公开(公告)号：US20160007453A1

公开(公告)日：2016-01-07

申请号：US14770143

申请日：2014-02-25

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate

IPC: H05K1/03 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0366 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0215 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: Problem: To prepare a prepreg having high thermal conductivity and a low thermal expansion coefficient. Resolution Means: The prepreg of the present disclosure is composed of a composite layer including an alumina-containing cloth including ceramic fibers and a thermosetting resin composition impregnated into the alumina-containing cloth and having a thermal conductivity coefficient greater than or equal to 1.0 W/(mK).

Abstract translation: 问题：制备具有高热导率和低热膨胀系数的预浸料。 分解方法：本公开的预浸料由包含含有陶瓷纤维的含氧化铝布和浸渍在含氧化铝的布中的热固性树脂组合物的复合层构成，其导热系数大于或等于1.0W / （mK）。

公开(公告)号：US20150327355A1

公开(公告)日：2015-11-12

申请号：US14443231

申请日：2013-11-15

Applicant: JUMATECH GMBH

Inventor： Markus WÖLFEL

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/028 ,  H05K1/0265 ,  H05K1/0278 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0017 ,  H05K3/202 ,  H05K2201/0275 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/057 ,  H05K2201/09027 ,  H05K2201/0969 ,  H05K2201/1028 ,  Y10T29/49156

Abstract: An angle-adjustable printed circuit board structure having two printed circuit board sections arranged angularly with respect to one another. The printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads. The two contact pads are situated on different printed circuit board sections. The printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. The conduction element has a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section.

Abstract translation: 一种角度可调的印刷电路板结构，其具有相对于彼此成角度地布置的两个印刷电路板部分。 印刷电路板结构包含至少一个导电元件，其至少主要嵌入在印刷电路板结构中，并且在两个接触焊盘之间延伸并且导电地连接到所述接触焊盘。 两个接触垫位于不同的印刷电路板部分上。 印刷电路板部分可相对于彼此具有角度可调节和/或成角度，同时维持接触焊盘和至少一个传导元件之间的连接，并且通过经印刷的弯曲边缘弯曲至少一个导电元件 电路板部分。 如横截面所示，导电元件沿着弯曲边缘比垂直方向具有更大的程度。

公开(公告)号：US20150307708A1

公开(公告)日：2015-10-29

申请号：US14435574

申请日：2013-10-18

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Tomo CHIBA ,  Hiroshi TAKAHASHI ,  Eisuke SHIGA ,  Takaaki OGASHIWA

IPC: C08L73/00 ,  C08J5/24 ,  H05K1/03 ,  C08L63/00

CPC classification number: C08L73/00 ,  B32B5/26 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/24 ,  C08G59/4246 ,  C08G59/621 ,  C08G77/18 ,  C08G77/52 ,  C08J5/24 ,  C08J2363/00 ,  C08J2373/00 ,  C08J2383/06 ,  C08J2463/00 ,  C08J2473/00 ,  C08K3/34 ,  C08K3/36 ,  C08L63/00 ,  C08L63/06 ,  C08L83/06 ,  C08L83/14 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/025 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0275 ,  H05K2201/029

Abstract: An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).

Abstract translation: 本发明的目的是提供一种能够获得具有高阻燃性，高耐热性，小热膨胀系数和高钻孔加工性的固化产物的树脂组合物，具有树脂组合物，层压体和金属箔的预浸料 具有该预浸料的复合层压板和具有该树脂组合物的印刷电路板。 一种树脂组合物，其至少具有通过使具有羧基的线性聚硅氧烷（a）与具有环氧基的环状环氧化合物（b）反应制备的环氧硅氧烷树脂（A），使得环状环氧化合物的环氧基（ b）基于线性聚硅氧烷（a）的羧基，氰酸酯化合物（B）和/或酚醛树脂（C）和无机填料（D）为2〜10当量。

公开(公告)号：US20150189746A1

公开(公告)日：2015-07-02

申请号：US14583232

申请日：2014-12-26

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Chih-Wei Liao ,  Hsien-Te Chen ,  Te-Liang Yu ,  Cheng-Ping Liu

IPC: H05K1/03 ,  B32B17/06 ,  H05K1/05 ,  C08G59/62 ,  C08G59/42 ,  C08L71/12 ,  B32B15/20 ,  C08L63/00

CPC classification number: H05K1/0373 ,  B32B15/14 ,  B32B15/20 ,  B32B17/061 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2305/076 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/4261 ,  C08G59/621 ,  C08G59/686 ,  C08K2003/2206 ,  C08L63/00 ,  C08L71/12 ,  H05K1/0366 ,  H05K2201/0275

Abstract: A prepreg is provided. The prepreg is prepared by immersing a reinforcing material into a resin composition and drying the immersed reinforcing material, wherein the resin composition has a first dielectric constant and comprises a thermosetting resin component, a hardener and a filler. The reinforcing material has a second dielectric constant, and the ratio of the first dielectric constant to the second dielectric constant ranges from 0.8 to 1.05.

