公开(公告)号：US08232573B2

公开(公告)日：2012-07-31

申请号：US12721551

申请日：2010-03-10

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L33/00

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader is aluminum and includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace includes a silver coating and a copper core and provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器是铝，包括一个柱子和一个基座。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线包括银涂层和铜芯，并且在焊盘和端子之间提供信号路由。

公开(公告)号：US08220977B2

公开(公告)日：2012-07-17

申请号：US12685571

申请日：2010-01-11

Applicant: Robert Fugerer ,  Carl Smith, III ,  Lisa Marie Fitzgerald

Inventor： Robert Fugerer ,  Carl Smith, III ,  Lisa Marie Fitzgerald

IPC: F21V29/00

CPC classification number: F21V15/01 ,  F21K9/00 ,  F21V7/18 ,  F21V15/015 ,  F21V19/004 ,  F21V23/026 ,  F21V23/0442 ,  F21V29/507 ,  F21V29/74 ,  F21V29/763 ,  F21V29/83 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: A lamp assembly manages thermal energy output from solid state lighting elements. An aspect of the present disclosure provides a lamp assembly that achieves enhanced cooling of light elements within the assembly. Enhanced cooling is achieved, in this aspect, by providing a lamp assembly including a heat sink having a plurality of thermo bosses protruding therefrom on a first side, and a plurality of heat sink fins on a second side. A printed circuit board is secured to the first side of the heat sink, and has a plurality of through holes that correspond to the size and locations of the thermo bosses, such that when the printed circuit board is secured to the heat sink, the thermo bosses extend into the through holes.

Abstract translation: 灯组件管理从固态照明元件输出的热能。 本公开的一个方面提供了一种灯组件，其实现组件内的轻元件的增强的冷却。 在这方面，通过提供一种灯组件，在第一侧具有多个从其上突出的热凸起的散热片和在第二侧上的多个散热片，提供了一种增强的冷却。 印刷电路板被固定到散热器的第一侧，并且具有多个对应于热凸台的尺寸和位置的通孔，使得当印刷电路板固定到散热器时，热电偶 老板伸进通孔。

公开(公告)号：US08167456B2

公开(公告)日：2012-05-01

申请号：US13078601

申请日：2011-04-01

Applicant: Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda

Inventor： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda

IPC: F21V7/22

CPC classification number: H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

Abstract translation: 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US08157418B2

公开(公告)日：2012-04-17

申请号：US12290807

申请日：2008-11-04

Applicant: Robert Kraus

Inventor： Robert Kraus

IPC: F21V29/00

CPC classification number: H05K1/0204 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: The invention relates to an illumination device (1) comprising at least one substrate plate (2), at least two light-emitting diodes (3) (LEDs) arranged on the same side (A) of the substrate plate (2), and at least one electrically conductive cooling device (8) arranged on the opposite side (B) of the substrate plate (2), in particular a metallic heat sink (8), wherein at least two LEDs (3) are thermally operatively connected to the cooling device (8) by means of in each case at least one thermal coupling device (9) formed from an electrically conductive material. According to the invention, the cooling device (8) has at least two regions (8a, 8b, 8c) which are electrically isolated from one another, wherein a first region (8b) is thermally and electrically operatively connected to at least one first LED (3), and a second region (8a, 8c) is thermally and electrically operatively connected to at least one second LED (3).

Abstract translation: 本发明涉及一种包括至少一个基板（2），至少两个布置在基板（2）的同一侧（A）上的发光二极管（3））的照明装置（1），以及 布置在基板（2）的相对侧（B）上的至少一个导电冷却装置（8），特别是金属散热器（8），其中至少两个LED（3）可热操作地连接到 冷却装置（8）通过在每种情况下至少一个由导电材料形成的热耦合装置（9）。 根据本发明，冷却装置（8）具有至少两个彼此电隔离的区域（8a，8b，8c），其中第一区域（8b）热和电操作地连接到至少一个第一LED （3），并且第二区域（8a，8c）热和电操作地连接到至少一个第二LED（3）。

公开(公告)号：US20120081895A1

公开(公告)日：2012-04-05

申请号：US13314919

申请日：2011-12-08

Applicant: Junya MITA ,  Yoshinori MOMOSE ,  Akemi MARUYAMA ,  Shintaro HAMA

Inventor： Junya MITA ,  Yoshinori MOMOSE ,  Akemi MARUYAMA ,  Shintaro HAMA

IPC: F21V21/00 ,  F21V7/00

CPC classification number: G02F1/133603 ,  G02F1/133608 ,  G02F2001/133628 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: An illumination system includes a light source unit including a light source and a circuit substrate electrically connected to the light source. The light source is placed in the circuit substrate such that at least part of the light source overlaps the circuit substrate in the thicknesswise direction of the circuit substrate.

Abstract translation: 照明系统包括光源单元，其包括光源和电连接到光源的电路基板。 光源被放置在电路基板中，使得至少部分光源在电路基板的厚度方向上与电路基板重叠。

公开(公告)号：US20120080137A1

公开(公告)日：2012-04-05

申请号：US12946343

申请日：2010-11-15

Applicant: HUNG-MING LIN

Inventor： HUNG-MING LIN

IPC: H05K3/46 ,  H05K3/10 ,  C25D1/20

CPC classification number: C25D1/20 ,  C25D5/02 ,  H05K3/205 ,  H05K3/42 ,  H05K3/462 ,  H05K2201/09054 ,  H05K2203/0117

Abstract: A manufacturing method of a circuit board. First, an electrode mold having a conductive circuit pattern is made, and then a conductive circuit metal layer is formed by means of electroplating on the electrode mold. The conductive circuit metal layer is transferred and joined with the dielectric layer to constitute a basic circuit board. After the conductive circuit metal layer is transferred to the dielectric layer, the electrode mold can be reused for electroplating, so that the conductive circuit metal layer may be formed again for the next basic circuit board. The manufacturing method provided herein may significantly reduce the manufacturing time and raising the product yields of the circuit board, and has the advantages of lower cost and environmental friendly.

