公开(公告)号：US06528343B1

公开(公告)日：2003-03-04

申请号：US09646711

申请日：2000-11-29

Applicant: Hiroshi Kikuchi ,  Yoshiyuki Kado ,  Ikuo Yoshida

Inventor： Hiroshi Kikuchi ,  Yoshiyuki Kado ,  Ikuo Yoshida

IPC: H01L2144

CPC classification number: H01L24/94 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/11 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/323 ,  H05K2201/023 ,  H05K2201/091 ,  H05K2201/10719 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Disclosed herein is a semiconductor device, which comprises a semiconductor chip including, over one main surface thereof, first wirings, protective films formed so as to cover other portions excluding parts of the first wirings, flexible layers respectively formed on the protective films so as to exclude the parts of the first wirings, and second wirings having first portions respectively electrically connected to the parts of the first wirings, and second portions respectively drawn onto the flexible layers; a wiring board having third wirings over one main surface thereof; and an adhesive comprising a large number of conductive particles contained in an insulative resin, and wherein the semiconductor chip is bonded to the wiring board with the adhesive interposed therebetween in a state in which the one main surface thereof is face to face with the one main surface of the wiring board, and the second portions of the second wirings are respectively electrically connected to the third wirings with some of the large number of conductive particles interposed therebetween.

Abstract translation: 这里公开了一种半导体器件，其包括在其一个主表面上包括第一布线的半导体芯片，形成为覆盖除了第一布线的部分以外的其它部分的保护膜，分别形成在保护膜上的柔性层，以便 排除第一布线的部分，第二布线具有分别电连接到第一布线的部分的第一部分和分别拉到柔性层上的第二部分; 布线板，其一个主表面上具有第三布线; 以及包含绝缘树脂中所含的大量导电性粒子的粘合剂，其中，所述半导体芯片在其一个主面与所述一个主体面对的状态下与所述配线基板接合， 布线板的表面和第二布线的第二部分分别电连接到第三布线，其中一些导电颗粒被插入其间。

公开(公告)号：US6101708A

公开(公告)日：2000-08-15

申请号：US859258

申请日：1997-05-20

Applicant: Akihiko Okano ,  Terutaka Okano

Inventor： Akihiko Okano ,  Terutaka Okano

IPC: H01R43/02 ,  G02F1/13 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/30

CPC classification number: H01R4/04 ,  H05K3/323 ,  G02F1/13452 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2203/0425 ,  H05K3/361 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A connection terminal portion of a substrate and a terminal portion of an external circuit substrate or a terminal portion of a part are electrically connected together using an anisotropic electrically conducting film. A structure in which a first substrate having a connection terminal portion and a second substrate having a connection terminal portion or a connection terminal portion of a part are connected together with an anisotropic electrically conducting adhesive containing electrically conducting particles, wherein the thickness of the electrically conducting film provided for the connection terminal of the first substrate, the second substrate or the part is smaller than the diameter of the electrically conducting particles. The invention is further concerned with a method of accomplishing the electrical connection.

Abstract translation: 基板的连接端子部分和外部电路基板的端子部分或部分的端子部分使用各向异性导电膜电连接在一起。 一种结构，其中具有连接端子部分的第一基板和具有连接端子部分或部分的连接端子部分的第二基板与包含导电颗粒的各向异性导电粘合剂连接在一起，其中导电 提供给第一基板，第二基板或部分的连接端子的薄膜小于导电颗粒的直径。 本发明还涉及一种完成电连接的方法。

公开(公告)号：US5456616A

公开(公告)日：1995-10-10

申请号：US192086

申请日：1994-02-04

Applicant: Robert M. Fuerst ,  Paul Krebaum ,  Fred L. Krehbiel

Inventor： Robert M. Fuerst ,  Paul Krebaum ,  Fred L. Krehbiel

IPC: C09J9/02 ,  C09J11/04 ,  H01R4/04 ,  H01R13/658 ,  H01R13/7195 ,  H05K1/09 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H01R13/66

CPC classification number: H01R13/65802 ,  H01R4/04 ,  H05K3/321 ,  H05K3/326 ,  H01R13/7195 ,  H05K1/0215 ,  H05K1/09 ,  H05K1/118 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/091 ,  H05K2201/1003 ,  H05K2201/1059 ,  H05K2203/0425 ,  H05K3/306 ,  H05K3/4007

Abstract: An electrical connector assembly includes a housing fabricated of a first metal material and having at least one integral pin projecting from a face thereof. A flat flexible circuit is mounted against the face of the housing and includes a ground plane on a side thereof facing the housing. The circuit has a hole for receiving the integral pin of the housing. The ground plane is of a second metal material different from that of the housing. An omni-directional conductive adhesive is deposited on the ground plane over the area of the hole to expand the conductive interface between the metal housing and the metal ground plane. Preferably, the conductive adhesive includes abrasive grain-like particles.

