得柔性印刷线路板10。

公开(公告)号：US4873397A

公开(公告)日：1989-10-10

申请号：US138237

申请日：1987-12-28

Applicant: Sho Masujima ,  Hiroshi Yagi ,  Atsuzo Tamashima ,  Jun Tamashima

Inventor： Sho Masujima ,  Hiroshi Yagi ,  Atsuzo Tamashima ,  Jun Tamashima

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/305 ,  H05K3/306 ,  H05K2201/0125 ,  H05K2201/0162 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10984 ,  H05K2201/2036 ,  H05K2203/0191 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/306 ,  H05K3/301 ,  H05K3/3447 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic circuit element capable of positively and stably accomplishing its provisional fixing on a printed circuit board substantially free of any trouble and being readily taken out or extracted for the mounting on a printed circuit board, irrespective of a manner of holding of the circuit element prior to the extraction. The electronic circuit element includes an element body and an adhesive or polymeric layer deposited on the element body. The polymeric layer is arranged on a surface of the element body opposite to a printed circuit board on which the circuit element is to be mounted. The polymeric layer is formed of a material exhibiting adhesion when it is heated to a temperature of about 80.degree. C.

Abstract translation: 一种电子电路元件，其能够在印刷电路板上基本上没有任何故障并且容易地取出或提取以便安装在印刷电路板上，而不管电路元件的保持方式如何 提取。 电子电路元件包括元件主体和沉积在元件主体上的粘合剂或聚合物层。 聚合物层布置在元件主体的与要安装电路元件的印刷电路板相对的表面上。 聚合物层由在加热至约80℃的温度下显示出粘合性的材料形成。

公开(公告)号：US4345895A

公开(公告)日：1982-08-24

申请号：US131610

申请日：1980-03-19

Applicant: Randall H. LeFever ,  Boyd G. Brower

Inventor： Randall H. LeFever ,  Boyd G. Brower

IPC: F21K5/04 ,  G03B15/04 ,  H01H37/74 ,  H05K1/00 ,  H05K1/18 ,  H05K3/04 ,  F21K5/02

CPC classification number: G03B15/0457 ,  G03B15/0442 ,  H05K1/0293 ,  H05K2201/0112 ,  H05K2201/0125 ,  H05K2201/0394 ,  H05K2203/175 ,  H05K3/041

Abstract: A photoflash device circuit board assembly including a dielectric substrate, switching element, and conductive member. The switching element and conductive member are pressed (e.g., die-stamped) within the substrate. The substrate is provided with a flexure means to permit it to flex during pressing such that the switching element will not be severed. A photoflash device including the circuit board assembly and a light-transmitting housing and an electrically activated flashlamp is also described.

Abstract translation: 一种闪光灯装置电路板组件，包括电介质基板，开关元件和导电构件。 开关元件和导电构件在衬底内被按压（例如模冲压）。 衬底设置有挠曲装置，以允许其在压制期间弯曲，使得开关元件不会被切断。 还描述了包括电路板组件和透光壳体和电激活闪光灯的照相闪光装置。

公开(公告)号：US4087849A

公开(公告)日：1978-05-02

申请号：US772055

申请日：1977-02-25

Applicant: William T. Colville ,  David W. Mecone ,  Emery G. Audesse

Inventor： William T. Colville ,  David W. Mecone ,  Emery G. Audesse

IPC: G03B15/04 ,  H05K1/00 ,  G03B15/02

CPC classification number: G03B15/0457 ,  H05K1/0293 ,  H05K2201/0112 ,  H05K2201/0125 ,  H05K2201/0394 ,  H05K2203/175

Abstract: A photoflash lamp array comprising a plurality of low voltage filament-type flashlamps mounted on a printed circuit board containing circuitry for sequentially igniting the flashlamps in response to successive low voltage firing pulses applied thereto. A plurality of reflectors respectively associated with the flashlamps are disposed between the lamps and the circuit board, with each reflector having an aperture in alignment with a corresponding aperture in the circuit board. The lamps are divided into upper and lower groups, with the circuit board having an upper connector coupled to the lower group of lamps and a lower connector coupled to the upper group of lamps, whereby one group of lamps functions as an extender for the other group to reduce the "red-eye" photographic effect. Connected in series with each but the first lamp of each group is a radiant-energy-activated quick-connect switch comprising a patch of heat shrinkable polymeric material attached to the circuit board and extending across a respective one of the apertures therein, a fixed contact attached to a first portion of the circuitry, and a resilient movable contact, such as a segment of spring wire, connected at one end to a second portion of the circuitry and having a bent segment at the other end which contacts the polymeric material in alignment with the respective aperture. The movable contact overlies the fixed contact and is held in a preenergized spaced apart relationship therefrom by the bent segment bearing against the polymeric material. Upon ignition of a flashlamp aligned with the respective aperture, the resulting radiant output rapidly melts away the heat shrinkable material from the aperture and thereby releases the movable contact to resiliently engage the fixed contact as the bent segment enters the circuit board aperture.