Abstract translation: 提供预浸料。 通过将增强材料浸渍到树脂组合物中并干燥浸渍的增强材料来制备预浸料，其中树脂组合物具有第一介电常数并且包含热固性树脂组分，硬化剂和填料。 增强材料具有第二介电常数，第一介电常数与第二介电常数之比在0.8至1.05之间。

公开(公告)号：US09052587B2

公开(公告)日：2015-06-09

申请号：US13881854

申请日：2012-10-01

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Hiroshi Yamazaki ,  Yoshimi Igarashi

IPC: H05K3/06 ,  G03F7/00 ,  G03F7/027 ,  G03F7/09 ,  G03F7/095 ,  G03F7/20

CPC classification number: G06F3/041 ,  G03F7/0005 ,  G03F7/027 ,  G03F7/09 ,  G03F7/092 ,  G03F7/095 ,  G03F7/0952 ,  G03F7/0955 ,  G03F7/2022 ,  G06F3/044 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/036 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0275 ,  Y10T428/24802

Abstract: A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Abstract translation: 本发明的导电图案形成方法包括：第一曝光步骤，以图案化方式将有源光照射到设置在基板上的感光性树脂层的感光层和设置在感光性树脂层的表面上的导电膜上 一侧与基板相对; 至少在第一曝光步骤中，在存在氧气的情况下将活性光辐射到感光层的部分或全部未暴露的第二曝光步骤; 以及在第二曝光步骤之后使感光层显影以形成导电图案的显影步骤。

公开(公告)号：US20150107883A1

公开(公告)日：2015-04-23

申请号：US14512514

申请日：2014-10-13

Applicant: TRIPOD TECHNOLOGY CORPORATION

Inventor： Bo-Shiung Huang ,  Wei-Hsiung Yang ,  Han-Ching Shih ,  Cheng-Feng Lin

IPC: H05K1/18 ,  H05K1/03 ,  H05K3/42 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01F17/0006 ,  H01F17/06 ,  H01F27/2804 ,  H01F41/046 ,  H05K1/0272 ,  H05K1/0366 ,  H05K1/115 ,  H05K1/165 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/0275 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/1003 ,  H05K2203/1178 ,  Y10T29/302 ,  Y10T29/49165

Abstract: A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

Abstract translation: 印刷电路板封装结构包括基板，多个环形磁性元件，支撑层和第一导电层。 基板具有两个相对的第一和第二表面，第一环形凹槽和第一凹槽。 每个第一环形凹槽通过至少一个第一凹槽与另一个第一环形凹槽连通，并且至少两个第一环形凹槽通过第一凹槽与基底的侧表面连通 以形成至少两个开口。 环形磁性元件分别位于第一环形凹部中。 支撑层位于第一表面上，并且覆盖第一环形凹部和第一凹槽。 支撑层和基板具有通孔。 第一导电层分别位于支撑层和面向通孔的基板的表面上。

公开(公告)号：US20140374142A1

公开(公告)日：2014-12-25

申请号：US14364914

申请日：2012-11-29

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/03 ,  H05K3/02 ,  H05K1/00

CPC classification number: H05K1/036 ,  B32B5/022 ,  B32B5/024 ,  B32B7/02 ,  B32B15/12 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2457/08 ,  H05K1/00 ,  H05K3/022 ,  H05K3/025 ,  H05K2201/0212 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24942

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

Abstract translation: 根据本实施例的覆金属层压板包括绝缘层和存在于绝缘层的至少一个表面侧上的金属层。 绝缘层是至少三层中心层，存在于中心层的一个表面侧的第一树脂层和存在于中心层的另一表面侧的第二树脂层的层压体。 中心层，第一树脂层和第二树脂层各自含有树脂组合物的固化物。 包含在第一树脂层和第二树脂层中的树脂组合物的固化产物的热膨胀系数小于包含在中心层中的树脂组合物的固化产物的热膨胀系数。

公开(公告)号：US20240090175A1

公开(公告)日：2024-03-14

申请号：US18261994

申请日：2022-01-19

Applicant: Beji SASAKI

Inventor： Beji SASAKI

IPC: H05K7/20 ,  H05K1/02 ,  H05K5/00 ,  H05K13/00

CPC classification number: H05K7/205 ,  H05K1/0209 ,  H05K5/006 ,  H05K13/0015 ,  H05K2201/0212 ,  H05K2201/0275

Abstract: An electronic device has a device part 10; and a fiber member 30 for joining the device part 10 to another member other than the device part included in the electronic device.

公开(公告)号：US20240057252A1

公开(公告)日：2024-02-15

申请号：US18266627

申请日：2020-12-17

Applicant: SEKISUI KASEI CO., LTD.

Inventor： Koichiro OKAMOTO

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K1/036 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0275

Abstract: There are provided a laminate and the like and a circuit board including the same that exhibit an excellent low dielectric property by a non-conventional new approach. The laminate according to an embodiment of the present invention is a laminate used for a core layer of a circuit board, in which the laminate does not include a buildup layer, the laminate is obtained by laminating a plurality of prepregs including a fiber base material layer and a resin layer (A) so that the prepregs are in direct contact with each other, the resin layer (A) contains an inorganic filler and hollow resin particles, and the hollow resin particles are contained in the resin layer (A) in an amount of 1% by weight to 50% by weight with respect to the total amount of the resin layer (A).

公开(公告)号：US11903127B2

公开(公告)日：2024-02-13

申请号：US17381201

申请日：2021-07-21

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Chih-Kai Chang ,  Hung-Yi Chang

IPC: H05K1/03 ,  B32B27/20 ,  B32B27/12 ,  B32B27/32

CPC classification number: H05K1/0366 ,  B32B27/12 ,  B32B27/20 ,  B32B27/322 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2264/101 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2264/301 ,  B32B2457/08 ,  H05K2201/015 ,  H05K2201/0275

Abstract: A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.