公开(公告)号：US20020076095A1

公开(公告)日：2002-06-20

申请号：US09897760

申请日：2001-06-29

Inventor： Sim Ching Tong ,  Rory S. Limqueco

IPC: G06K009/00

CPC classification number: H05K1/0269 ,  G01R31/2813 ,  G01R31/309 ,  G06T7/73 ,  G06T2207/30141 ,  H05K3/306 ,  H05K2201/09927 ,  H05K2203/161 ,  H05K2203/168

Abstract: An optical inspection system and a method of inspecting a printed circuit board identify a color for a package of a component and identify dark areas and light areas on the package. The identified color is then used to determine which of the dark areas or light areas represent markings. From the identified markings, the orientation of the component is determined.

Abstract translation: 光学检查系统和检查印刷电路板的方法识别组件的包装的颜色并识别包装上的暗区域和光区域。 然后使用所识别的颜色来确定哪个暗区或亮区代表标记。 从识别的标记中，确定组件的方向。

公开(公告)号：US06268616B1

公开(公告)日：2001-07-31

申请号：US08639323

申请日：1996-04-25

Applicant: Eiichiro Kamekawa

Inventor： Eiichiro Kamekawa

IPC: H01L2358

CPC classification number: H05K1/0266 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2924/0002 ,  H05K1/0268 ,  H05K1/11 ,  H05K3/3457 ,  H05K2201/09781 ,  H05K2201/09927 ,  H01L2924/00

Abstract: An electrical wiring boards 10 having the same specifications are provided with a plurality of lands for identification 12a to 12e and identification of the type of the final product is carried out by applying solder onto one land for identification 12b corresponding to the final product.

Abstract translation: 具有相同规格的电气布线板10设置有多个用于识别的焊盘12a至12e，并且通过将焊料施加到与最终产品相对应的识别12b的一个焊盘上来进行最终产品的类型的识别。

公开(公告)号：US6120883A

公开(公告)日：2000-09-19

申请号：US914826

申请日：1997-08-19

Applicant: Gary Jay Litman ,  Nancy Orlando

Inventor： Gary Jay Litman ,  Nancy Orlando

IPC: C09D7/12 ,  H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  B32B3/00

CPC classification number: H05K3/0076 ,  C09D7/1216 ,  C08K3/0033 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  H05K1/0266 ,  H05K2201/0209 ,  H05K2201/09927 ,  H05K2203/0191 ,  H05K3/3452 ,  Y10T428/24901 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/265

Abstract: A printable coating is disclosed, which is opaque as well as mar and scratch resistant. The coating contains a resin as a binder and, as a filler, titanium dioxide and boron nitride. The resultant coated film product can be used in various chemically and thermally demanding applications such as printed circuit board bar-code labels, wave solder masking tapes, automotive labels, and electrical insulation.

Abstract translation: 公开了一种可印刷的涂层，其是不透明的以及耐刮擦的。 该涂层含有作为粘合剂的树脂，作为填料，包含二氧化钛和氮化硼。 所得到的涂膜产品可用于各种化学和热要求苛刻的应用，例如印刷电路板条形码标签，波峰焊胶带，汽车标签和电绝缘。

公开(公告)号：US09360589B1

公开(公告)日：2016-06-07

申请号：US14537830

申请日：2014-11-10

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： Mitchell W. Meinhold ,  Jonathan W. Ward ,  Michael J. O'Connor

IPC: G01N21/64 ,  G01V15/00 ,  G06K19/077 ,  G06K19/00 ,  G06K19/14 ,  B82Y15/00 ,  B82Y30/00

CPC classification number: G01V15/00 ,  B82Y15/00 ,  B82Y30/00 ,  G01N21/643 ,  G01N21/65 ,  G01N2021/6417 ,  G01N2021/6439 ,  G06K19/00 ,  G06K19/077 ,  G06K19/14 ,  H01B1/24 ,  H05K1/0266 ,  H05K1/0275 ,  H05K2201/026 ,  H05K2201/09927 ,  Y10S977/932 ,  Y10T428/24851 ,  Y10T428/24893

Abstract: Identifying marks are often used for authentication and tracking purposes with various types of articles, but the marks themselves can sometimes be subject to replication or removal by an outside entity, such as a person or group having malicious intent. This can make it easier for an outside entity to produce a counterfeit article or to sell a stolen article. Carbon nanotubes and other carbon nanomaterials can be used to form identifying marks that are not visible to the naked eye, thereby making the marks more difficult for an outside entity to tamper with. Various articles can include an identifying mark that is localized and not visible to the naked eye, the identifying mark being electrically conductive and containing a carbon nanomaterial. By electrically interrogating the article, such as through spatially measuring eddy currents about the article, the marks can be located and authenticated.

