公开(公告)号：US09632263B2

公开(公告)日：2017-04-25

申请号：US15029016

申请日：2014-09-11

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Shibata ,  Yuichi Tsujita

IPC: G02B6/12 ,  G02B6/42 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32

CPC classification number: G02B6/4245 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4239 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/117 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0358 ,  H05K2201/09481 ,  H05K2201/09827 ,  H05K2201/10121 ,  H05K2201/2009 ,  H05K2201/2054

Abstract: In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.

公开(公告)号：US20170054046A1

公开(公告)日：2017-02-23

申请号：US15076081

申请日：2016-03-21

Applicant: ORBITAL ATK, INC.

Inventor： Robert Minelli

IPC: H01L31/05 ,  H05K3/30 ,  H05K1/18 ,  H05K3/28 ,  H01L31/048 ,  H01L31/02

CPC classification number: H01L31/0504 ,  H01L31/02008 ,  H01L31/048 ,  H01L31/188 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/305 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/10121 ,  Y02E10/50 ,  Y02P70/613

Abstract: A flexible, lightweight photovoltaic cell array includes one or more individual photovoltaic cell strings attached to a polyimide film substrate and covered with a polyvinyl fluoride film. Each photovoltaic cell string includes one or more photovoltaic cells attached to a flexible printed circuit board. The photovoltaic cell array may be manufactured by a method that includes bonding at least one photovoltaic cell to a flexible printed circuit board, mounting the flexible printed circuit board on a polyimide film substrate, and covering the flexible printed circuit board with a substantially transparent polyvinyl fluoride film.

Abstract translation: 柔性，轻质的光伏电池阵列包括一个或多个单独的光伏电池串，其连接到聚酰亚胺膜基底上并被聚氟乙烯膜覆盖。 每个光伏电池串包括连接到柔性印刷电路板的一个或多个光伏电池。 光伏电池阵列可以通过包括将至少一个光伏电池接合到柔性印刷电路板，将柔性印刷电路板安装在聚酰亚胺膜基底上的方法制造，并用基本上透明的聚氟乙烯覆盖柔性印刷电路板 电影。

公开(公告)号：US20160250830A1

公开(公告)日：2016-09-01

申请号：US15027323

申请日：2014-10-08

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Satoshi KIYA ,  Sumito UEHARA ,  Kousuke MIURA ,  Makoto NAKABAYASHI

IPC: B32B27/32 ,  H05K3/38 ,  H05K1/02 ,  H05K3/20 ,  B32B7/12 ,  H05K1/03

CPC classification number: B32B27/322 ,  B32B7/12 ,  B32B27/30 ,  B32B2457/08 ,  H05K1/024 ,  H05K1/0274 ,  H05K1/034 ,  H05K1/0366 ,  H05K3/007 ,  H05K3/067 ,  H05K3/20 ,  H05K3/281 ,  H05K3/285 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0326 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0264 ,  H05K2203/0278 ,  H05K2203/0376 ,  H05K2203/0769 ,  H05K2203/1173

Abstract: A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.

Abstract translation: 含氟树脂作为主要成分的氟树脂基材在其表面的至少部分区域上具有改性层，所述改性层含有硅氧烷键和亲水性有机官能团，所述改性层的表面具有接触角 90°以下。

公开(公告)号：US09332637B2

公开(公告)日：2016-05-03

申请号：US13998482

申请日：2013-11-04

Applicant: NOVOSET, LLC

Inventor： Sajal Das ,  Patrick Shipman

IPC: H05K1/03

CPC classification number: H05K1/0326 ,  B32B15/06 ,  B32B15/20 ,  B32B25/02 ,  B32B2307/204 ,  B32B2457/08 ,  C08F279/02 ,  C08F283/12 ,  C08J5/24 ,  C08J2351/00 ,  C08J2351/08 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0162

Abstract: A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1−f-W]n−1-[W-(Z)f/(H)1−f-(OCN)f/(R)1−f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

公开(公告)号：US09253884B2

公开(公告)日：2016-02-02

申请号：US14136428

申请日：2013-12-20

Applicant: Intel Corporation

Inventor： Christopher Jezewski ,  Ravi Pillarisetty ,  Brian Doyle

IPC: H01L23/52 ,  H05K1/03 ,  D03D1/00 ,  D03D11/02 ,  D03D15/00 ,  H05K3/00 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/038 ,  D03D1/0088 ,  D03D11/02 ,  D03D15/00 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/10 ,  H05K3/28 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/029

Abstract: A system comprises an article comprising one or more fabric layers, a plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers.

