公开(公告)号：US11657944B2

公开(公告)日：2023-05-23

申请号：US17627887

申请日：2021-03-24

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Yukie Tsuda ,  Yuichi Nakamura ,  Masanao Yamashita ,  Koji Nitta ,  Kou Noguchi

IPC: H01F7/20 ,  H05K1/02 ,  H01F27/06 ,  H01F7/02 ,  G02B27/64

CPC classification number: H01F7/20 ,  H01F7/02 ,  H01F27/06 ,  H05K1/028 ,  G02B27/646 ,  H01F2027/065 ,  H05K2201/08

Abstract: A flexible printed circuit board according to the present disclosures includes a base film having an insulating property, and a planar coil disposed on a surface of the base film, wherein a number of turns on an inside of a center point of a coil width of the planar coil in a plan view is greater than a number of turns on an outside of the center point.

公开(公告)号：US20160073491A1

公开(公告)日：2016-03-10

申请号：US14945073

申请日：2015-11-18

Applicant: CYNTEC CO., LTD.

Inventor： Chih-Tse Chen ,  Joseph D. S. Deng ,  Shih-Hsien Tseng

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K5/00 ,  H05K5/0026 ,  H05K7/00 ,  H05K9/0022 ,  H05K2201/08 ,  H05K2201/1003

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.

Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 任何两个相邻的以太网变压器分别布置有具有第二特定长度的间隙。

公开(公告)号：US20140016289A1

公开(公告)日：2014-01-16

申请号：US13935713

申请日：2013-07-05

Applicant: CYNTEC CO., LTD

Inventor： Chih-Tse Chen ,  Joseph D.S. Deng ,  Shih-Hsien Tseng

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H05K1/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K5/00 ,  H05K5/0026 ,  H05K7/00 ,  H05K9/0022 ,  H05K2201/08 ,  H05K2201/1003

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.

Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 以太网变压器和至少一个网络磁性组件的电感器之间的导电迹线的间隔距离或路径长度小于第一特定长度。

公开(公告)号：US12088208B1

公开(公告)日：2024-09-10

申请号：US18206890

申请日：2023-06-07

Applicant: Vicor Corporation

Inventor： Patrizio Vinciarelli

IPC: H02M3/335 ,  H01F1/44 ,  H01F3/10 ,  H01F27/28 ,  H01F41/04 ,  H02M1/44 ,  H02M3/337 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00 ,  H05K3/02 ,  H02M1/00

CPC classification number: H02M3/33523 ,  H01F1/44 ,  H01F3/10 ,  H01F27/2804 ,  H01F41/041 ,  H02M1/44 ,  H02M3/33561 ,  H02M3/33592 ,  H02M3/3376 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/181 ,  H05K3/0011 ,  H05K3/02 ,  H01F1/447 ,  H01F2003/106 ,  H01F2027/2809 ,  H01F2027/2819 ,  H02M1/0058 ,  H02M1/008 ,  H05K1/0204 ,  H05K1/0265 ,  H05K2201/08 ,  H05K2201/086

Abstract: A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

公开(公告)号：US20230309240A1

公开(公告)日：2023-09-28

申请号：US17955855

申请日：2022-09-29

Applicant: Zhuhai ACCESS Semiconductor Co., Ltd

Inventor： Xianming CHEN ,  Xiaowei XU ,  Gao HUANG ,  Benxia HUANG

IPC: H05K3/06 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/064 ,  H05K3/0044 ,  H05K3/4647 ,  H05K1/0298 ,  H05K2203/025 ,  H05K2203/061 ,  H05K2203/143 ,  H05K2203/1446 ,  H05K2201/0376 ,  H05K2201/08

Abstract: A manufacturing method for a conductive substrate with a filtering function includes preparing a core layer and forming first and second conductive holes in the core layer, forming a sacrificial copper layer on the first conductive hole and on the core layer, forming a metal layer on the second conductive hole, forming a metal post in the first conductive hole, forming a lower insulating layer on the core layer, forming a lower insulative post in the second conductive hole, forming a magnet wrapping around the metal post to obtain a first conductive post, forming an upper insulating layer on the core layer, forming an upper insulative post in the second conductive hole to obtain a second conductive post, removing the upper insulating layer, the lower insulating layer, and the remaining sacrificial copper post layer, followed by flattening.