Abstract translation: 识别标记通常用于与各种类型的文章的认证和跟踪目的，但是标记本身有时可能被外部实体（例如具有恶意意图的人或组）的复制或删除。 这可以使外部实体更容易生产伪造物品或出售被盗物品。 碳纳米管和其他碳纳米材料可以用于形成肉眼不可见的识别标记，从而使得外部实体篡改的标记更加困难。 各种制品可以包括局部的并且肉眼不可见的识别标记，识别标记是导电的并且包含碳纳米材料。 通过电子询问物品，例如通过空间测量关于物品的涡流，可以定位和认证标记。

公开(公告)号：US09180539B1

公开(公告)日：2015-11-10

申请号：US14218557

申请日：2014-03-18

Applicant: Flextronics AP, LLC

Inventor： Dason Cheung ,  Murad Kurwa

IPC: B23K31/02 ,  B23K1/018 ,  B23K1/20

CPC classification number: B23K1/0016 ,  B23K1/20 ,  H05K1/0269 ,  H05K1/0271 ,  H05K3/225 ,  H05K3/3484 ,  H05K2201/09927 ,  H05K2201/10371 ,  H05K2203/0126 ,  H05K2203/0445 ,  H05K2203/082 ,  H05K2203/085 ,  H05K2203/105 ,  H05K2203/111 ,  H05K2203/163

Abstract: A radio-frequency (RF) shield pad is “dressed” by automatically removing melted solder from the shield pad by traversing a pattern of the shield pad. After an RF shield has been removed from a shield pad of a printed circuit board (PCB), the PCB is pre-heated to a temperature sufficient to heat solder on the shield pad and to prevent thermally stressing the PCB during the dressing process. The solder is melted, such as by a heated tip of a desoldering tool, and the melted solder is vacuumed while the tip automatically traverses the pattern of the shield pad, until all or a threshold amount of the melted solder has been removed from the shield pad. After the PCB has been reworked, solder paste is automatically disposed on the RF-shield pad, the RF shield is temporarily mounted on the RF-shield pad, and the PCB is processed in a reflow oven, thereby securely attaching the RF shield to the PCB.

Abstract translation: 通过穿过屏蔽垫的图案，通过从屏蔽垫自动去除熔化的焊料，射频（RF）屏蔽垫被“穿透”。 在已经从印刷电路板（PCB）的屏蔽焊盘上移除RF屏蔽之后，PCB被预热到足以在屏蔽焊盘上加热焊接的温度，并防止在修整过程中对PCB进行热应力。 焊料熔化，例如通过脱焊工具的加热尖端，并且熔化的焊料被抽真空，同时尖端自动穿过屏蔽垫的图案，直到从屏蔽层去除了所有或阈值量的熔化焊料 垫。 在PCB被重新加工之后，焊膏自动地被放置在RF屏蔽垫上，RF屏蔽件临时安装在RF屏蔽垫上，并且PCB在回流炉中被处理，从而将RF屏蔽件牢固地附接到 PCB。

公开(公告)号：US20110239457A1

公开(公告)日：2011-10-06

申请号：US13155463

申请日：2011-06-08

Applicant: Hiroshi NISHIKAWA ,  Taro HIRAI

Inventor： Hiroshi NISHIKAWA ,  Taro HIRAI

IPC: H05K3/00 ,  G06K19/077

CPC classification number: H05K1/0266 ,  H05K2201/09927 ,  Y10T29/49108 ,  Y10T29/49115 ,  Y10T29/49121 ,  Y10T29/49155

Abstract: Circuit modules including identification codes and a method of managing them are provided. A module substrate includes signal input output terminals and outer ground terminals provided at the peripheral portions of a surface which becomes a mounting surface when the circuit module is completed. An inner-ground-terminal formation area surrounded by the signal input output terminals and the outer ground terminals includes a plurality of inner ground terminals arranged in a matrix of rows and columns. One of the edge portions is a direction identification area. The inner ground terminal is not provided in the direction identification area, and a first identification code having information about the position of the module substrate is provided in the direction identification area.

Abstract translation: 提供了包括识别码的电路模块及其管理方法。 模块基板包括设置在电路模块完成时成为安装表面的表面的周边部分处的信号输入端子和外部接地端子。 由信号输入端子和外部接地端子包围的内部 - 地面端子形成区域包括以行和列为矩阵排列的多个内部接地端子。 边缘部分之一是方向识别区域。 内部接地端子不设置在方向识别区域，并且具有关于模块基板的位置的信息的第一识别码被提供在方向识别区域。

公开(公告)号：US07877875B2

公开(公告)日：2011-02-01

申请号：US12193735

申请日：2008-08-19

Applicant: Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

Inventor： Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

IPC: B23P17/00 ,  B21D53/76 ,  H01L41/00 ,  H04R17/00 ,  H05B3/00

CPC classification number: H05K3/361 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14362 ,  B41J2002/14491 ,  B41J2202/19 ,  H01R12/62 ,  H05K1/0266 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2201/09927 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49401

