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    Element and formation method of film
    23.
    发明授权
    Element and formation method of film 有权
    电影的元素和形成方法

    公开(公告)号：US09572253B2

    公开(公告)日：2017-02-14

    申请号：US14548814

    申请日：2014-11-20

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： Shunpei Yamazaki ,  Teppei Oguni ,  Kiyofumi Ogino ,  Hisao Ikeda

    IPC: H05K1/09 ,  H05K3/12 ,  H01B1/04 ,  G06F3/044

    CPC classification number: H05K1/09 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  H01B1/04 ,  H01L27/323 ,  H01L27/3244 ,  H01L51/5246 ,  H01L2251/5307 ,  H01L2251/5315 ,  H05K1/092 ,  H05K3/06 ,  H05K3/12 ,  H05K3/1283 ,  H05K2201/0323 ,  H05K2201/10151

    Abstract: A novel element is provided. A novel film formation method is provided. A novel element manufacturing method is provided. Furthermore, a film including graphene is formed at low cost and high yield. The element includes a first electrode and a second electrode located apart from the first electrode. The first electrode and the second electrode include graphene. The film including graphene is formed through a first step of forming a film including graphene oxide over a substrate, a second step of immersing the film including graphene oxide in an acidic solution, and a third step of reducing graphene oxide included in the film including graphene oxide. Furthermore, before graphene oxide included in the film including graphene oxide is reduced, the film including graphene oxide is selectively removed by a photolithography technique.

    Abstract translation: 提供了一个新颖的元素。 提供了一种新颖的成膜方法。 提供了一种新颖的元件制造方法。 此外，以低成本和高产率形成包括石墨烯的膜。 元件包括第一电极和与第一电极分开的第二电极。 第一电极和第二电极包括石墨烯。 包括石墨烯的薄膜是通过在衬底上形成包括氧化石墨烯的薄膜的第一步骤形成的，第二步是将包含氧化石墨烯的薄膜浸渍在酸性溶液中;以及第三步骤，还原包括在石墨烯中的石墨烯氧化物 氧化物。 此外，在包括氧化石墨烯的薄膜中包含的氧化石墨烯之前，通过光刻技术有选择地除去包括氧化石墨烯的薄膜。

    Nano graphene platelet-based conductive inks and printing process
    28.
    发明授权
    Nano graphene platelet-based conductive inks and printing process 有权
    纳米石墨烯基血小板基导电油墨和印刷工艺

    公开(公告)号：US09456497B2

    公开(公告)日：2016-09-27

    申请号：US13184787

    申请日：2011-07-18

    Applicant: Bor Z. Jang ,  Aruna Zhamu

    Inventor： Bor Z. Jang ,  Aruna Zhamu

    IPC: C01B31/02 ,  H05K1/00 ,  H01B1/24 ,  B82Y30/00 ,  B82Y40/00 ,  H05K1/09 ,  C09D11/037 ,  C09D11/38 ,  C09D11/52

    CPC classification number: H05K1/097 ,  C09D11/037 ,  C09D11/102 ,  C09D11/30 ,  C09D11/38 ,  C09D11/52 ,  H05K1/0212 ,  H05K1/0259 ,  H05K9/0092 ,  H05K2201/0245 ,  H05K2201/0323 ,  H05K2201/10098

    Abstract: A nano graphene platelet-based conductive ink comprising: (a) nano graphene platelets (preferably un-oxidized or pristine graphene), and (b) a liquid medium in which the nano graphene platelets are dispersed, wherein the nano graphene platelets occupy a proportion of at least 0.001% by volume based on the total ink volume and a process using the same. The ink can also contain a binder or matrix material and/or a surfactant. The ink may further comprise other fillers, such as carbon nanotubes, carbon nano-fibers, metal nano particles, carbon black, conductive organic species, etc. The graphene platelets preferably have an average thickness no greater than 10 nm and more preferably no greater than 1 nm. These inks can be printed to form a range of electrically or thermally conductive components or printed electronic components.

    Abstract translation: 一种纳米石墨烯血小板基导电油墨，其包含：（a）纳米石墨烯片晶（优选未被氧化或原始石墨烯），和（b）其中分散纳米石墨烯片晶的液体介质，其中纳米石墨烯血小板占据比例 至少为0.001体积％，以及使用该容量的方法。 油墨还可以含有粘合剂或基质材料和/或表面活性剂。 油墨还可以包含其它填料，例如碳纳米管，碳纳米纤维，金属纳米颗粒，炭黑，导电有机物质等。石墨烯薄片优选具有不大于10nm的平均厚度，更优选不大于 1nm。 这些油墨可以印刷以形成一系列导电或导热的部件或印刷的电子部件。

    Build-up printed wiring board substrate having a core layer that is part of a circuit
    29.
    发明授权
    Build-up printed wiring board substrate having a core layer that is part of a circuit 有权
    具有作为电路的一部分的芯层的积层印刷线路板基板

    公开(公告)号：US09408314B2

    公开(公告)日：2016-08-02

    申请号：US13491388

    申请日：2012-06-07

    Applicant: Kalu K. Vasoya

    Inventor： Kalu K. Vasoya

    IPC: H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H05K3/46 ,  H05K3/42

    CPC classification number: H05K3/4608 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/11 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/0959 ,  H01L2224/0401

    Abstract: Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are described for increasing the integrity of core layers in designs calling for high density clearance hole drilling. One embodiment of the invention includes a core layer that includes electrically conductive material and at least one build-up wiring portion formed on an outer surface of the core layer. In addition, the build-up portion comprises at least one micro wiring layer including a circuit that is electrically connected to the electrically conductive material in the core layer via a plated through hole.

    Abstract translation: 描述了用于制造集成电路的集成电路和工艺，其使用具有作为印刷线路板的电路的一部分的芯层的印刷线路板基板。 在多个实施例中，芯层由碳复合材料构成。 在几个实施例中，描述了在要求高密度间隙孔钻孔的设计中增加芯层的完整性的技术。 本发明的一个实施例包括芯层，其包括导电材料和形成在芯层的外表面上的至少一个堆积布线部分。 此外，积层部分包括至少一个微布线层，其包括通过电镀通孔与芯层中的导电材料电连接的电路。

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