Abstract translation: 电连接器组件包括由第一金属材料制成并具有从其表面突出的至少一个整体销的壳体。 平面柔性电路安装在壳体的表面上，并且在其面向壳体的一侧上包括接地平面。 电路具有用于接收壳体的整体销的孔。 地平面是与壳体不同的第二金属材料。 在孔的区域上的接地平面上沉积全向导电粘合剂，以扩展金属壳体和金属接地平面之间的导电界面。 优选地，导电粘合剂包括磨粒状颗粒。

公开(公告)号：US5300340A

公开(公告)日：1994-04-05

申请号：US874553

申请日：1992-04-22

Applicant: Clyde D. Calhoun ,  Maurice J. Fleming ,  George D. Foss ,  Richard L. Renstrom

Inventor： Clyde D. Calhoun ,  Maurice J. Fleming ,  George D. Foss ,  Richard L. Renstrom

IPC: H01B5/16 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01B5/00 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01B1/22 ,  C09J7/02 ,  C09J9/02 ,  H01R4/04 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K3/361 ,  Y10S428/906 ,  Y10T428/1429 ,  Y10T428/2438 ,  Y10T428/24413 ,  Y10T428/24545 ,  Y10T428/24843 ,  Y10T428/24893 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2857

Abstract: Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 .mu.m thick.

Abstract translation: 两个基板上的导电元件可以通过包含以预定图案单独定位在粘合剂层中的导电等轴晶粒的胶带电连接。 每个颗粒比要互连的元件更硬，从而手压使颗粒进入元件，从而产生可靠的电连接。 特别有用的颗粒是具有厚度为0.1至2（μm）的金属涂层的玻璃珠。

公开(公告)号：US4814040A

公开(公告)日：1989-03-21

申请号：US174715

申请日：1988-03-29

Applicant: Kazuhito Ozawa

Inventor： Kazuhito Ozawa

IPC: H01R13/02 ,  H01L21/00 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K1/09 ,  H05K3/06 ,  H05K3/32 ,  H05K3/36 ,  C23F1/02 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC classification number: H01L21/67144 ,  H01R4/04 ,  H05K3/323 ,  H05K1/09 ,  H05K1/095 ,  H05K2201/023 ,  H05K2201/0323 ,  H05K2201/035 ,  H05K2203/0522 ,  H05K2203/0571 ,  H05K2203/0723 ,  H05K2203/1189 ,  H05K3/061 ,  H05K3/361 ,  Y10T29/49155

Abstract: An electronic element is connected to a base plate provided with a metallic pattern and a conductive resist layer superposed thereon by a thermal compression process with an adhesive layer sandwiched between the element and the base plate. The adhesive layer contains many metallic particles which are larger than the layer thickness of the resist such that these metallic particles penetrate the resist layer and invade the metallic pattern by the thermal compression process.

Abstract translation: 电子元件通过热压缩工艺连接到设置有金属图案的基板和与其叠置在一起的导电抗蚀剂层，其中夹在元件和基板之间的粘合剂层。 粘合剂层包含大于抗蚀剂层厚度的许多金属颗粒，使得这些金属颗粒穿透抗蚀剂层并通过热压缩过程侵入金属图案。

公开(公告)号：US09928934B2

公开(公告)日：2018-03-27

申请号：US14758220

申请日：2014-01-16

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Hideaki Ishizawa ,  Takashi Kubota

IPC: B32B27/38 ,  B32B27/26 ,  B32B27/20 ,  B32B27/18 ,  C08L63/00 ,  C09J163/00 ,  H01B1/22 ,  C08K5/17 ,  H05K1/11 ,  C08G59/40 ,  C09J9/02

CPC classification number: H01B1/22 ,  C08G59/40 ,  C08K5/17 ,  C09J9/02 ,  H05K1/11 ,  H05K2201/023

Abstract: Provided is a curable composition for an electronic component that can be quickly cured and furthermore can have increased storage stability. The curable composition for an electronic component according to the present invention contains an epoxy compound, an anionic curing agent, a flux, and a basic compound excluding the anionic curing agent.

公开(公告)号：US09491868B2

公开(公告)日：2016-11-08

申请号：US13206693

申请日：2011-08-10

Applicant: Tomoaki Onoue ,  Masaaki Hirayama ,  Yoshiki Aburatani

Inventor： Tomoaki Onoue ,  Masaaki Hirayama ,  Yoshiki Aburatani

IPC: H01R4/04 ,  H05K3/32 ,  H01R4/58 ,  H01R4/00

CPC classification number: H05K3/321 ,  H01R4/00 ,  H01R4/04 ,  H01R4/58 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0323 ,  Y10T428/25

Abstract: A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or pitch-derived fine carbon pieces is used to electrically bond two conductive elements. The conductive resin composition is supplied to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas.