Abstract: A method for connecting a flexible printed circuit board (PCB) to a printhead assembly that includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the steps of: adhering the PCB to a first surface of the printhead; receiving the printhead and PCB in a mechanical nest, and actuating the nest into a position below a heated platen assembly; heating the heated platen assembly and actuating the heated platen assembly rectilinearly towards the nest, the heated platen assembly thereby compressing the PCB and the printhead; actuating a forming bar assembly, provided adjacent the heated platen assembly, rectilinearly towards the nest, the forming bar assembly thereby bending a portion of the PCB extending beyond the printhead towards the printhead assembly; and heating a heater cartridge and actuating the heater cartridge rectilinearly towards the print head printhead in a direction substantially perpendicular to the direction in which the forming bar assembly is actuated, whereby the PCB is connected to the printhead and bonded to the printhead carrier.

Abstract translation: 一种用于将柔性印刷电路板（PCB）连接到打印头组件的方法，该打印头组件包括打印头托架和由托架承载的喷墨打印头。 该方法包括以下步骤：将PCB粘附到打印头的第一表面; 将所述打印头和PCB接收在机械嵌套中，并且将所述嵌套驱动到加热的压板组件下方的位置; 加热加热的压板组件并使加热的压板组件直线地朝向嵌套，加热的压板组件由此压缩PCB和打印头; 致动成形条组件，其邻近加热的压板组件直线地朝向嵌套，成形条组件从而将PCB的部分延伸超过打印头朝向打印头组件; 并且加热加热器盒并且在基本上垂直于成形条组件被致动的方向的方向上朝向打印头打印头直线地致动加热器盒，由此PCB连接到打印头并结合到打印头托架。

公开(公告)号：US20100043220A1

公开(公告)日：2010-02-25

申请号：US12193735

申请日：2008-08-19

Applicant: Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

Inventor： Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

IPC: H01R43/00

CPC classification number: H05K3/361 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14362 ,  B41J2002/14491 ,  B41J2202/19 ,  H01R12/62 ,  H05K1/0266 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2201/09927 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49401

Abstract: The present invention relates to a method for connecting a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the step of connecting the flexible PCB to the printhead using a first heater assembly movable along a first path. In turn, the connected PCB is then bent. The method further includes the step of connecting the bent PCB to the printhead carrier using a second heater assembly movable along a second path.

Abstract translation: 本发明涉及一种将柔性印刷电路板（PCB）连接到打印头组件的方法。 打印头组件包括打印头托架和由托架承载的喷墨打印头。 该方法包括使用可沿着第一路径移动的第一加热器组件将柔性PCB连接到打印头的步骤。 然后，连接的PCB然后弯曲。 该方法还包括使用可沿着第二路径移动的第二加热器组件将弯曲PCB连接到打印头托架的步骤。

公开(公告)号：US20090226605A1

公开(公告)日：2009-09-10

申请号：US12045461

申请日：2008-03-10

Applicant: Naveen CHOPRA ,  Peter M. KAZMAIER ,  Dominique J. LALISSE ,  Paul F. SMITH

Inventor： Naveen CHOPRA ,  Peter M. KAZMAIER ,  Dominique J. LALISSE ,  Paul F. SMITH

IPC: B05D5/12 ,  B05D3/02

CPC classification number: H05K1/097 ,  C09D11/322 ,  C09D11/52 ,  H05K1/0266 ,  H05K3/125 ,  H05K2201/09927 ,  H05K2203/013

Abstract: A process for printing conductive metal markings directly on a substrate under an ambient condition, including the steps of synthesizing or providing conductive the ink on a substrate to form conductive metallic nanoparticles into an ink; and printing the ink on a substrate to form conductive metallic markings on the substrate. The printed conductive metallic markings may form wires that behave as resonant RFID antenna applications.

Abstract translation: 一种在环境条件下直接在衬底上印刷导电金属标记的方法，包括以下步骤：在衬底上合成或提供导电油墨以形成导电金属纳米颗粒成油墨; 并将油墨印刷在基板上以在基板上形成导电金属标记。 印刷的导电金属标记可以形成作为谐振RFID天线应用的导线。

公开(公告)号：US07365272B2

公开(公告)日：2008-04-29

申请号：US10921832

申请日：2004-08-20

Applicant: Shih-Ping Hsu ,  Shang-Wei Chen ,  Suo-Hsia Tang ,  Chao-Wen Shih

Inventor： Shih-Ping Hsu ,  Shang-Wei Chen ,  Suo-Hsia Tang ,  Chao-Wen Shih

IPC: H05K1/00

CPC classification number: H05K1/0266 ,  H05K1/0269 ,  H05K3/107 ,  H05K3/4644 ,  H05K2201/09781 ,  H05K2201/09927 ,  H05K2201/09936

Abstract: A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.