Abstract translation: 系统包括包括一个或多个织物层的制品，多个电子装置，每个电子装置并入到一个或多个织物层中的一个或多个织物层中的一个上，以及多个电子装置中的两个或更多个之间的一个或多个通信连接。 多个电子设备中的每一个可以包括耦合到织物层的柔性衬底，沉积在柔性衬底上的一个或多个金属化层以及电耦合到一个或多个金属化层的一个或多个电子部件。

公开(公告)号：US09204537B2

公开(公告)日：2015-12-01

申请号：US13623615

申请日：2012-09-20

Applicant: FINISAR CORPORATION

Inventor： Henry Meyer Daghighian ,  Steve Bird ,  Bruce Sramek

IPC: H05K1/02 ,  H04B10/40 ,  H01P3/08 ,  H05K3/46 ,  H05K1/03 ,  H05K1/16 ,  H05K3/40 ,  H05K3/42

CPC classification number: H05K1/0283 ,  H01P3/08 ,  H01P3/088 ,  H04B10/40 ,  H05K1/0242 ,  H05K1/0251 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/165 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4691 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/086 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: High-speed pluggable rigid-end flex circuit. A circuit includes a flexible section, rigid section, connector disposed on the rigid section, and electrically conductive signal transmission line electrically coupled to the connector. The flexible section includes a first portion of a flexible insulating layer. The rigid section includes a second portion of the flexible insulating layer and a rigid insulating layer disposed on the second portion of the flexible insulating layer. The connector is configured to form a pluggable conductive connection. The electrically conductive signal transmission line includes a first signal trace having a root mean square surface roughness below 20 micrometers and a filled signal via configured to pass through at least a portion of the rigid insulating layer. The flexible and rigid insulating layers have a dissipation factor equal to or below a ratio of 0.004 and a dielectric constant equal to or below a ratio of 3.7.

Abstract translation: 高速可插拔刚性端柔性电路。 电路包括柔性部分，刚性部分，设置在刚性部分上的连接器，以及电连接到连接器的导电信号传输线。 柔性部分包括柔性绝缘层的第一部分。 刚性部分包括柔性绝缘层的第二部分和设置在柔性绝缘层的第二部分上的刚性绝缘层。 连接器被配置成形成可插拔的导电连接。 导电信号传输线包括具有低于20微米的均方根粗糙度的第一信号迹线和经配置以穿过刚性绝缘层的至少一部分的填充信号通道。 柔性和刚性绝缘层的损耗因子等于或低于0.004的比例和等于或低于3.7的介电常数。

公开(公告)号：US20150159043A1

公开(公告)日：2015-06-11

申请号：US14561070

申请日：2014-12-04

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chung-Ting Lai ,  Chih-Wei Lin

IPC: C09D179/08 ,  B05D1/38 ,  B05D3/00

CPC classification number: C09D179/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/322 ,  B32B2038/0016 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2311/00 ,  B32B2379/08 ,  B32B2457/08 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1071 ,  H05K1/036 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/2495 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/31544 ,  C08L27/18 ,  C08L83/04 ,  C08K3/36

Abstract: A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.