Abstract translation: 电路板的制造方法。 首先，制造具有导电电路图案的电极模具，然后通过电镀在电极模具上形成导电电路金属层。 导电电路金属层被传送并与电介质层接合以构成基本电路板。 在将导电电路金属层转移到电介质层之后，可以将电极模具重新用于电镀，从而可以再次为下一个基本电路板形成导电电路金属层。 本文提供的制造方法可以显着减少制造时间并提高电路板的产品产量，并且具有成本低廉和环境友好的优点。

公开(公告)号：US08076182B2

公开(公告)日：2011-12-13

申请号：US12714495

申请日：2010-02-28

Applicant: Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L21/00

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the adhesive above the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将基底安装在粘合剂上，包括使柱与基底中的孔对准， 然后将粘合剂在位于柱和基底之间的孔中的间隙中向上流动，固化粘合剂，然后蚀刻柱以在柱上方的粘合剂中形成空腔，然后将半导体器件安装在柱上，其中 散热器包括柱和基座，并且半导体器件延伸到空腔中，将半导体器件电连接到衬底并将半导体器件热连接到散热器。

公开(公告)号：US20110284914A1

公开(公告)日：2011-11-24

申请号：US13131257

申请日：2008-11-25

Applicant: Motohiro Suzuki ,  Naomi Yonemura ,  Yoshihiko Okajima ,  Tetsuro Maeda ,  Eiji Yoshimura

Inventor： Motohiro Suzuki ,  Naomi Yonemura ,  Yoshihiko Okajima ,  Tetsuro Maeda ,  Eiji Yoshimura

IPC: H01L33/64 ,  B32B37/02 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0206 ,  H05K1/0373 ,  H05K1/056 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09054 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2203/1545 ,  H01L2924/00014

Abstract: A substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, comprising:an insulating layer which is composed of a resin containing heat conductive fillers under the mounting position of said light emitting element and has a heat conductivity of 1.0 W/mK or more; and a metal layer disposed inside said insulating layer and having the thick metal section, wherein a heat conductive mask section is disposed at the top of said thick metal section.

Abstract translation: 一种用于发光元件封装的衬底，其具有形成在发光元件的安装位置的厚金属部分，包括：绝缘层，其由在所述发光元件的安装位置处的包含导热填料的树脂构成;以及 热导率为1.0W / mK以上; 以及金属层，其设置在所述绝缘层的内部并且具有厚的金属部分，其中导热掩模部分设置在所述厚金属部分的顶部。

公开(公告)号：US20110275180A1

公开(公告)日：2011-11-10

申请号：US13113051

申请日：2011-05-22

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

IPC: H01L21/60

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making a semiconductor chip assembly includes providing a post, a base, a support layer and an underlayer, wherein the post extends above the base and the support layer is sandwiched between the base and the underlayer, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a heat spreader that includes the post, the base, the underlayer and a thermal via that extends from the base through the support layer to the underlayer, then mounting a semiconductor device on the post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供柱，基底，支撑层和底层，其中柱延伸到基底之上，并且支撑层夹在基底和底层之间，将粘合剂安装在基底上，包括 将所述柱插入所述粘合剂的开口中，将导电层安装在所述粘合剂上，包括使所述柱与所述导电层中的孔对准，然后使所述粘合剂在所述柱和所述导电层之间向上流动，使所述粘合剂固化， 轨迹，其包括衬垫，端子和导电层的选定部分，提供包括柱，基底，底层的散热器和从基底穿过支撑层延伸到底层的热通孔，然后安装 在该柱上的半导体器件，将半导体器件电连接到导电迹线并将半导体器件热连接到第二半导体器件 e散热器。

公开(公告)号：US20110272179A1

公开(公告)日：2011-11-10

申请号：US13095799

申请日：2011-04-27

Applicant: Kalu K. Vasoya

Inventor： Kalu K. Vasoya

IPC: H05K7/20 ,  H05K3/02

CPC classification number: H05K1/0204 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K2201/09054 ,  H05K2201/10106 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: A printed circuit board includes a dielectric layer having a first surface and an opposing second surface and a circuit layer laminated to the first surface of the dielectric layer. Cut-out windows provide openings through the dielectric and circuit layers. A thermally conductive layer is laminated to the second surface of the dielectric layer. The thermally conductive layer includes at least one sinkpad that passes through the cut-out windows. The sinkpad is an embossed, hollow feature of the thermally conductive layer. A surface of the sinkpad may be substantially coplanar with a surface of the circuit layer and be prepared for compatibility with a solder reflow process. A heat generating electronic component may be electrically coupled to the circuit layer and thermally coupled to the sinkpad of the thermally conductive layer to form an electronic assembly.

Abstract translation: 印刷电路板包括具有第一表面和相对的第二表面的电介质层，以及层压到电介质层的第一表面的电路层。 切口窗口通过介电层和电路层提供开口。 将导热层层叠到电介质层的第二表面。 导热层包括穿过切口窗的至少一个沉没垫。 散热片是导热层的浮雕，中空特征。 散热片的表面可以与电路层的表面基本共面，并且准备与焊料回流工艺的兼容性。 发热电子部件可以电耦合到电路层，并且热耦合到导热层的吸收板，以形成电子组件。