Abstract translation: 一种闪光灯阵列，包括安装在印刷电路板上的多个低电压灯丝型闪光灯，其包含用于响应于施加到其上的连续低电压点火脉冲而顺序地点燃闪光灯的电路。 分别与闪光灯相关联的多个反射器设置在灯和电路板之间，每个反射器具有与电路板中的相应孔对准的孔。 灯被分成上组和下组，电路板具有耦合到下组灯的上连接器和耦合到上组灯的下连接器，由此一组灯用作另一组的延长器 减少“红眼”的摄影效果。 与每个组除了第一个灯串联的是辐射能激活的快速连接开关，其包括附接到电路板并延伸穿过其中的相应一个孔的热收缩聚合物材料片，固定触点 连接到电路的第一部分，以及弹性活动触点，例如弹簧线的一段，其一端连接到电路的第二部分，并且在另一端具有与对准的聚合材料接触的弯曲段 与相应的光圈。 可动触头覆盖在固定触头上，并通过弯曲的支承部分抵靠聚合物材料保持预加压间隔的关系。 当与相应的孔对齐的闪光灯点燃时，所得到的辐射输出迅速地从该孔中熔化掉热收缩材料，从而当弯曲部分进入电路板孔时释放可动触头以弹性地接合固定触头。

公开(公告)号：US09285083B2

公开(公告)日：2016-03-15

申请号：US13085945

申请日：2011-04-13

Applicant: GunKyo Lee

Inventor： GunKyo Lee

IPC: F21V9/00 ,  F21S4/00 ,  F21K99/00 ,  F21V31/00 ,  H05K3/28 ,  F21Y101/02 ,  F21Y103/00

CPC classification number: F21K9/17 ,  F21K9/27 ,  F21V31/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H05K3/281 ,  H05K2201/0125 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A light emitting device module is provided comprising a light emitting device package, a printed circuit board on which the light emitting device package is arranged and a sealing member that surrounds the light emitting device package and the printed circuit board, wherein a predetermined space is formed between the light emitting device package and the printed circuit board and the sealing member.

Abstract translation: 提供一种发光器件模块，其包括发光器件封装，其上布置有发光器件封装的印刷电路板和围绕发光器件封装和印刷电路板的密封构件，其中形成预定空间 在发光器件封装和印刷电路板之间以及密封构件。

公开(公告)号：US20160007473A1

公开(公告)日：2016-01-07

申请号：US14333837

申请日：2014-07-17

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： Sameh Dardona ,  Wayde R. Schmidt ,  Slade R. Culp

IPC: H05K3/00 ,  H05K3/12 ,  H05K1/16

CPC classification number: H05K1/167 ,  B29C61/003 ,  B29C61/02 ,  B29K2025/06 ,  H01L21/4867 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/032 ,  H05K1/034 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0125 ,  H05K2201/0162 ,  H05K2201/083 ,  H05K2203/0271 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1194 ,  H01L2924/00

Abstract: A method for fabricating printed electronics and optical components includes printing a trace of electrically conductive, semiconductive or insulating material on a substrate and shrinking the substrate to a target size. The material can include an ink, solution, dispersion, powder, slurry, paste or the like. The step of shrinking can include heating the substrate at a predetermined temperature based on properties of the substrate. The step of shrinking can also include heating the substrate for a predetermined duration based on properties of the substrate. The step of shrinking can also include releasing an external electrical potential used to stretch the substrate during printing. For example, the substrate may decrease in area by at least fifty percent during heating.

Abstract translation: 制造印刷电子学和光学部件的方法包括在衬底上印刷导电，半导体或绝缘材料迹线，并将衬底收缩到目标尺寸。 该材料可以包括油墨，溶液，分散体，粉末，浆料，糊剂等。 收缩的步骤可以包括基于基底的性质在预定温度下加热基底。 收缩步骤还可以包括基于基底的性质将衬底加热预定的持续时间。 收缩的步骤还可以包括在印刷期间释放用于拉伸基板的外部电位。 例如，在加热过程中，衬底的面积减少至少百分之五十。