Abstract translation: 多层聚酰亚胺膜包括含有含氟聚合物颗粒并具有第一表面和第二表面的第一聚酰亚胺层，以及分别设置在第一表面和第二表面上的第二聚酰亚胺层和第三聚酰亚胺层。 第二和第三聚酰亚胺层含有有机硅氧化合物颗粒。 多层聚酰亚胺膜的热膨胀系数（CTE）为约13至约30ppm /℃。

公开(公告)号：US08985818B2

公开(公告)日：2015-03-24

申请号：US13508676

申请日：2010-11-26

Applicant: Daisuke Kitagawa ,  Yoshinari Takayama ,  Ichiro Suehiro ,  Hideyuki Usui ,  Takashi Oda

Inventor： Daisuke Kitagawa ,  Yoshinari Takayama ,  Ichiro Suehiro ,  Hideyuki Usui ,  Takashi Oda

IPC: H05K1/03 ,  C08L27/18 ,  H01L23/373 ,  H01L33/60 ,  H01L33/64 ,  H05K3/00

CPC classification number: H05K1/0373 ,  C08L27/18 ,  H01L23/3735 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesin, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m·K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.

Abstract translation: 本发明的LED安装基板包括由含有氮化硼粉末和氟树脂的组合物构成的导热层（导热片（10）），氟树脂含有聚四氟乙烯。 导热层的导热率为2W /（m·K）以上。 导热层在380nm，470nm和650nm的波长处具有0.80以上的反射率。

公开(公告)号：US20140335341A1

公开(公告)日：2014-11-13

申请号：US14364978

申请日：2012-12-11

Applicant: LG CHEM, LTD.

Inventor： Young Seok Park ,  Soon Yong Park ,  Se Myung Jang

IPC: H05K1/03 ,  H05K1/05 ,  C09J147/00

CPC classification number: H05K1/0353 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/734 ,  B32B2457/08 ,  C08G73/0655 ,  C08L9/06 ,  C08L27/18 ,  C08L63/00 ,  C09J109/06 ,  C09J179/04 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/022 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/015 ,  Y10T428/31696

Abstract: The present invention relates to an adhesive resin composition for fabrication of circuit boards and its use. The adhesive resin composition of the present invention includes a cyanate ester resin, a fluorine-based resin powder dispersed in the cyanate ester resin, and a rubber component and has low dielectric constant and low dielectric loss factor, which enables the fabrication of circuit boards with further enhanced electrical characteristics.

Abstract translation: 本发明涉及一种用于制造电路板的粘合剂树脂组合物及其用途。 本发明的粘合剂树脂组合物包括氰酸酯树脂，分散在氰酸酯树脂中的氟基树脂粉末和橡胶组分，并且具有低介电常数和低介电损耗因子，这使得可以制造具有 进一步增强电气特性。

公开(公告)号：US08883313B2

公开(公告)日：2014-11-11

申请号：US11547557

申请日：2005-04-04

Applicant: Yoshinori Nanba ,  Yasuhiko Sawada ,  Shunji Kasai ,  Shuji Tagashira ,  Makoto Ono ,  Takahiro Taira ,  Hiroyuki Yoshimoto

Inventor： Yoshinori Nanba ,  Yasuhiko Sawada ,  Shunji Kasai ,  Shuji Tagashira ,  Makoto Ono ,  Takahiro Taira ,  Hiroyuki Yoshimoto

IPC: C08F259/08 ,  C08F214/26 ,  C08F14/26 ,  H05K1/03 ,  H05K1/02

CPC classification number: C08F214/26 ,  C08F14/26 ,  C08F214/262 ,  C08F259/08 ,  H05K1/024 ,  H05K1/0373 ,  H05K2201/015 ,  H05K2201/0212 ,  Y10T428/3154 ,  C08F2/00

Abstract: The present invention provides a polytetrafluoroethylene powder having moldability/processability as well as electrical characteristics in microwave bands. The present invention is a modified polytetrafluoroethylene powder which has (1) a dielectric loss tangent at 12 GHz of not higher than 2.0×10−4 and (2) a cylinder extrusion pressure of not higher than 45 MPa at a reduction ratio of 1600.

Abstract translation: 本发明提供了具有成型性/加工性以及微波带的电特性的聚四氟乙烯粉末。 本发明是一种改性聚四氟乙烯粉末，其具有（1）在12GHz下的介电损耗角正切不高于2.0×10-4，（2）压缩比为1600时的气缸挤压压力不高于45MPa。