公开(公告)号：US11749655B2

公开(公告)日：2023-09-05

申请号：US17326727

申请日：2021-05-21

Applicant: Shenzhen Galaxypixel Electronics Co., Ltd

Inventor： Ligang Zhao ,  Guangming Song ,  Heng Zhan ,  Youhe Zhang ,  Lei Liang

IPC: H05K1/02 ,  H01L25/13 ,  H01L33/48

CPC classification number: H01L25/13 ,  H01L33/483 ,  H05K1/028 ,  H05K2201/08 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: An icosahedral LED display screen belongs to the field of display screens and includes multiple cabinet main frames. Each cabinet main frame is formed with an accommodating cavity. A side of each cabinet main frame is provided with a flexible PCB, an outer side of the flexible PCB is disposed with LEDs, and an inner side of the flexible PCB is provided with a magnet fixedly therewith. The multiple e.g., twenty cabinet main frames are mutually connected to form an icosahedral sphere which has no end point similar to a football, and polygons that make up the sphere are the same, and therefore the cabinet main frames can be completely covered by the flexible PCBs to eliminate a missing of display at an endpoint and reduce design numbers and complexities of the cabinet main frames and the flexible PCBs. An installation of the LED display screen becomes more convenient.

公开(公告)号：US20230254965A1

公开(公告)日：2023-08-10

申请号：US17650092

申请日：2022-02-07

Applicant: L3Harris Technologies, Inc.

Inventor： CHARLES WEIRICK ,  VOI NGUYEN

IPC: H05K1/02 ,  H01F7/13 ,  H01F7/126 ,  H01F7/02

CPC classification number: H05K1/0209 ,  H01F7/13 ,  H01F7/126 ,  H01F7/0273 ,  H05K2201/08

Abstract: An electronic device may include an electronic circuit, a heat sink thermally coupled to the electronic circuit, and spaced apart cooling fins extending from the heat sink. Each cooling fin includes a circuit board and a cooling device mounted thereon. The cooling device may have a conductive trace layer on the circuit board defining an electromagnet, a mounting member extending upwardly from the circuit board, a fan blade coupled to an upper end of the mounting member to be movable in a rocking motion about an axis defined by the mounting member, and a permanent magnet carried by the fan blade and responsive to the electromagnet.

公开(公告)号：US09903754B2

公开(公告)日：2018-02-27

申请号：US15240277

申请日：2016-08-18

Applicant: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Xiao-Hu Tang ,  Pei Liu

IPC: G01J1/18 ,  H05K1/02 ,  H05K1/18 ,  H05K1/14

CPC classification number: G01J1/18 ,  G01V8/20 ,  H05K1/0274 ,  H05K1/0275 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10234

Abstract: A security device in an electronic device which protects against unauthorized disassembly includes light sources, a plurality of photosensitive elements, a detection unit, a storage unit, a processor, and light guiding devices. Light conducting channels are provided between the light sources and the induction elements. Barrier objects that block light are installed at certain first light guiding channels of the light guiding channels, and are removed from the first light conducting channels when the electronic device is disassembled, so that induction signals output by the photosensitive elements are changed from the model or original digitally-recorded signals.

公开(公告)号：US20160278200A1

公开(公告)日：2016-09-22

申请号：US15074503

申请日：2016-03-18

Applicant: THALES

Inventor： David Costes

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/40 ,  H05K1/18

CPC classification number: H05K1/0206 ,  B33Y80/00 ,  H05K1/0298 ,  H05K1/185 ,  H05K3/1241 ,  H05K3/4038 ,  H05K3/46 ,  H05K3/4664 ,  H05K3/4694 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/08 ,  H05K2201/09736

Abstract: The manufacturing method gives the possibility of manufacturing a printed circuit comprising an electrically insulating substrate and electrically conductive elements borne by the substrate. The manufacturing method comprises the manufacturing of the insulating substrate and of the conductive elements together by additive manufacturing.

Abstract translation: 制造方法给出制造包括电绝缘基板和由基板承载的导电元件的印刷电路的可能性。 制造方法包括通过添加剂制造将绝缘基板和导电元件一起制造。

公开(公告)号：US09226387B2

公开(公告)日：2015-12-29

申请号：US13935713

申请日：2013-07-05

Applicant: CYNTEC CO., LTD

Inventor： Chih-Tse Chen ,  Joseph D. S. Deng ,  Shih-Hsien Tseng

IPC: H02B5/00 ,  H05K7/00 ,  H05K1/02 ,  H05K9/00 ,  H05K1/00 ,  H05K5/00 ,  H01H9/28 ,  H01H27/00 ,  H01H47/00 ,  H01H63/00 ,  H02B7/00 ,  H02B1/26 ,  H02B1/00

CPC classification number: H05K1/0216 ,  H05K1/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K5/00 ,  H05K5/0026 ,  H05K7/00 ,  H05K9/0022 ,  H05K2201/08 ,  H05K2201/1003

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.

Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 以太网变压器和至少一个网络磁性组件的电感器之间的导电迹线的间隔距离或路径长度小于第一特定长度。