Abstract translation: 一种导电树脂组合物，其包括（a）固化性树脂和（b）通过用细碳粒子和/或沥青衍生的细碳片涂覆球形基础碳颗粒的表面形成的硬球形碳，以将两个导电 元素。 将导电性树脂组合物供给到分别具有彼此电连接的区域的至少两个工件的区域之间的空间，并且在该区域之间施加压力的同时使导电树脂组合物固化。

公开(公告)号：US20110293922A1

公开(公告)日：2011-12-01

申请号：US13206693

申请日：2011-08-10

Applicant: Tomoaki Onoue ,  Masaaki Hirayama ,  Yoshiki Aburatani

Inventor： Tomoaki Onoue ,  Masaaki Hirayama ,  Yoshiki Aburatani

IPC: B32B5/16 ,  H01B1/24 ,  B32B7/12 ,  B32B37/12 ,  B32B37/10

CPC classification number: H05K3/321 ,  H01R4/00 ,  H01R4/04 ,  H01R4/58 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0323 ,  Y10T428/25

Abstract: A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or pitch-derived fine carbon pieces is used to electrically bond two conductive elements. The conductive resin composition is supplied to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas.

Abstract translation: 一种导电树脂组合物，其包括（a）固化性树脂和（b）通过用细碳粒子和/或沥青衍生的细碳片涂覆球形基础碳颗粒的表面形成的硬球形碳，以将两个导电 元素。 将导电性树脂组合物供给到分别具有彼此电连接的区域的至少两个工件的区域之间的空间，并且在该区域之间施加压力的同时使导电树脂组合物固化。

公开(公告)号：US20110250395A1

公开(公告)日：2011-10-13

申请号：US13139926

申请日：2010-06-04

Applicant: Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

Inventor： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

IPC: C09J7/00 ,  B32B15/02 ,  H01B1/22 ,  B32B5/16

CPC classification number: H05K3/323 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/361 ,  H05K2201/023 ,  H05K2203/104 ,  Y10T428/24372 ,  Y10T428/24413 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/268 ,  H01L2924/00 ,  H01L2224/0401

Abstract: There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode 2 and a second connection electrode 10 are connected to each other with a conductive adhesive layer 9 therebetween includes organic films 6 and 11 formed on at least the first connection electrode and conductive particles 8 contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.

Abstract translation: 通过使用导电性粘合剂将各自包括作为防氧化膜的有机膜彼此连接的连接电极简化为生产工艺，提供了以低成本生产的高可靠性产生的高可靠性的连接结构。 其中第一连接电极2和第二连接电极10之间的导电粘合剂层9彼此连接的电极连接结构包括形成在至少第一连接电极上的有机膜6和11以及包含的导电颗粒8 颗粒的长轴在导电粘合剂层的厚度方向上定向，并且长轴的平均长度大于至少有机膜和导电粘合剂层的总厚度，其中导电颗粒刺穿有机物 并与第一连接电极和第二连接电极接触。

公开(公告)号：US07396752B1

公开(公告)日：2008-07-08

申请号：US10986398

申请日：2004-11-10

Applicant: Albert E. Puah

Inventor： Albert E. Puah

IPC: H01L21/44

CPC classification number: H05K3/3457 ,  H01L23/60 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/06505 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/14505 ,  H01L2224/81012 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/023 ,  H05K2203/0278

Abstract: An electronic device is disclosed with solder bumps treated to improve coplanarity and reduce the effects of poor solder bump surface quality, and a method of constructing same. An electronic device is placed against a flat plate and a controlled amount of force is applied to press together the electronic device and flat plate. The taller solder bumps are compressed, reducing non-coplanarity of the solder bumps. The controlled amount of force exposes the bulk material of a solder bump coated with a foreign material. A layer of abrasive, electroconductive particles that is harder than the foreign material, dispersed on the surface of the flat plate and firmly held in place, may also puncture the foreign material and expose the solder bump bulk material when the controlled amount of force is applied.

Abstract translation: 公开了一种电子器件，其具有被处理以改善共面性并减少不良焊料凸起表面质量的影响的焊料凸块及其构造方法。 将电子装置放置在平板上，并施加受控的力以将电子装置和平板压在一起。 较高的焊料凸块被压缩，从而降低焊料凸块的非共面性。 受控的力暴露了涂有异物的焊料凸块的散装材料。 分散在平板表面并牢固地固定就位的比异物硬的研磨性导电颗粒层也可以在施加受控的力量时刺穿异物并暴露焊料块体材料 。